• Journal of Welding and Joining
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• 제21권7호
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• pp.59-64
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• 2003

Microstructure and shear strength of Sn-Zn lead-free solders and Au/Ni/Cu UBM joint under thermal aging conditions was investigated. The samples were aged isothermally at 10$0^{\circ}C$ and 15$0^{\circ}C$ for 300, 600, and 900 hours. The IMCs(Intermetallic Compound) at the interface between solder and UBM were examined by FESEM and TEM. The results showed that the shear strength was decreased with aging time and temperature. The solder ball with high activated RA flux had about 8.2% higher shear strength than that of RMA flux. Poor wetting and many voids were observed in the fractured solder joint with of RMA flux. The decreased shear strengths were caused by IMC growth and Zn grain coarsening. Zn reacted with Au and then was transformed to the $\beta$ -AuZn compound. Although AuZn grew first, $r-Ni_5Zn_{21}$ compounds were formed with aging time. The layers indicated by $Ni_5Zn_{21}(1)$, (2), and (3) were formed with the thickness of ∼0.7 ${\mu}{\textrm}{m}$, ∼4 ${\mu}{\textrm}{m}$, and ∼2 ${\mu}{\textrm}{m}$, respectively.

• 한국신뢰성학회지:신뢰성응용연구
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• 제13권2호
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• pp.109-116
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• 2013

The solder is any of various fusible alloys, usually tin and lead, used to join metallic parts that provide the contact between the chip package and the printed circuit board. Solder plays an important role of electrical signals to communicate between the two components. In this study, two kinds of Ag-free solder as sample is made to conduct the thermal shock test and the high humidity temperature test. Low resistance is measured to estimate crack size of solder, using daisy chain. The low speed shear test is also performed to analyze strength of solder. The appropriate degradation model is estimated using the result data. Depending on the composition of solder, lifetime estimation is conducted by adopted degradation model. The lifetime estimated two kinds of Ag-free solder is compared with expected lifetime of Sn-Ag-Cu solder. The result is that both Ag-free composition are more reliable than Sn-Ag-Cu solder.

• Journal of Welding and Joining
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• 제35권3호
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• pp.21-27
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• 2017

A soldering temperature of ($235{\pm}3$) $^{\circ}C$ is described in ISO 9455-15 for the copper corrosion test. However, this temperature is not suitable for performing lead-free solder pastes. We evaluated the compatibility of a lead-free solder paste in the experimental conditions of (Liquidus temperature + ($35{\pm}3$)) $^{\circ}C$. Based on the results after a Cu corrosion test, a proper temperature for Pb-free soldering was (melting point+($35{\pm}3$)) $^{\circ}C$. Criteria used to evaluate corrosion due to discoloration of flux residue is described in ISO 9455-15, but a more quantitative evaluation standard is needed. In this study, experimental error level was estimated by analyzing flux residue after a corrosion test for 72, 500 hours of specimens using EDS analysis with acceleration voltage. It was determined that the copper area at the flux residue boundary is suitable for the EDS analysis area.

• 한국신뢰성학회:학술대회논문집
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• 한국신뢰성학회 2005년도 학술발표대회 논문집
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• pp.385-392
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• 2005

The restriction of the use of hazardous substances in electrical and electronic equipment legislation mandates the substitution of lead and other hazardous substances in electronics products by July 2006. Due to this legislative pressure, the electronics industry is moving to adoption of lead free solders. In this paper, we investigated a flux to restrict generating electrochemical migration in lead-free solder. The lead-free solders used in this study were Sn-0.7Cu-0.01P and Sn-3.0Ag-0.5Cu. To measure the resistance of electrochemical migration, the dew-cycle test and water drop test were adopted. As the result, now flux having high durable of electrochemical migration was developed.

