• Title/Summary/Keyword: Lead Pitch

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The Reinforced Design for the Buckling of Semiconductor Lead Frame Punch (반도체 리드프레임 펀치의 좌굴에 관한 보강설계)

  • Lee I.S.;Ko D.C.;Kim B.M.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.10a
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    • pp.1008-1011
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    • 2005
  • It is necessary for the design of lead frame punches in blanking to consider buckling because inner lead pitch of lead frame has been narrowed by miniaturization and high accumulation of semiconductor. In addition, if process variables change in press stamping process, the lift of punches is no longer influenced in wear and punches can be broken suddenly. To prevent the fracture of fine pitch lead frame punches, having considered applying reinforcement to it, this paper verified the design with buckling analysis. This study presents the optimal position and number of reinforcement to be attached to punches. Finally this study presents design rules of attaching reinforcement.

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Understanding and Implementation Strategy of Tact Time, Pitch Time and Cycle Time (택트타임, 피치타임, 사이클타임의 이해와 적용방안)

  • Choe, Seong-Un
    • Proceedings of the Safety Management and Science Conference
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    • 2011.11a
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    • pp.557-561
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    • 2011
  • The study proposes three types of production lead time according to the production or demand pattern. First of all, it discusses the difference of three lead times. While pitch time and cycle time are used in push system with process stock and mass conveyor production, the tact time is used in pull system like as JIT based lean production system.

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Development of The Screw Lead Measurement System (나사 리드 측정시스템 개발)

  • Choi, Jong-Guen;Choi, Hyeon-Cheol;Kim, Hyung-Sun
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.16 no.5
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    • pp.7-13
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    • 2007
  • This study proposes a new screw measurement system that is capable of measuring the pitch or lead of a screw, which is one of the most important parameters representing the screw quality. There are various conventional methods for screw measurement including some mechanical and optical ones, but they can not be applied to measure the lead except the profiles or sizes. The newly suggested method is able to measure the pitch or lead directly. This is executed by scanning the thread with a digital probe while the target screw rotates. The devised measurement system is a integrated computer system which is composed of a stepping motor, a digital linear gauge and a chuck device for holding the measured screw. In order to operate the system effectively and conveniently, a computer program having graphical user interface facility is developed. Some experiments were done to prove the effectiveness of the system.

Simulation of Thermal Fatigue Life Prediction of Flip Chip with Lead-free Solder Joints by Variation in Bump Pitch and Underfill (무연 솔더 접합부을 갖는 플립칩에서의 언더필 및 범프 피치 변화에 의한 열 피로 수명 예측 해석)

  • Kim, Seong-Keol;Kim, Joo-Young
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.19 no.2
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    • pp.157-162
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    • 2010
  • This paper describes the thermal fatigue life prediction models for 95.5Sn-4.0Ag-0.5Cu solder joints of Flip chip package considering Under Bump Metallurgy(UBM). A 3D Finite element slice model was used to simulate the viscoplastic behavior of the solder. For two types of solder bump pitches, simulations were analyzed and the effects of underfill packages were studied. Consequently, it was found out that solder joints with underfill had much better fatigue life than solder joints without underfill, and solder joints with $300{\mu}m$ bump pitch had a longer thermal fatigue life than solder joints with $150{\mu}m$ bump pitch. Through the simulations, flip chip with lead-free solder joints should be designed with underfill and a longer bump pitch.

Maskless Screen Printing Process using Solder Bump Maker (SBM) for Low-cost, Fine-pitch Solder-on-Pad (SoP) Technology

  • Choi, Kwang-Seong;Lee, Haksun;Bae, Hyun-Cheol;Eom, Yong-Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.20 no.4
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    • pp.65-68
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    • 2013
  • A novel bumping process using solder bump maker (SBM) is developed for fine-pitch flip chip bonding. It features maskless screen printing process. A selective solder bumping mechanism without the mask is based on the material design of SBM. Maskless screen printing process can implement easily a fine-pitch, low-cost, and lead-free solder-on-pad (SoP) technology. Its another advantage is ternary or quaternary lead-free SoP can be formed easily. The process includes two main steps: one is the thermally activated aggregation of solder powder on the metal pads on a substrate and the other is the reflow of the deposited powder on the pads. Only a small quantity of solder powder adjacent to the pads can join the first step, so a quite uniform SoP array on the substrate can be easily obtained regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of 130 ${\mu}m$ is, successfully, formed.

The Prediction of Etching Characteristics Using Spray Characteristics in Etching Process of Lead-Frame (Lead-Frame 에칭공정에서 분무특성을 이용한 에칭특성의 예측)

  • Jeong Heung-Cheol;Choi Gyung-Min;Kim Duck-Jool
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.30 no.4 s.247
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    • pp.381-388
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    • 2006
  • The objective of this study is to predict the etching characteristics using spray characteristics for the optimization on the etching process of Lead-Frame. The etching characteristics such as etching factor, uniformity were investigated on the actual operating conditions. The correlation between the etching characteristics and the spray ones obtained by measurement were analyzed to simulate the etching characteristics according to actual conditions of lead-frame etching process. These conditions of lead-frame process were spray pressure, distance from nozzle tip to substrate, pipe pitch, and nozzle pitch. To improve the etching characteristics in the lead-frame process, effects of the various operating conditions should be understood in detail. The spray characteristics obtained by experiment using PDA system were simulated by the Monte-Carlo method. The etching process model was coded by Java language. It was found that simulation results generally agreed well with the measured results of etching characteristics in lead-frame etching process. The optimal operating parameters were successfully found under variable conditions.

