• Korean Journal of Optics and Photonics
• /
• v.23 no.6
• /
• pp.269-273
• /
• 2012

It is important to control the beam pattern of an LED by the design of a reflector. The optimum conditions of the structure parameters for the 2 segment LED reflector are analyzed and compared as they vary depending on the various intensity distributions of light output on the LED chip surface. It is also interesting that combining various types of reflectors is possible to give several efficient beam patterns, such as the maximum intensity profile or relatively wide controllability of beam angle.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
• /
• 2017.10a
• /
• pp.510-511
• /
• 2017

In this paper, we have studied to minimize the lifetime and fault occurrence of LED fixtures, which have a short lifetime and frequent faults. In the current LED chip, the lifetime is semi-permanent, but compared to the lifetime of the LED chip, Drivers do not last long. In recent years, low-priced LED illuminators such as those from China have entered the market, and many consumers are perceiving LED illuminators. In order to solve these problems, we designed an LED illuminator of 25W class by using AC Direct IC, which has a longer lifetime than the conventional driver, by removing the electrolytic capacitor in the LED driving driver which is the cause of the failure.

• Proceedings of the SAREK Conference
• /
• 2009.06a
• /
• pp.1379-1384
• /
• 2009

High power light emitting diode(LEDs), a strong candidate for the next generation general illumination applications are of interest. With major advantages of power saving, increased life expectancy and faster response time over traditional incandescent bulb, the LEDs are rapidly taking over many applications such as LCD backlighting, traffic light, automotive lighting, signage, etc. The increased electrical currents used to drive the LEDs have focused more attention on the thermal management because the efficiency and reliability of the solid-state lighting devices strongly depend on successful thermal management. There exist some problems that are caused by heat generation in the LED package, such as wire breakage, yellowing of epoxy resin, lifted chip caused by reflow of thermal paste chip attach and interfacial separation between LED package and silicon resin. The goal of this study is to analyze high power LED thermal properties of using pulsating heat pipe.

• Transactions on Electrical and Electronic Materials
• /
• v.18 no.2
• /
• pp.59-61
• /
• 2017

This research was analyzed thermal characteristics that was appointed disadvantage when smart LED driver ICs was packaged and we applied extracted thermal characteristics for optimal layout design. We confirmed reliability of smart LED driver ICs package without additional heat sink. If the package is not heat sink, we are possible to minimize package. For extracting thermal loss due to overshoot current, we increased driver current by two and three times. As a result of experiment, we obtained 22 mW and 49.5 mW thermal loss. And we obtained optimal data of 350 mA driver current. It is important to distance between power MOSFET and driver ICs. If the distance was increased, the temperature of package was decreased. And so we obtained optimal data of 3.7 mm distance between power MOSFET and driver ICs. Finally, we fabricated real package and we analyzed the electrical characteristics. We obtained constant 35 V output voltage and 80% efficiency.

• Transactions on Electrical and Electronic Materials
• /
• v.13 no.6
• /
• pp.292-296
• /
• 2012

An optimum heat sink for a 30 W chip on board (COB) LED down-light is designed, fabricated, and characterized. By using the SolidWorks Flow simulator and thermal analysis software, the thermal characteristics of the optimum heat sink is analyzed. Four different types of heat sink are simulated and an optimum structure of the heat sink is found. The simulated temperature of the heat sink when operating the LED down-light is $55.9^{\circ}C$, which is only a difference of $2^{\circ}C$ from the measured temperature. In order to reduce the temperature further, a copper spreader is introduced to the heat sink. The temperature of the heat sink with the copper spreader is $3^{\circ}C$ lower than without the copper spreader.