• 마이크로전자및패키징학회지
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• 제25권2호
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• pp.25-30
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• 2018

Sn-Pb솔더는 그동안 자동차 전장품에서 많이 사용되어 왔다. 그러나 최근에 환경과 인체에 대한 유해성 때문에 end-of-life vehicle (ELV)과 같은 국제 환경 규제로 인하여 Pb의 사용이 금지되었다. 이러한 이유로 자동차 전장품을 위한 Pb-free 솔더링에 관한 많은 연구들이 보고 되어 왔다. 한편, 자동차의 연료 효율성과 공간 활용을 위하여 유연성과 경량의 특성을 가지는 플렉시블 기판이 자동차 전장품에 사용되고 있다. 자동차 전장품에 대한 Pb-free 솔더 접합부 특성에 관한 연구들이 많이 진행되었음에도 불구하고 자동차의 사용 환경을 고려한 플렉시블 기판 솔더 접합부에 대한 신뢰성 특성에 관한 연구는 아직 부족한 실정이다. 본 연구에서는 organic solderability preservative (OSP) 및 electroless nickel immersion gold (ENIG) 표면처리 된 플렉시블 기판 위 Sn3.0Ag0.5Cu, Sn0.7Cu, Sn0.5Cu0.01Al(Si) 세 가지 Pb-free 솔더 접합부에 대한 특성을 보고 하였다. 솔더 조성과 기판 표면처리에 따른 접합부의 특성 및 신뢰성을 비교 평가 하기 위하여 인장 강도 시험, 열 충격 시험과 반복 굽힘 시험을 진행 하고 그 결과를 분석하였다. OSP 표면처리 된 기판 접합부에 대한 반복 굽힘 시험 결과 세 종류의 솔더 접합부 모두 파괴는 솔더 내부에서 일어 났으며 Sn3.0Ag0.5Cu 솔더의 접합부에서 반복 굽힘 수명이 가장 길게 나타났다.

• 마이크로전자및패키징학회지
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• 제18권2호
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• pp.17-27
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• 2011

본 논문에서는 솔더의 온도 변화에 따른 변형 거동을 평가하기 위하여 솔더 재료의 열변형 거동을 파악할 수 있는 전단시편을 고안하여 온도변화에 따르는 열변형 실험과 유한요소해석을 수행하였다. 전단시편은 열팽창계수가 다른 두 금속 막대와 그 사이 공간에 접합된 솔더로 구성되어 있으며, 솔더는 유연 솔더 (Sn/36Pb/2Ag)와 무연 솔더 (Sn/3.0Ag/0.5Cu) 두가지를 대상으로 하였다. 실시간 무아레 간섭계를 이용하여 세 온도 사이클 동안의 각 온도단계에서 변 위 분포를 나타내는 간섭무늬를 얻고 그로부터 온도에 따른 유연 솔더와 무연 솔더의 열변형 특성을 비교하였다. 유한요소해석을 통하여 여러 연구자가 제시한 솔더의 점소성 물성치를 평가하였으며 유연 솔더의 경우에는 Darveaux가 제안한 Anand 모델, 무연 솔더의 경우 Chang이 제안한 Anand 모델을 사용한 해석 결과가 실험 결과와 가장 일치한다는 것을 밝혔다. 평가된 재료 모델을 사용하여 무연 솔더와 유연 솔더가 포함된 전단시편을 유한요소 해석하고 솔더의 점소성 거동 을 자세하게 분석하였다.

• 한국재료학회지
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• 제12권9호
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• pp.750-760
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• 2002

