Proceedings of the Korean Reliability Society Conference (한국신뢰성학회:학술대회논문집)
- 2005.06a
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- Pages.385-392
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- 2005
A Study on Development of Flux to Restrict Occurrence of ion Migration in Lead-Free Solder
무연솔더 내 마이그레이션 플럭스개발에 관한 연구
- Ryu Dong Su (Ref. CS Group, Global CS Team, System Appliances Division, Digital Appliance Business, Samsung Electronics Co. LTD) ;
- Lim Jae Hoon (Ref. CS Group, Global CS Team, System Appliances Division, Digital Appliance Business, Samsung Electronics Co. LTD) ;
- Woo Seong Woo (Ref. CS Group, Global CS Team, System Appliances Division, Digital Appliance Business, Samsung Electronics Co. LTD)
- 유동수 (삼성전자 생활가전 총괄시스템 가전사업부 Global CS팀 냉장고 CS그룹) ;
- 임재훈 (삼성전자 생활가전 총괄시스템 가전사업부 Global CS팀 냉장고 CS그룹) ;
- 우성우 (삼성전자 생활가전 총괄시스템 가전사업부 Global CS팀 냉장고 CS그룹)
- Published : 2005.06.01
Abstract
The restriction of the use of hazardous substances in electrical and electronic equipment legislation mandates the substitution of lead and other hazardous substances in electronics products by July 2006. Due to this legislative pressure, the electronics industry is moving to adoption of lead free solders. In this paper, we investigated a flux to restrict generating electrochemical migration in lead-free solder. The lead-free solders used in this study were Sn-0.7Cu-0.01P and Sn-3.0Ag-0.5Cu. To measure the resistance of electrochemical migration, the dew-cycle test and water drop test were adopted. As the result, now flux having high durable of electrochemical migration was developed.
Keywords