• 산업경영시스템학회지
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• 제25권1호
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• pp.49-55
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• 2002

For making a lead terminal(condenser, resistor etc.), it is the matter that lead wire have to be supplied smooth without twisting and curving when it is supplied to the further processing (cutting, forming, attach process) after it being forwarded. The purpose of this study is to solve the winding claims of lead wire through the structural expansion of winding equipment to which the improvement of packing equipment to forward safely and supply the lead wire and QFD method are applied. The results of this study is available to solve the technical problem caused by the installation of the existing flyer system for the prevention of twisting and can expect the quality assurance as it prevents the claim(surface fault) caused by the bumping among lead wire which are involved in the packing equipment in its moving stage.

• 센서학회지
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• 제18권4호
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• pp.322-326
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• 2009

To estimate the measurement uncertainty for industrial platinum resistance thermometers(IPRTs) made with 3-wire connection, the immersion temperature profile was investigated using a liquid bath. Two types of IPRTs having lead wires made of silver and nickel were constructed and the immersion profiles were measured at temperatures from -50 $^{\circ}C$ to 250 $^{\circ}C$ using 3-wire and 4-wire method. As immersion depth and temperature increased, the resistances measured by 3-wire method increased linearly but not for 4-wire method. To calibrate a 3-wire IPRT, the immersion effect must be accounted for. We propose a linear equation to assess correctly the measurement uncertainty.

• 반도체디스플레이기술학회지
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• 제6권1호
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• pp.17-22
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• 2007

Recent new packages such as MCP(Multi-Chip Package), QDP(Quadratic Die Package) and DDP(Dual Die Package) have stack type configuration. This kind of multi-layer package is thicker than single layer package. So there is need for the low height looping technology in wirebonder to make these packages thinner. There is stiff zone above ball in wirebonder wire which is called HAZ(Heat Affect Zone). When making low height loop (below $80\;{\mu}m$) with traditional forward loop, stiff wire in HAZ(Heat Affected Zone) above ball is bended and weakened. So the traditional forward looping method cannot be applied to low height loop. SSB(stand-off stitch) wire bonding method was applied to many packages which require very low loops. The drawback of SSB method is making frequent errors at making ball, neck damage above ball on lead and the weakness of ball bonding on lead. The alternative looping method is BNL(ball neckless) looping technology which is already applied to some package(DDP, QDP). The advantage of this method is faster in bonding process and making little errors in wire bonding compared with SSB method. This paper presents the result of BNL looping technology applied in assembly house and several issues related to low loop height consistence and BNL zone weakness.

• 한국재료학회지
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• 제31권8호
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• pp.471-479
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• 2021

The electrochemical reaction between lead borate glass frit doped with Sn metal filler and Ni-Cr wire of a J-type resistor during a term of Joule heating is investigated. The fusing behavior in which the Ni-Cr wire is melted is not observed for the control group but measured for the Sn-doped specimen under 30 V and 500 mA. The Sn-doped lead borate glass frit shows a fusing property compared with other metal-doped specimens. Meanwhile, the redox reaction significantly contributes to the fusing behavior due to the release of free electrons of the metal toward the glass. The electrons derived from the glass, which used Joule heat to reach the melting point of Ni-Cr wire, increase with increasing corrosion rate at interface of metal/glass. Finally, the confidence interval is 95 ± 1.95₉ %, and the adjusted regression coefficient, R in the optimal linear graph, is 0.93, reflecting 93% of the data and providing great potential for fusible resistor applications.

• 한국산학기술학회논문지
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• 제18권5호
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• pp.29-34
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• 2017

