Browse > Article

A Fully-Integrated DC-DC Buck Converter Using A New Gate Driver  

Ahn, Young-Kook (Department of Electronics & Communication Engineering)
Jeon, In-Ho (Department of Electronics & Communication Engineering)
Roh, Jeong-Jin (Department of Electronics & Communication Engineering)
Publication Information
Journal of the Institute of Electronics Engineers of Korea SD / v.49, no.6, 2012 , pp. 1-8 More about this Journal
Abstract
This paper presents a fully-integrated buck converter equipped with packaging inductors. These inductors include parasitic inductances of the bonding wires and lead frames in the package. They have significantly better Q factors than the best on-chip inductors implemented on silicon. This paper also proposes a low-swing gate driver for efficient regulation of high-frequency switching converters. The low-swing driver uses the voltage drop of a diode-connect transistor. The proposed converter is designed and fabricated using a $0.13-{\mu}m$ CMOS process. The fully-integrated buck converter achieves 68.7% and 86.6% efficiency for 3.3 V/2.0 V and 2.8 V/2.3 V conversions, respectively.
Keywords
Fully-integrated DC-DC converter; packaging inductor; gate driver; diode-connected; low-voltage swing;
Citations & Related Records
연도 인용수 순위
  • Reference
1 이민우, 김형중, 노정진, "SoC 전원관리를 위한 인덕터와 커패시터 내장형 100MHz DC-DC 부스트 변환기", 대한전자공학회 논문지, 제 46권, 8호, 31-40쪽, 2009년.
2 김영재, 남현석, 안영국, 노정진, "Stacked Interleaved 방식의 50MHz 스위칭 주파수의 벅 변환기", 전자공학회 논문지, 제 46권, SD편, 6호, 466-473쪽, 2009년 6월.
3 M. Ludwig, M. Duffy, T. O'Donnell, P. McCloskey and S. C. O. Mathuna "PCB integrated inductors for low power DC - DC converter", IEEE Trans. Power Electron., vol. 18, pp. 937-945, July 2003.   DOI   ScienceOn
4 E. McShane and K. Shenai, "A CMOS monolithic 5MHz, 5 V, 250 mA, 56% efficiency switch-mode boost converter with dynamic PWM for embedded power management," in Proc. Conf. Record Industry Applications Society Annu. Conf., 2001, pp. 653-657.
5 A. Abedinpour, A. Trivedi, and K. Shenai, "DC-DC power converter for monolithic implementation," in Proc. Conf. IEEE Industry Applications Soc Annu. Meeting, 2000, pp. 2471-2475.
6 J. Zou, J. Chen, C. Liu, and J. Schutt-Aine, "Plastic Deformation Magnetic Assembly(PDMA) of out-of-plane microstructures: technology and application," J. Microelectromech. Syst., vol. 10, no. 2, pp. 302-309, Jun. 2001.   DOI   ScienceOn
7 P. Hazucha, G. Schrom, J. Hahn, B. A. Bloechel, P. Hack, G. E. Dermer, S. Narendra, D. Gardner, T. Karnik, V. De, and S. Borkar, "A 233 MHz 80%-87% efficient four-phase DC-DC converter utilizing air-core inductors on package," IEEE J. Solid-State Circuits, vol. 40, no. 4, pp. 838-845, Apr. 2005.   DOI
8 J. Wibben and R. Harjani, "A High-efficiency DC-DC Converter Using 2nH Integrated Inductors," IEEE J. Solid-State Circuits, vol. 43, no. 4, pp. 844-854, Apr. 2008.   DOI
9 S. Abedinpour, B. Bakkaloglu, and S. Kiaei, "A multi-stage interleaved synchronous buck converter with integrated output filter in 0.18 um SiGe process," IEEE Trans. Power Electron., vol. 22, pp. 2164-2175, Nov. 2007.   DOI
10 J. Sun, D. Giuliano, S. Devarajan, J. Lu, T. P. Chow, and R. J. Gutmann, "Fully monolithic cellular buck converter design for 3-D power delivery," IEEE Trans. Very large Scale Integr. (VLSI) Syst., vol. 17, no. 3, Mar. 2009.
11 M. Alimadadi, S. Sheikhaei, G. Lemieux, S. Mirabbasi, W. G. Dunford, and P. R. Palmer, "A fully integrated 660MHz low-swing energy-recycling dc-dc converter," IEEE Trans. Power Electron., vol. 24, pp. 1475-1485, June 2009.
12 H. Khatri, P. S. Cudem, and L. E. Larson, "Integrated RF interference suppression filter design using bond-wire inductors," IEEE Trans. Microw. Theory Tech., vol. 56, no. 5 pp. 1024-1034, May 2008.   DOI
13 Bond Wire Modeling Standard, EIA/JEDEC Standard EIA/JESD59, Jun. 1997.
14 Wens, M. Steyaert, "A fully-integrated 0.18um CMOS DC-DC step-down converter, using a bondwire spiral inductor," IEEE Custom Integr. Circuits Conf. (CICC), 2008, pp. 17-20.
15 P. J. Sullivan, B. A. Xavier, and W. H. Ku, "An integrated CMOS distributed amplifier utilizing packaging inductance", IEEE Trans. Microwave Theory Tech., vol. 45, pp. 1969 - 1975, Oct. 1997.   DOI   ScienceOn
16 P. E. Allen and D. R. Holberg, CMOS Analog Circuit Design, New York: Holt Rinehart and Winston, 1987.
17 MQFP data sheet. [Online]. Available: http://www.amkor.com
18 C.-T. Tsai, "Package inductance characterization at high frequencies", IEEE Trans. Comp., Packag., Manufact. Technol. B, vol. 17, no. 2, pp. 175 - 181, May 1994.   DOI   ScienceOn
19 N. C. Li, G. L. Haviland, and A. A. Tuszynski, "CMOS tapered buffer", IEEE J. Solid-State Circuits, vol. 25, pp.1005 - 1008 , 1990.   DOI   ScienceOn
20 M. D. Mulligan, B. Broach, and T. H. Lee, "A constant-frequency method for improving light-load efficiency in synchronous buck converters," IEEE Trans. Power Electron. Lett., vol. 3, no. 1, pp. 24-29, Mar. 2005.   DOI   ScienceOn