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http://dx.doi.org/10.4313/TEEM.2012.13.6.292

Development and Characterization of Optimum Heat Sink for 30 W Chip on Board LED Down-Light  

Seo, Bum-Sik (Collage of Engineering, Wonkwang University)
Lee, Ki-Joung (Collage of Engineering, Wonkwang University)
Yang, Jong-Kyung (Collage of Engineering, Wonkwang University)
Cho, Young Seek (Collage of Engineering, Wonkwang University)
Park, Dae-Hee (Collage of Engineering, Wonkwang University)
Publication Information
Transactions on Electrical and Electronic Materials / v.13, no.6, 2012 , pp. 292-296 More about this Journal
Abstract
An optimum heat sink for a 30 W chip on board (COB) LED down-light is designed, fabricated, and characterized. By using the SolidWorks Flow simulator and thermal analysis software, the thermal characteristics of the optimum heat sink is analyzed. Four different types of heat sink are simulated and an optimum structure of the heat sink is found. The simulated temperature of the heat sink when operating the LED down-light is $55.9^{\circ}C$, which is only a difference of $2^{\circ}C$ from the measured temperature. In order to reduce the temperature further, a copper spreader is introduced to the heat sink. The temperature of the heat sink with the copper spreader is $3^{\circ}C$ lower than without the copper spreader.
Keywords
LED; COB; Thermal design; Heat sink; Down-light;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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