• Journal of Korean Society of Industrial and Systems Engineering
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• v.25 no.1
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• pp.49-55
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• 2002

For making a lead terminal(condenser, resistor etc.), it is the matter that lead wire have to be supplied smooth without twisting and curving when it is supplied to the further processing (cutting, forming, attach process) after it being forwarded. The purpose of this study is to solve the winding claims of lead wire through the structural expansion of winding equipment to which the improvement of packing equipment to forward safely and supply the lead wire and QFD method are applied. The results of this study is available to solve the technical problem caused by the installation of the existing flyer system for the prevention of twisting and can expect the quality assurance as it prevents the claim(surface fault) caused by the bumping among lead wire which are involved in the packing equipment in its moving stage.

• Journal of Sensor Science and Technology
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• v.18 no.4
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• pp.322-326
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• 2009

To estimate the measurement uncertainty for industrial platinum resistance thermometers(IPRTs) made with 3-wire connection, the immersion temperature profile was investigated using a liquid bath. Two types of IPRTs having lead wires made of silver and nickel were constructed and the immersion profiles were measured at temperatures from -50 $^{\circ}C$ to 250 $^{\circ}C$ using 3-wire and 4-wire method. As immersion depth and temperature increased, the resistances measured by 3-wire method increased linearly but not for 4-wire method. To calibrate a 3-wire IPRT, the immersion effect must be accounted for. We propose a linear equation to assess correctly the measurement uncertainty.

• Journal of the Semiconductor & Display Technology
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• v.6 no.1 s.18
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• pp.17-22
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• 2007

Recent new packages such as MCP(Multi-Chip Package), QDP(Quadratic Die Package) and DDP(Dual Die Package) have stack type configuration. This kind of multi-layer package is thicker than single layer package. So there is need for the low height looping technology in wirebonder to make these packages thinner. There is stiff zone above ball in wirebonder wire which is called HAZ(Heat Affect Zone). When making low height loop (below $80\;{\mu}m$) with traditional forward loop, stiff wire in HAZ(Heat Affected Zone) above ball is bended and weakened. So the traditional forward looping method cannot be applied to low height loop. SSB(stand-off stitch) wire bonding method was applied to many packages which require very low loops. The drawback of SSB method is making frequent errors at making ball, neck damage above ball on lead and the weakness of ball bonding on lead. The alternative looping method is BNL(ball neckless) looping technology which is already applied to some package(DDP, QDP). The advantage of this method is faster in bonding process and making little errors in wire bonding compared with SSB method. This paper presents the result of BNL looping technology applied in assembly house and several issues related to low loop height consistence and BNL zone weakness.

• Korean Journal of Materials Research
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• v.31 no.8
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• pp.471-479
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• 2021

The electrochemical reaction between lead borate glass frit doped with Sn metal filler and Ni-Cr wire of a J-type resistor during a term of Joule heating is investigated. The fusing behavior in which the Ni-Cr wire is melted is not observed for the control group but measured for the Sn-doped specimen under 30 V and 500 mA. The Sn-doped lead borate glass frit shows a fusing property compared with other metal-doped specimens. Meanwhile, the redox reaction significantly contributes to the fusing behavior due to the release of free electrons of the metal toward the glass. The electrons derived from the glass, which used Joule heat to reach the melting point of Ni-Cr wire, increase with increasing corrosion rate at interface of metal/glass. Finally, the confidence interval is 95 ± 1.95₉ %, and the adjusted regression coefficient, R in the optimal linear graph, is 0.93, reflecting 93% of the data and providing great potential for fusible resistor applications.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.5
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• pp.29-34
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• 2017

In this paper, we report a method of improving the productivity of lead wire fabricated through the rolling process by increasing its linear velocity. The most important point to consider when raising the linear velocity is that the original specifications must still be adhered to. In other words, the dimensional tolerance must be satisfied when increasing the linear velocity of the wire without causing cracks. However, if the linear velocity of the wire is increased, the degree of reduction must also be increased, which causes more damage to the wire and increases the load on its surface. Therefore, we studied a three step rolling process which can satisfy the specifications of the wire produced through the two step rolling process and improve the productivity. In this study, only the roll gap of the three-stage rolling roller is assumed to be a variable, while the other conditions are the same as the field conditions. In addition, through the PIANO (Process Integration, Design and Optimization) tool, the (optimum?) surface roughness and maximum stress are maintained.

