• 제목/요약/키워드: Laser Direct Patterning

검색결과 63건 처리시간 0.026초

나노초 UV 레이저 응용 IC 기판 소재 조성별 가공 특성 (Characteristics of direct laser micromachining of IC substrates using a nanosecond UV laser)

  • 손현기;신동식;최지연
    • 한국레이저가공학회지
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    • 제15권3호
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    • pp.7-10
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    • 2012
  • Dimensions (line/space) of circuits in IC substrates for high-end chips (e.g. CPU, etc.) are anticipated to decrease as small as $10{\mu}m/10{\mu}m$ in 2014. Since current etch-based circuit-patterning processes are not able to address the urgent requirement from industry, laser-based circuit patterning processes are under active research in which UV laser is used to engrave embedded circuits patterns into IC substrates. In this paper, we used a nanosecond UV laser to directly fabricate embedded circuit patterns into IC substrates with/without ceramic powders. In experiments, we engraved embedded circuit patterns with dimensions (width/depth) of abut $10{\mu}m/10{\mu}m$ and $6{\mu}m/6{\mu}m$ into the IC substrates. Due to the recoil pressure occurring during ablation, the circuit patterning of the IC substrates with ceramic powders showed the higher ablation rate.

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Nd:$YVO_4$ 레이저 빔을 이용한 인듐 주석 산화물 직접 묘화 기술 (Direct Patterning Technology of Indium Tin Oxide Layer using Nd:$YVO_4$ Laser Beam)

  • 김광호;권상직
    • 대한전자공학회논문지SD
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    • 제45권11호
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    • pp.8-12
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    • 2008
  • AC PDP에 사용되는 ITO 전극의 공정시간을 단축시키고 생산성을 향상시키기 위해서 Nd:$YVO_4$ laser를 사용하여 ITO 전극 패턴을 하였다. ITO etchant를 사용하여 ITO 전극패턴을 형성한 샘플과 비교해서 laser를 사용하여 제작한 샘플은 ITO 라인 끝 부분에 shoulder와 물결무늬가 형성되었다. shoulder와 물결무늬의 제거를 위해서 laser의 펄스반복율과 스캔 속도에 변화를 주었다. 또한 shoulder와 물결무늬를 갖는 ITO 전극이 PDP에 주는 영향을 알아보기 위해서 방전특성분석을 하였다. 실험결과 40 kHz와 500 mm/s를 기본 조건으로 결정하였다. 본 실험을 통하여 레이저를 이용한 PDP용 ITO 전극막의 직접 패터닝 가능성을 확인할 수 있었다.

나노 스테레오리소그래피 공정을 이용한 불투명 기판에서의 3차원 마이크로 형상 제작 방법에 관한 연구 (Direct Patterning of 3D Microstructures on an Opaque Substrate Using Nano-Stereolithography)

  • 손용;임태우;하철우;양동열;정병제;공홍진
    • 한국정밀공학회지
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    • 제27권10호
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    • pp.93-99
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    • 2010
  • A nano-stereolithography is the direct patterning process with a nanoscale resolution using twophoton absorption induced by a femtosecond laser. However, in the majority of the works, the fabrication of 3D microstructures have been done only onto transparent glass due to the use of an oil immersion objective lens for achieving a high resolution. In this work, the coaxial illumination and the auto-focusing system are proposed for the direct patterning of nano-precision patterns on an opaque substrate such as a silicon wafer and a metal substrate. Through this work, 3D polymer structures and metallic patterns are fabricated on a silicon wafer using the developed process.

레이저를 이용한 미세에칭에 관한 연구 (A Study on the Argon Laser Assisted Thermochemical Micro Etching)

  • 박준민;정해도
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2001년도 춘계학술대회 논문집
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    • pp.844-847
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    • 2001
  • The application of laser direct etching has been discussed, and believed that the process is a very powerful method for micro machining. This study is focused on the micro patterning technology using laser direct etching process with no chemical damage of the material surface. A new introduced concept of energy synergy effect for surface micro machining is the combination of chemically ion reaction and laser thermal process. The etchant can't etch the material in room temperature, and used Ar laser has not power enough to machine. But, the machining is occurred in local area of the material by the combined energy. Using this process, the material is especially prevented from chemical damage for electric property. We have tested this new concept, and achieved a line with $1{mu}m$ width. The Ar laser with 488nm wavelength was used. The material was Si(100) wafer, and etchant is KOH solution. The application and flexibility of this process is in great hopes for MEMS structures and fabrication of the micro electric device parts.

