Development and Characterization of Optimum Heat Sink for 30 W Chip on Board LED Down-Light |
Seo, Bum-Sik
(Collage of Engineering, Wonkwang University)
Lee, Ki-Joung (Collage of Engineering, Wonkwang University) Yang, Jong-Kyung (Collage of Engineering, Wonkwang University) Cho, Young Seek (Collage of Engineering, Wonkwang University) Park, Dae-Hee (Collage of Engineering, Wonkwang University) |
1 | N. Narendran and Y. Gu, Life of LED-based White Light Sources, Journal of Display Technology, 1, 1 (2005) [DOI: http://dx.doi.org/10.1109/JDT. 2005.852510]. DOI ScienceOn |
2 | Chun-Jen Weng, Advanced thermal enhancement and management of LED packages, International Communications in Heat and Mass Transfer, 36, 3 (2009) [DOI: http://dx.doi.org/10.1016/TDEI.2008. 11.015]. |
3 | S. J. LEE, A study on the photon extraction efficiency ingan light-emitting diodes depending on chip structure and chip-mount schemes, 45, 014601 (2006) [DOI: http://dx.doi.org/10.1117/1.2151194]. DOI ScienceOn |
4 | D. W Hong, S.J LEE, A Study on High Power LED Lamp Structures, 21, 3 (2010) [DOI: http://dx.doi.org/10.3807/KJOP.2010.2.3.118]. |
5 | Keum-Yeon, COB, COH Package LED Module Thermal Analysis Simulation, 12, 11 (2011) [DOI: http://dx.doi.org/10.5762/KAIS.2011. 12.11.5117]. DOI ScienceOn |
6 | ARPACI, KAO, SELAMET, Introduction to heat transfer, 28, 112(2001) [DOI: http://dx.doi.org/10.1049/SQJ.1958.0026]. DOI |
7 | Yunus A. cengel, Heat Transfer a practical approach 2nd edition n (McGraw-Hill, Boston, 2003) p.145. |
8 | S. H Yu Analysis of Natural Convection around Radial HeatSink, 15.11(2009) [DOI: http://dx.doi.org/10.1016/J.IJHEEATMASSTRANSFER.2010.02.032]. |
9 | D. W HONG, A Study on High Power LED Lamp Structures, 21, 3 (2010) [DOI: http://dx.doi.org/10.3807/KJOP.2010.21.2.118]. |
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