• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.83-88
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• 2018

The electromigration (EM) tests were performed at $150^{\circ}C$ with $1.5{\times}10^5A/cm^2$ conditions in order to investigate the effect of non-conductive film (NCF) trap on the electrical reliability of Cu/Ni/Sn-Ag microbumps. The EM failure time of Cu/Ni/Sn-Ag microbump with NCF trap was around 8 times shorter than Cu/Ni/Sn-Ag microbump without NCF trap. From systematic analysis on the electrical resistance and failed interfaces, the trapped NCF-induced voids at the Sn-Ag/Ni-Sn intermetallic compound interface lead to faster EM void growth and earlier open failure.

• Corrosion Science and Technology
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• v.22 no.3
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• pp.187-192
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• 2023

The use of biomass is increasing as a response to the convention on climate change. In Korea, a method applied to replace fossil fuels is using wood chips in a cogeneration plant. To remove air pollutants generated by burning wood chips, a selective denitrification facility (Selective catalytic reduction, SCR) is installed downstream. However, problems such as ash deposition and descaling of the equipment surface have been reported. The cause is thought to be unreacted ammonia slip caused by ammonia ions injected into the reducing agent and metal corrosion caused by an acidic environment. Element analysis confirmed that ash contained alkali metals and sulfur that could cause catalyst poisoning, leading to an increase in the size of ash particle and deposition. Measurement of the size of ash deposited inside the facility confirmed that the size of ash deposited on the catalyst was approximately three times larger than the size of generally formed ash. Therefore, it was concluded that a reduction in pore area of the catalyst by ash deposition on the surface of the catalyst could lead to a problem of increasing differential pressure in a denitrification facility.

• KSBB Journal
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• v.20 no.3
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• pp.220-227
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• 2005

Doxorubicin is an anthracycline-family polyketide compound with a very potent anti-cancer activity, typically produced by Streptomyces peucetius. To understand the potential target biosynthetic genes critical for the doxorubicin everproduction, a doxorubicin-specific DNA microarray chip was fabricated and applied to reveal the growth-phase-dependent expression profiles of biosynthetic genes from two doxorubicin-overproducing strains along with the wild-type strain. Two doxorubicin-overproducing 5. peucetius strains were generated via over-expression of a dnrl (a doxorubicin-specific positive regulatory gene) and a doxA (a gene involved in the conversion from daunorubicin to doxorubicin) using a streptomycetes high expression vector containing a strong ermE promoter. Each doxorubicin-overproducing strain was quantitatively compared with the wild-type doxorubicin producer based on the growth-phase-dependent doxorubicin productivity as well as doxorubicin biosynthetic gene expression profiles. The doxorubicin-specific DNA microarray chip data revealed the early-and-steady expressions of the doxorubicin-specific regulatory gene (dnrl), the doxorubicin resistance genes (drrA, drrB, drrC), and the doxorubicin deoxysugar biosynthetic gene (dnmL) are critical for the doxorubicin overproduction in S. peucetius. These results provide that the relationship between the growth-phase-dependent doxorubicin productivity and the doxorubicin biosynthetic gene expression profiles should lead us a rational design of molecular genetic strain improvement strategy.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.49 no.6
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• pp.1-8
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• 2012

This paper presents a fully-integrated buck converter equipped with packaging inductors. These inductors include parasitic inductances of the bonding wires and lead frames in the package. They have significantly better Q factors than the best on-chip inductors implemented on silicon. This paper also proposes a low-swing gate driver for efficient regulation of high-frequency switching converters. The low-swing driver uses the voltage drop of a diode-connect transistor. The proposed converter is designed and fabricated using a $0.13-{\mu}m$ CMOS process. The fully-integrated buck converter achieves 68.7% and 86.6% efficiency for 3.3 V/2.0 V and 2.8 V/2.3 V conversions, respectively.

• Korean Journal of Materials Research
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• v.17 no.3
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• pp.152-159
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• 2007

When the electronics are tested with thermal shock for Pb-free solder joint reliability, there are temperature conditions with use environment but number of cycles for test don't clearly exist. To obtain the long term reliability data, electronic companies have spent the cost and times. Therefore this studies show the test method and number of thermal shock cycles for evaluating the solder joint reliability of electronic components and also research bonding strength variation with formation and growth of intermetallic compounds (IMC). SMD (surface mount device) 3216 chip resistor and 44 pin QFP (quad flat package) was utilized for experiments and each components were soldered with Sn-40Pb and Sn-3.0 Ag-0.5 Cu solder on the FR-4 PCB(printed circuit board) using by reflow soldering process. To reliability evaluation, thermal shock test was conducted between $-40^{\circ}C\;and\;+125^{\circ}C$ for 2,000 cycles, 10 minute dwell time, respectively. Also we analyzed the IMCs of solder joint using by SEM and EDX. To compare with bonding strength, resistor and QFP were tested shear strength and $45^{\circ}$ lead pull strength, respectively. From these results, optimized number of cycles was proposed with variation of bonding strength under thermal shock.

• Journal of Animal Environmental Science
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• v.19 no.2
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• pp.177-182
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• 2013

We studied the possibility to produce solid fuel using cattle manure and to apply TAO (Thermophilic Aerobic Oxidation) process of solid-liquid separation fraction. The physiochemical compositions of cattle manure solid fuel chip were analyzed as water 0.12%, low calorific value 3,510 kcal/kg, ashes 11.9%, chlorine 0.82%, sulfur dust 0.5%, mercury non-detection, cadmium 1.0 mg/kg, lead 2 mg/kg, arsenic non-detection. In treating cattle manure with TAO reactor the internal temperature of the reactor was increasing higher and $50^{\circ}C$ and over was maintained after 20 hours on. The physiochemical compositions of liquids increased from pH 7.3 to pH 9.18 and EC decreased from 4.6 to 3.48 mS/cm in treating process of cattle manure with TAO reactor. COD and SCOD decreased from 16,800 to 10,400 mg/L, from 4,600 to 2,040 mg/L respectively, which showed about 38% and 56% of remove efficiency respectively.