본 논문에서는 압연 공정을 통해 리드용 와이어를 생산할 때 생산성을 향상시키기 위해 와이어의 직진 속도를 증가시키는 방법을 연구했다. 직진 속도를 증가시킬 때 가장 중요한 점은 와이어가 원래의 목적을 바르게 수행할 수 있는 것이다. 즉, 와이어의 직진 속도가 증가함과 동시에 균열이 발생하지 않으며, 치수 공차를 만족시켜야 한다. 하지만 와이어의 직진속도를 증가시키게 되면 기존의 압하량 보다 더 큰 수치를 주어야 하고 이는 와이어에 보다 큰 손상을 주어 표면에 무리를 주게 된다. 따라서 기존의 2단계 평압연 공정을 통해 생산되었던 와이어의 필요스펙을 충족시키면서 생산성 향상까지 도모할 수 있는 3단계 평압연 공정에 관해 연구하였다. 본 연구에서는 3단계 평압연 롤러의 압하량만을 변수로 가정하고 다른 조건은 현장 조건과 일치시킨다. 상용 PIDO(Process Integration and Design Optimization) 툴인 PIANO (Process Integration, Design and Optimization)를 통해 지정한 변수 3가지를 조작하면서 실험점을 분포하고 이를 바탕으로 최적설계를 진행하여 와이어의 생산성을 향상시킴과 동시에 필요 스펙인 최대 응력의 최소화가 가능하도록 설계되었다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2004년도 학술대회 논문집 정보 및 제어부문
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• pp.135-137
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• 2004

In this study we'll deal with the small-sized metalized film capacitors with large capacity which head have $5mm{\times}5mm{\times}2.5mm$ dimension. The lead wire is used to weld at both sides of capacitors. At that time the position gap between the welding machine and lead wire supplier would cause the welding error. Also, during the tapping processing of metalized film capacitors, the interval error among the capacitors, the length error of lead frame attached at the capacitors, and the straightness distortion of the lead frame could happen. As mentioned, four kinds of error parameters will be measured and analyzed by using the automatic visual inspection system that is implemented with CCD camera, optical parts, background lighting, and image processing algorithms. Finally we are able to achieve success rate above 99% to detect the welding faults of capacitors in the field test.

• 한국군사과학기술학회지
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• 제5권2호
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• pp.116-122
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• 2002

Electro Explosive Devices can be susceptible to electromagnetic interference. When these components are exposed to external electromagnetic fields, it may cause to induce sufficient current to generate enough heat for an inadvertent detonation. It is almost impossible to monitor the event of firing throughout the electromagnetic environment test. The survivability of EED for hazards of electromagnetic radiation is investigated. A fiber optic sensor is installed near the bridge wire after removing explosive material in order to measure the induced current on the bridge wire. The length of lead-wire of the EED fabricated is around 15 cm.

• Smart Structures and Systems
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• 제1권1호
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• pp.47-61
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• 2005

A ring-shaped lead zirconate titanate (PZT) piezoceramic sensor has been integrated with the Langevin-type piezoceramic driver of an ultrasonic wire-bonding transducer to form a smart transducer for in-situ measurement of three essential bonding parameters: namely, impact force, ultrasonic amplitude and bond time. This sensor has an inner diameter, an outer diameter and a thickness of 12.7 mm, 5.1 mm and 0.6 mm, respectively. It has a specifically designed electrode pattern on the two major surfaces perpendicular to its thickness along which polarization is induced. The process-test results have indicated that the sensor not only is sensitive to excessive impact forces exerted on the devices to be bonded but also can track changes in the ultrasonic amplitude proficiently during bonding. Good correlation between the sensor outputs and the bond quality has been established. This smart transducer has good potential to be used in automatic process-control systems for ultrasonic wire bonding.

• 한국정밀공학회지
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• 제18권2호
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• pp.102-110
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• 2001

In this paper, methods to analyze wire sweep and paddle shift during the semiconductor ship-encapsulation process have been studied. The analysis of wire sweep includes flow-field analysis in a complicated geometry, drag-force calculation for given flow of fluid, and wire-deformation calculation for given loads. The paddle-shift analysis is used to analyze the deformation of the paddle due to the pressure difference in two cavities. the analysis is done using either analytical solutions or numerical simulation. The analytical solution is used for rough but fast calculation of wire sweep. The numerical solution is used for more accurate calculation of wire-sweep. The numerical results of wire sweep show good agreements with the experimental ones.

• 한국기계가공학회지
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• 제16권4호
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• pp.119-126
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• 2017

High-precision wire is one of the most important components of lead production. However, no studies have been performed on the dimensional tolerance of these wires, and their capabilities have been deduced through trial and error. Therefore, PIANO, a commercial PIDO tool, was used to systematically determine the optimal parameters for stress minimization. The values obtained from the optimum design were modeled and analyzed using LS-Dyna, a finite element analysis program. Maximum stress was reduced by about 10% compared to its initial values, and the wire now satisfies dimensional tolerance ($10{\mu}m$).