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광조형을 이용한 마스크리스 패턴형성에 관한 연구 (A Study of Mastless Pattern Fabrication using Stereolithography)

  • 정영대;조인호;손재혁;임용관;정해도
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2002년도 춘계학술대회 논문집
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    • pp.503-507
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    • 2002
  • Mask manufacturing is a high COC and COO process in developing of semiconductor devices, because of the mass production tool with high resolution. Direct writing has been thought to be one of the patterning method to cope with development or small-lot production of the device. This study focused on the development of the direct, mastless patterning process using stereolithography tool for the easy and convenient application to micro and miso scale products. Experiments are utilized by three dimensional CAD/CAM as a mask and photo-curable resin as a photo-resist in a conventional stereo-lithography apparatus. Results show that the resolution of the pattern was achieved about 300 micron because of complexity of SLA apparatus settings, inspite of 100 micro of inherent resolution. This paper concludes that photo resist and laser spot diameter should be adjusted to get finer patterns and the proposed method is significantly feasible to mastless and low cost patterning with micro and miso scale.

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회절광학소자 제작을 위한 레이저 직접 노광기의 공정실험 (Parametric Study for a Diffraction Optics Fabrication by Using a Direct Laser Lithographic System)

  • 김영광;이혁교;김영식;이윤우
    • 한국정밀공학회지
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    • 제33권10호
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    • pp.845-850
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    • 2016
  • A direct laser lithography system is widely used to fabricate various types of DOEs (Diffractive Optical Elements) including lenses made as CGH (Computer Generated Hologram). However, a parametric study that uniformly and precisely fabricates the diffractive patterns on a large area (up to $200mm{\times}200mm$) has not yet been reported. In this paper, four parameters (Focal Position Error, Intensity Variation of the Lithographic Beam, Patterning Speed, and Etching Time) were considered for stabilization of the direct laser lithography system, and the experimental results were presented.

355nm UV 레이저를 이용한 AZ5214와 SU-8 포토레지스트 어블레이션에 관한 연구 (A Study on the Ablation of AZ5214 and SU-8 Photoresist Processed by 355nm UV Laser)

  • 오재용;신보성;김호상
    • 한국레이저가공학회지
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    • 제10권2호
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    • pp.17-24
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    • 2007
  • We have studied a laser direct writing lithography(LDWL). This is more important to apply to micro patterning using UV laser. We demonstrate the possibility of LDWL and construct the fabrication system. We use Galvano scanner to process quickly micro patterns from computer data. And laser beam is focused with $F-{\theta}$ lens. AZ5214 and SU-8 photoresist are chosen as experimental materials and a kind of well-known positive and negative photoresist respectively. Laser ablation mechanism depends on the optical properties of polymer. In this paper, therefore we investigate the phenomenon of laser ablation according to the laser fluence variation and measure the shape profile of micro patterned holes. From these experimental results, we show that LDWL is very useful to process various micro patterns directly.

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레이저 직접 패터닝에 의한 폴리이미드의 표면 특성 제어 (Tailoring Surface Properties of Polyimides by Laser Direct Patterning)

  • 황윤찬;손정민;박재희;남기호
    • 한국염색가공학회지
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    • 제35권2호
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    • pp.121-127
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    • 2023
  • In this study, a comprehensive investigation was conducted on the morphological and property changes of laser-induced nanocarbon (LINC) as a function of laser process parameters. LINC was formed on the surfaces of polyimide films with different backbone structures under various process conditions, including laser power, scan speed, and resolution. Three different forms of LINC electrodes (i.e., continuous 3D porous graphene, wooly nanocarbon fibers, line cut) were formed depending on the laser power and scan speed. Furthermore, heteroatom doping induced from the chemical structure of the polyimide during laser patterning was found to be effective in modifying the electrical properties of LINC electrodes. The LINC surfaces exhibited different microstructures depending on the laser beam resolution under constant laser power and scan speed, allowing for controllable surface wettability. The correlation between the chemical structure of the polymer substrate, laser process parameters, and carbonized surface properties in this study is expected to be utilized as fundamental understanding for the manufacturing of next-generation carbon-based electronic devices.

Nd:YVO4 Laser Patterning of Various Transparent Conductive Oxide Thin Films on Glass Substrate at a Wavelength of 1,064 nm

  • Wang, Jian-Xun;Kwon, Sang Jik;Cho, Eou Sik
    • Transactions on Electrical and Electronic Materials
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    • 제14권2호
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    • pp.59-62
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    • 2013
  • At an infra-red (IR) wavelength of 1,064 nm, a diode-pumped Q-switched $Nd:YVO_4$ laser was used for the direct patterning of various transparent conductive oxide (TCO) thin films on glass substrate. With various laser beam conditions, the laser ablation results showed that the indium tin oxide (ITO) film was removed completely. In contrast, zinc oxide (ZnO) film was not etched for any laser beam conditions and indium gallium zinc oxide (IGZO) was only ablated with a low scanning speed. The difference in laser ablation is thought to be due to the crystal structures and the coefficient of thermal expansion (CTE) of ITO, IGZO, and ZnO. The width of the laser-patterned grooves was dependent on the film materials, the repetition rate, and the scanning speed of the laser beam.