• Journal of Appropriate Technology
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• v.5 no.1
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• pp.46-53
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• 2019

It should be supported by the ease and economic production in terms of appropriate technology to be widely used in the real applying fields. In particular, the diagnosis of diseases is one of the most difficult areas to apply to the developing countries compared to other fields because of the high costs of professional manpower, equipment, and medial reagents. In recent years, paper, which is one of the most common materials around, has been used to fabricate the disease diagnostic chips, particularly without any special facilities or the equipment. These new technologies lead the possibility of using point-of-care testing devices that can be manufactured quickly in the field by lowering the production cost. These paperbased technologies will contribute to solve many of the deadliest medical problems in developing countries and ultimately improve the quality of human life.

• Journal of Animal Science and Technology
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• v.52 no.5
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• pp.357-366
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• 2010

The emergence of next-generation sequencing technologies has lead to application of new computational and statistical methodologies that allow incorporating genetic information from entire genomes of many individuals composing the population. For example, using single-nucleotide polymorphisms (SNP) obtained from whole genome amplification platforms such as the Ilummina BovineSNP50 chip, many researchers are actively engaged in the genetic evaluation of cattle livestock using whole genome relationship analyses. In this study, we estimated the genomic relationship matrix (GRM) and compared it with one computed using a pedigree relationship matrix (PRM) using a population of Hanwoo. This project is a preliminary study that will eventually include future work on genomic selection and prediction. Data used in this study were obtained from 187 blood samples consisting of the progeny of 20 young bulls collected after parentage testing from the Hanwoo improvement center, National Agriculture Cooperative Federation as well as 103 blood samples from the progeny of 12 proven bulls collected from farms around the Kyong-buk area in South Korea. The data set was divided into two cases for analysis. In the first case missing genotypes were included. In the second case missing genotypes were excluded. The effect of missing genotypes on the accuracy of genomic relationship estimation was investigated. Estimation of relationships using genomic information was also carried out chromosome by chromosome for whole genomic SNP markers based on the regression method using allele frequencies across loci. The average correlation coefficient and standard deviation between relationships using pedigree information and chromosomal genomic information using data which was verified using a parentage test andeliminated missing genotypes was $0.81{\pm}0.04$ and their correlation coefficient when using whole genomic information was 0.98, which was higher. Variation in relationships between non-inbred half sibs was $0.22{\pm}0.17$ on chromosomal and $0.22{\pm}0.04$ on whole genomic SNP markers. The variations were larger and unusual values were observed when non-parentage test data were included. So, relationship matrix by genomic information can be useful for genetic evaluation of animal breeding.

• Journal of the Korea Organic Resources Recycling Association
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• v.8 no.3
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• pp.81-88
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• 2000

Composting of N-rich wastes such as food waste and wastewater sludges can be associated loss of with substantial gaseous N, which means loss of an essential plant nutrient but may also lead to environmental pollution. We investigated the behavior of nitrogenous materials during the first high-rate phase in composting of food waste. Air dried food waste was mixed with shredded waste paper or wood chip and reacted in a bench scale composting reactor. Samples were analyzed for pH, ammonia, oxidized nitrogen and organic nitrogen. The volatilized ammonia nitrogen was also analyzed using sulfuric acid as an absorbent solution. Initial progress of composting reaction greatly influenced the ammonification of organic nitrogen. A well-balanced composting reaction with an addition of active compost as an inoculum resulted in the promoted mineralization of organic nitrogen and volatilization of ammonia. The prolongation of initial low pH period delayed the production of ammonia. It was also found that nitrogen loss was highly dependent on the air flow supplied. With an increase in input air flow, the loss of nitrogen as an ammonia also increased, resulted in substantial reduction of ammonia content in compost. The conversion ratio of initial nitrogen into ammonia was in the range of 28 to 38% and about 77~94% of the ammonia produced was escaped as a gas. Material balance on the nitrogenous materials was demonstrated to provide an information of importance on the behavior of nitrogen in composting reaction.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.4
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• pp.23-29
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• 2000

We demonstrate the fabrication method of high-density and high-quality solder bump solving a copper (Cu) cross-contamination in Si-LSI laboratory. The Cu cross-contamination is solved by separating solder-bump process by two steps. Former is via-formation process excluding Cu/Ti under ball metallurgy (UBM) layer sputtering in Si-LSI laboratory. Latter is electroplating process including Ti-adhesion and Cu-seed layers sputtering out of Si-LSI laboratory. Thick photoresist (PR) is achieved by a multiple coating method. After TiW/Al-electrode sputtering for electroplating and via formation in Si-LSI laboratory, Cu/Ti UBM layer is sputtered on sample. The Cu-seed layer on the PR is etched during Cu-electroplating with low-electroplating rate due to a difference in resistance of UBM layer between via bottom and PR. Therefore Cu-buffer layer can be electroplated selectively at the via bottom. After etching the Ti-adhesion layer on the PR, Sn/Pb solder layer with a composition of 60/40 is electroplated using a tin-lead electroplating bath with a metal stoichiometry of 60/40 (weight percent ratio). Scanning electron microscope image shows that the fabricated solder bump is high-uniformity and high-quality as well as symmetric mushroom shape. The solder bumps with even 40/60 $\mu\textrm{m}$ in diameter/pitch do not touch during electroplating and reflow procedures. The solder-bump process of high-uniformity and high-density with the Cu cross-contamination free in Si-LSI laboratory will be effective for electronic microwave application.