• Proceedings of the KIEE Conference
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• 2004.11c
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• pp.135-137
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• 2004

In this study we'll deal with the small-sized metalized film capacitors with large capacity which head have $5mm{\times}5mm{\times}2.5mm$ dimension. The lead wire is used to weld at both sides of capacitors. At that time the position gap between the welding machine and lead wire supplier would cause the welding error. Also, during the tapping processing of metalized film capacitors, the interval error among the capacitors, the length error of lead frame attached at the capacitors, and the straightness distortion of the lead frame could happen. As mentioned, four kinds of error parameters will be measured and analyzed by using the automatic visual inspection system that is implemented with CCD camera, optical parts, background lighting, and image processing algorithms. Finally we are able to achieve success rate above 99% to detect the welding faults of capacitors in the field test.

• Journal of the Korea Institute of Military Science and Technology
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• v.5 no.2
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• pp.116-122
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• 2002

Electro Explosive Devices can be susceptible to electromagnetic interference. When these components are exposed to external electromagnetic fields, it may cause to induce sufficient current to generate enough heat for an inadvertent detonation. It is almost impossible to monitor the event of firing throughout the electromagnetic environment test. The survivability of EED for hazards of electromagnetic radiation is investigated. A fiber optic sensor is installed near the bridge wire after removing explosive material in order to measure the induced current on the bridge wire. The length of lead-wire of the EED fabricated is around 15 cm.

• Smart Structures and Systems
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• v.1 no.1
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• pp.47-61
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• 2005

A ring-shaped lead zirconate titanate (PZT) piezoceramic sensor has been integrated with the Langevin-type piezoceramic driver of an ultrasonic wire-bonding transducer to form a smart transducer for in-situ measurement of three essential bonding parameters: namely, impact force, ultrasonic amplitude and bond time. This sensor has an inner diameter, an outer diameter and a thickness of 12.7 mm, 5.1 mm and 0.6 mm, respectively. It has a specifically designed electrode pattern on the two major surfaces perpendicular to its thickness along which polarization is induced. The process-test results have indicated that the sensor not only is sensitive to excessive impact forces exerted on the devices to be bonded but also can track changes in the ultrasonic amplitude proficiently during bonding. Good correlation between the sensor outputs and the bond quality has been established. This smart transducer has good potential to be used in automatic process-control systems for ultrasonic wire bonding.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.2
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• pp.102-110
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• 2001

In this paper, methods to analyze wire sweep and paddle shift during the semiconductor ship-encapsulation process have been studied. The analysis of wire sweep includes flow-field analysis in a complicated geometry, drag-force calculation for given flow of fluid, and wire-deformation calculation for given loads. The paddle-shift analysis is used to analyze the deformation of the paddle due to the pressure difference in two cavities. the analysis is done using either analytical solutions or numerical simulation. The analytical solution is used for rough but fast calculation of wire sweep. The numerical solution is used for more accurate calculation of wire-sweep. The numerical results of wire sweep show good agreements with the experimental ones.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.4
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• pp.119-126
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• 2017

High-precision wire is one of the most important components of lead production. However, no studies have been performed on the dimensional tolerance of these wires, and their capabilities have been deduced through trial and error. Therefore, PIANO, a commercial PIDO tool, was used to systematically determine the optimal parameters for stress minimization. The values obtained from the optimum design were modeled and analyzed using LS-Dyna, a finite element analysis program. Maximum stress was reduced by about 10% compared to its initial values, and the wire now satisfies dimensional tolerance ($10{\mu}m$).