In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu were screen printed on both electroless Ni/Au and OSP metal finished micro-via PCBs (Printed Circuit Boards). The interfacial reaction between PCB metal pad finish materials and solder materials, and its effects on the solder bump joint mechanical reliability were investigated. The lead free solders formed a large amount of intermetallic compounds (IMC) than Sn-37Pb on both electroless Ni/Au and OSP (Organic Solderabilty Preservatives) finished PCBs during solder reflows because of the higher Sn content and higher reflow temperature. For OSP finish, scallop-like $Cu_{6}$ /$Sn_{5}$ and planar $Cu_3$Sn intermetallic compounds (IMC) were formed, and fracture occurred 100% within the solder regardless of reflow numbers and solder materials. Bump shear strength of lead free solders showed higher value than that of Sn-37Pb solder, because lead free solders are usually harder than eutectic Sn-37Pb solder. For Ni/Au finish, polygonal shaped $Ni_3$$Sn_4$ IMC and P-rich Ni layer were formed, and a brittle fracture at the Ni-Sn IMC layer or the interface between Ni-Sn intermetallic and P-rich Ni layer was observed after several reflows. Therefore, bump shear strength values of the Ni/Au finish are relatively lower than those of OSP finish. Especially, spalled IMCs at Sn-3.5Ag interface was observed after several reflow times. And, for the Sn-3.8Ag-0.7Cu solder case, the ternary Sn-Ni-Cu IMCs were observed. As a result, it was found that OSP finished PCB was a better choice for solders on PCB in terms of flip chip mechanical reliability.

• 마이크로전자및패키징학회지
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• 제17권4호
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• pp.35-40
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• 2010

본 연구에서는 상용 고온 솔더 중 많이 쓰이고 있는 Sn-3.5Ag, Sn-0.7Cu, Sn-5.0Sb 솔더에 대한 열충격 시험, 열싸이클 시험, 고온 진동 복합 시험 신뢰성 평가를 하였다. 테스트 샘플을 제작하기 위해 Sn-3.5Ag, Sn-0.7Cu, Sn-5.0Sb 솔더볼을 ENIG 표면 처리된 BGA에 접합하였으며, 그 후 BGA샘플을 OSP 표면 처리된 PCB에 실장 하였다. 신뢰성평가 동안 저항변화를 측정하였으며 신뢰성 평가 전후 전단강도 시험을 통하여 접합강도의 변화를 평가하였다. Sn-3.5Ag의 솔더인 경우 전기저항과 접합강도의 저하가 비교 평가한 3가지 솔더 중 가장 높은 저하율을 보였으며 Sn-0.7Cu의 솔더가 신뢰성 평가 후에 비교적 높은 안정성을 나타내었다.

• Journal of Welding and Joining
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• 제24권6호
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• pp.21-27
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• 2006

This study was focused on the evaluation of the thermo-mechanical board-level reliability of Pb-bearing and Pb-free surface mount assemblies. The composition of Pb-bearing solder was a typical Sn-37Pb and that of Pb-free solder used in this study was a representative Sn-3.0Ag-0.5Cu in mass %. Thermal shock test was chosen for the reliability evaluation of the solder joints. Typical $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed between both solders and Cu lead frame at the as-reflowed state, while a layer of $Cu_3Sn$ was additionally formed between the $Cu_6Sn_5$ and Cu lead frame during the thermal shock testing. Thickness of the IMC layers increased with increasing thermal shock cycles, and this is very similar result with that of isothermal aging study of solder joints. Shear test of the multi layer ceramic capacitor(MLCC) joints was also performed to investigate the degradation of mechanical bonding strength of solder joints during the thermal shock testing. Failure mode of the joints after shear testing revealed that the degradation was mainly due to the excessive growth of the IMC layers during the thermal shock testing.

• 한국생산제조학회지
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• 제18권5호
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• pp.449-454
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• 2009

This paper presents an experimental study on the failure characteristics of SnAgCu lead-free solder balls. To estimate the effect of Ag, three types of SnAgCu balls are first prepared by varying the weight percent of Ag(1.0, 3.0, 4.0 wt%) and then analyzed by reliability tests such as thermal shock, high speed ball shear, and drop tests. Thermal shock test reveals that the higher the weight percent of Ag is, the longer the fatigue lift becomes. To the contrary, high speed ball-shear test and drop test show that the shear strength and the fracture toughness of solder balls are inversely proportional to the weight percent of Ag, respectively, Reasons for these observations will be further investigated In the future work.