Mechanical Performance Comparison of Pedicle Screw Based on Design Parameters: Dual Lead and Dual Pitch (척추경 나사못의 디자인이 고정력 및 구동 토크에 미치는 영향 분석: 이중 나사 및 이중 피치 나사)

  • Choi, Sun-Gak;Cha, Eun-Jong;Kim, Kyung-Ah;Ahn, Yoon-Ho
    • Journal of Biomedical Engineering Research
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    • v.39 no.3
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    • pp.134-139
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    • 2018
  • One of the most common problems with pedicle screw system is pullout of the screw. This study was performed to evaluate the pullout strength and driving torque of newly designed pedicle screws. The design of three type screws were standard pedicle screw, which had single lead threaded and single pitched design (Type A), single pitched and dual lead threaded pedicle screw (Type B), dual pitched and dual lead threaded pedicle screw (Type C), respectively. The tests were performed in accordance with the ASTM standards using polyurethane (PU) foam blocks. There was no significant difference in pullout strength among three types of screw. Type B and Type C exhibited higher insertion torque and removal torque than Type A, respectively (p<0.05). Pedicle screws newly developed with dual pitched and dual lead threaded design showed higher driving torque without decrease in pullout strength compared to the standard pedicle screw and could be inserted more rapidly with the same number of revolutions.

Experimental Study on Spray Etching Process In Micro Fabrication of Lead Frame

  • Jung, Ji-Won;Choi, Gyung-Min;Kim, Duck-Jool
    • Journal of Mechanical Science and Technology
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    • v.18 no.12
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    • pp.2294-2302
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    • 2004
  • The objective of this study is to obtain detailed information for the micro fabrication of lead frames by applying spray technology to wet etching process. Wet etching experiments were performed with different etching parameters such as injection pressure, distance from nozzle tip to etched substrate, nozzle pitch and etchant temperature. The characteristics of single and twin spray were measured to investigate the correlation between the spray characteristics and the etching characteristics. Drop size and velocity were measured by Phase-Doppler Anemometer (PDA). Four liquids of different viscosity were used to reveal the effects of viscosity on the spray characteristics. The results indicated that the shorter the distance from nozzle tip and the nozzle pitch, the larger etching factor became. The average etching factor had good positive correlation with average axial velocity and impact force. It was found that the etching characteristics depended strongly on the spray characteristics.

Ground Resonance Instabilities Analysis of a Bearingless Helicopter Main Rotor (무베어링 헬리콥터 로터의 지상공진 불안정성 특성 해석)

  • Yun, Chul-Yong;Kee, Young-Jung;Kim, Tae-Joo;Kim, Deog-Kwan;Kim, Seung-Ho
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.22 no.4
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    • pp.352-357
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    • 2012
  • The ground resonance instability of a helicopter with bearingless main rotor hub were investigated. The ground resonance instability is caused by an interaction between the blade lag motion and hub inplane motion. This instability occurs when the helicopter is on the ground and is important for soft-inplane rotors where the rotating lag mode frequency is less than the rotor rotational speed. For the analysis, the bearingless rotor was composed of blades, flexbeam, torque tube, damper, shear restrainer, and pitch links. The fuselage was modeled as a mass-damper-spring system having natural frequencies in roll and pitch motions. The rotor-fuselage coupling equations are derived in non-rotating frame to consider the rotor and fuselage equations in the same frame. The ground resonance instabilities for three cases where are without lead-lag damper and fuselage damping, with lead-lag damper and without fuselage damping, and finally with lead-lag damper and fuselage damping. There is no ground resonance instability in the only rotor-fuselage configuration with lead-lag damper and fuselage damping.

Studies on the Screening of Fixing agent for Deposit Control of ONP Stock (신문지 생산공정의 Deposit 제어를 위한 Fixing Agent의 선정에 관한 연구)

  • Lee, Kwang-Pyo;Ryu, Jeong-Yong;Song, Bong-Keun;Jeong, Seong-Hyeon;Park, Jong-Moon
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.42 no.3
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    • pp.1-6
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    • 2010
  • A new testing method named pitch deposit tester (PDT) was developed by KRICT in order to evaluate the deposit potential of micro-stickies. The new method involves depositing the potential pitch particles on the air bubble covered plastic film set in the pitch deposit tester (PDT) and analysing the deposited area by an image analyzer. In this study, the effect of fixing agents on potential pitch deposition was elucidated. The effects of some fixing agents (polyamine and polyethyleneimine) on pitch control were investigated by the PDT test of 100% recycled newsprint stock. The study suggested that proper use of the PEI can lead to better pitch control than that of polyamine. The efficiency of novel screening method using the PDT and retention and drainage analyser (RDA) for fixing agents in terms of retention and deposit contamination could be confirmed by above mentioned results.