• 한국정밀공학회지
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• 제17권12호
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• pp.82-87
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• 2000

This paper deals with monitoring of grinding wheel wear in grinding process. A monitoring system is developed in which a laser scanning micrometer is used to measure the circumferential shape as well as the axial shape of grinding wheel. The monitoring system is applied to grinding machines. The experiment results show that the monitoring system is useful not only for monitoring the amount of wear in grinding wheel but also for measuring the apparent diameter of the grinding wheel.

• International Journal of Precision Engineering and Manufacturing
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• 제2권1호
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• pp.81-86
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• 2001

This paper deals with the monitoring of grinding wheel wear in surface grinding process. A monitoring system, which makes use of a laser scanning micrometer, is developed to measure the circumferential shape as well as the axial profile of grinding wheel. The monitoring system is applied to surface grinding processes. The experimental results show that the developed monitoring system is useful not only for monitoring the amount of wear in grinding wheel but also for evaluation the quality of ground surface and determining proper derssing time for the grinding wheel.

• 한국정밀공학회지
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• 제19권7호
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• pp.59-64
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• 2002

Laser lithography technique is useful for fabricating micro-patterns of silicon wafers. In this work, the laser lithography micromachining technique is optimized based on Taguchi method. Sensitivity analysis was performed using laser scanning speed, laser power level, developing time and mixture ratio between developer and Di-water as the parameters. The results show that for the photoresist used in this work, 70${\mu}m$/s scan speed, 50㎽ laser power, 60sec. developing time and 6: 1 mixture ratio gives the best result. This work shows the effectiveness of laser lithography technique in fabricating patterns with a flew micrometer in width.

• International Journal of Precision Engineering and Manufacturing
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• 제7권4호
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• pp.3-7
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• 2006

Confocal scanning microscopy is a measurement technique used to observe micrometer and sub-micrometer features due to its high resolution, nondestructive properties, and 3D surface profiling capabilities. The design, implementation, and performance test of a confocal scanning microscopy system are presented in this paper. A short-wavelength laser (405 nm) and an objective lens with a high numerical aperture (0.95) were used to achieve the desired high resolution, while the x- and y-axis scans were implemented using an acousto-optic deflector and galvanomirror, respectively. An objective lens with a piezo-actuator was used to scan the z-axis. A spatial resolution of less than 138 nm was achieved, along with successful 3D surface reconstructions.

• Current Optics and Photonics
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• 제6권4호
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• pp.381-391
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• 2022

Two-photon-polymerization additive-manufacturing systems feature high resolution and precision. However, there are few reports on specific methods and possible problems concerning the use of small lasers to independently build such platforms. In this paper, a femtosecond-laser two-photon-polymerization additive-manufacturing system containing an optical unit, control unit, monitoring unit, and testing unit is built using a miniature femtosecond laser, with a detailed building process and corresponding control software that is developed independently. This system has integrated functions of light-spot detection, interface searching, micro-/nanomanufacturing, and performance testing. In addition, possible problems in the processes of platform establishment, resin preparation, and actual polymerization for two-photon-polymerization additive manufacturing are explained specifically, and the causes of these problems analyzed. Moreover, the impacts of different power levels and scanning speeds on the degree of polymerization are compared, and the influence of the magnification of the object lens on the linewidth is analyzed in detail. A qualitative analysis model is established, and the concepts of the threshold broadening and focus narrowing effects are proposed, with their influences and cooperative relation discussed. Besides, a linear structure with micrometer accuracy is manufactured at the millimeter scale.

• 한국정밀공학회지
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• 제18권8호
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• pp.150-156
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• 2001

This paper deals with the theoretical estimation and its experimental verification of grinding wheel wear in surface grinding process. A theoretical formulation is provided to predict the grinding wheel wear in surface grinding. To validate the theoretical prediction, the grinding wheel wear is measured by using a laser scanning micrometer. The associated surface roughness and grinding farce are also investigated both theoretically and experimentally. Through a series of simulations and experiments, it is shown that the predictions are in good agreement with the experimental results.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 추계학술대회 논문집
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• pp.1018-1021
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• 1997

This paper presents a result of simulation and improvement of grinding process for linear motion guide blocks. A simulation software, which is based on cylindrical grinding process. is used to predict the grinding wheel wear during the grinding process. To validate the simulation, the simulation result is compared with the experimental one. Simulation study is extended to obtain an optimal grinding condition for minimizing the grinding wheel wear. The optimal condition is validated through an experiment.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 춘계학술대회 논문집
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• pp.613-616
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• 2000

This paper deals with monitoring of grinding wheel wear in surface grinding process. A laser scanning micrometer is used to measure the circumferential shape as well as the axial shape of grinding wheel. The monitoring system is applied to two kinds of grinding methods: plunge and traverse grinding. Through experiments, it is found that measurement of grinding wheel wear reveals information of roughness of ground surface and the adequate dressing time. In addition, monitoring of grinding wheel wear makes it possible to identify abnormal grinding conditions.

• 마이크로전자및패키징학회지
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• 제19권3호
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• pp.77-82
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• 2012

본 연구에서는 칩을 기판에 내장하기 위해 상용화된 CSR사의 bluetooth chip을 이용하여 표면의 솔더볼을 제거하고 PCB소재와 공정을 이용하는 embedded active PCB 공정에 관한 연구를 하였다. 솔더볼이 제거된 칩과 PCB는 구리 도금 공정으로 연결되었으나 열 충격시 표면처리를 하지 않았을 시 칩의 표면과 ABF 간의 de-lamination 현상이 발견되었고, 이를 해결하기 위해 칩의 polyimide passivation layer에 디스미어와 플라즈마 공정을 이용하여 조도 형성을 하는 연구를 진행하였다. SEM(Scanning Electron Microscope) 과 AFM(Atomic Force Micrometer)을 통하여 표면을 관찰하였고, XPS(X-ray Photoelectron Spectroscopy)를 이용하여 표면의 화학적 구조의 변화를 관찰하였다. 실험결과 플라즈마 처리 시 표면 조도형성이 되었으나 그 밀도가 조밀하지 못하였지만 디스미어 공정과 함께 처리하였을 시 조도의 조밀도가 높아 열 충격을 가하였을 시에도 칩의 polyimide layer와 ABF간의 de-lamination 현상이 발견되지 않았다.

• 한국주조공학회지
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• 제23권5호
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• pp.276-285
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• 2003

In the undercooled melt of $Pd_{40}Cu_{30}Ni_{10}P_{20}$ alloy, the solidification behavior including nucleation and growth of crystals at the micrometer level has been observed in-situ by use of a confocal scanning laser microscope combined with an infrared image furnace. The $Pd_{40}Cu_{30}Ni_{10}P_{20}$ alloy specimens were cooled from the liquid state to glass transition temperature. 575 K, at various cooling late under a helium gas flow. According to the cooling rate, the morphologies of the solidification front are changed among various types, irregular jog like front, columnar dendritic front, cellular grain, star like shape jog and fine grain, etc. The velocities of the solid-liquid interface are measured to be $10^{-5}{\sim}10^{-8}$ m/s which are at least two orders higher than the theoretical crystal growth rates. Combining the morphologies observed in terms of cooling rates and their solidification behaviors, we conclude that phase separation takes place in the undercooled molten $Pd_{40}Cu_{30}Ni_{10}P_{20}$ alloy. The continuous cooling transformation (CCT) diagram was constructed from solidification onset time at various linear cooling conditions with different rate. The CCT diagram suggests that the critical cooling rate for glassy solidification is about 1.5 K/s, which is in agreement with the previous calorimetric findings.