Thermo-Mechanical Reliability of Lead-Free Surface Mount Assemblies for Auto-Mobile Application |
Ha, Sang-Su
(School of Advanced Materials Science and Engineering, Sungkyunkwan University)
Kim, Jong-Woong (School of Advanced Materials Science and Engineering, Sungkyunkwan University) Chae, Jong-Hyuck (Research & Development Division for Hyundai Motor Company & Kia Motors Corporation) Moon, Won-Chul (Sungkyunkwan University, Micro Electro Packaging Consortium) Hong, Tae-Hwan (School of Advanced Materials Science and Engineering, Chungju National University) Yoo, Choong-Sik (Manufacturing Technology Group, WS Module Business Team, Samsung Electro-Mechanics) Moon, Jeong-Hoon (Department of Electronics Packaging, Suwon Science College) Jung, Seung-Boo (School of Advanced Materials Science and Engineering, Sungkyunkwan University) |
1 | J. H. Lau : Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw-Hill, NY (1997), 1-9 |
2 | C. H. Zhon and S. Yi : Soldering & Surface Mount Technology 11/1 (1999), 44-48 DOI ScienceOn |
3 | D. G. Kim, S. B. Jung : Materials Transactions, 11 (2005), 2366-2371 |
4 | M. Abtew, G. Selvaduray : Materials Science and Engineering, 27 (2000), 95-108 DOI |
5 | J. K. Lin, A. D. Silva, D. Frear, Y. Guo, S. Hayes, J. W. Jang, L. Li, D. Mitchell, B. Yeung, and C. Zhang : IEEE Transactions EPM, 25 (2002), 300-307 |
6 | S. Y. Jang, J. Wolf, Oswin Ehrmann, Heinz Gloor, Thomas Schreiber, Herbert Reichl. and Kyung-Wook Paik, Member : IEEE Transactios CPT, 26 (2003), 245-253 |
7 | W. B. Hampshire : Soldering & Surface Mounting. 14 June (1993), 49-52 |
8 | J. H. Lau : Low Cost Flip Chip Technologies, McGraw- Hill, NY (2000), 1-17, 183, 184 |
9 | P. T. Vianco, K. L. Erickson, and P,L. Hopkins : Journal of Electronic Materials, 23 (1994), 721-727 DOI ScienceOn |
10 | J. W. Yoon, Y. H. Lee, D. G. Kim, H. B. Kang, S. J. Suh, .C. W. Yang, C. B. Lee, J. M. Jung, C. S. Yoo and S. B. Jung : Journal of Alloy and Compounds, 381 (2004), 151-157 DOI |
11 | D. Suraski and K. Seeling : IEEE Transactions EPM, 24 (2001), 244-248 |