• Journal of the Microelectronics and Packaging Society
• /
• v.14 no.4
• /
• pp.87-92
• /
• 2007

A $CaAl_{12}O_{19}:Mn^{4+}$ red phosphor showed the highest emission intensity at a concentration of 0.02mole $Mn^{4+}$ and the high crystallinity and luminescent properties were obtained at $1600^{\circ}C$ firing temperature for 3hr. The synthesized phosphor showed a broad emission band at 658nm wavelength. Red light-emitting diodes(LEDs) were fabricated through the integration of on InGaN UV bare chip and a 1:3 ratio of $CaAl_{12}O_{19}:Mn^{4+}$ and epoxy resin in a single package. This coated LED can be applicable to make White LEDs under excitation energy of UV LED.

• The Journal of Korean Institute of Communications and Information Sciences
• /
• v.39C no.3
• /
• pp.234-238
• /
• 2014

Multichip packaging was achieved the best solution to significantly reduce thermal resistance at the same time, to increase luminance intensity in LEDs packaging application. For the packaging, thermal spreading resistance is an important parameter to get influence the total thermal performance of LEDs. In this study, silicon-based multichip light emitting diodes (LEDs) packaged module has been examined for thermal characteristics in several parameters. Compared to the general conventional single LED packaged chip module, multichip LED packaged module has many advantages of low cost, low density, small size, and low thermal resistance. This analyzed module is comprised of multichip LED array, which consists of 32 LED packaged chips with supplement power of 0.2 W at every single chip. To realize the extent of thermal distribution, the computer-aided design model of 6.4 W Si-based multichip LED module was designed and was performed by the simulation basis of actual fabrication flow. The impact of thermal distribution is analyzed in alternative ways both optimizing numbers of fins and the thickness of that heatsink. In addition, a thermal resistance model was designed and derived from analytical theory. The optimum simulation results satisfies the expectations of the design goal and the measurement of IR camera results. tart after striking space key 2 times.

• Journal of the Microelectronics and Packaging Society
• /
• v.17 no.4
• /
• pp.95-100
• /
• 2010

LED (Light Emitting Diode) is 85% of the applied energy is converted into heat that is already well known. Lately, LED chips increasing the capacity as result delivered to increase the heat of the LED products and module that directly related to life span and degradation. Thus, in industry the high-power LED chip to control the heat generated during the course of the study and the existing aluminum, copper adhesives, and uses MLC (Metal clad laminate) structures using low-cost FR4 and copper CCL (Copper Clad Laminate) to reduce costs by changing to a study being carried out. In this study, using low-cost CCL Class, mounted 1W LED chip to analyze changes in the thermal resistance. In addition, heat dissipation in the CCL to facilitate a variety of thermal via design outside of the heat generated by the LED chip to control and facilitate the optimal structure of the heat dissipation is suggested.

• Korean Journal of Optics and Photonics
• /
• v.25 no.5
• /
• pp.254-261
• /
• 2014

Two types of white light-emitting diodes (LEDs) with different phosphor structures were fabricated and compared in terms of their optical characteristics. Their spectroscopic properties were analyzed as a function of temperature, from room temperature to $80^{\circ}C$. The temperature dependence of the luminance and the color coordinates showed that the decrease in luminance and change in the color coordinates of the remote-phosphor type LED were much smaller compared to the conventional white LED. These improvements were attributed to the decrease in phosphor temperature, due to the distance between the LED chip and the phosphor layer, as well as to the reduced absorption by the LED chip of the light emitted from the phosphor layer.

• The Journal of the Korea institute of electronic communication sciences
• /
• v.9 no.5
• /
• pp.561-566
• /
• 2014

The high power COB(Chip on Board) LED, densely arranged chips on a board, are increasing to resolve heat problems in LED that has luminous semiconductor chips as main materials. In case of high-power COB LED, protection against heat is necessary due to the power consumption is high. Also if the temperature of device increases, the optical emission becomes less efficient and the life rapidly reduces due to thermal stress. This study packaged 13.5W COB LED and heat sink with difference form and produced 13.5W COB LED down-light heat sink by analyzing the thermal modes with Solidworks Flow Simulation. And finally it analyzed and evaluated the thermal modes using contacting and non-contacting thermometers.