• Title/Summary/Keyword: LED boards

Search Result 27, Processing Time 0.017 seconds

Development of 80W LED Lighting Equipment for Broadcasting System (방송시스템용 80W LED 조명장비의 개발)

  • Lee, Dong-Yoon
    • The Journal of Korea Institute of Information, Electronics, and Communication Technology
    • /
    • v.10 no.6
    • /
    • pp.506-511
    • /
    • 2017
  • LED lighting, which many companies are pursuing commercialization, is a representative green energy technology. However, the LED lighting for broadcasting image should have high output and easy portability compared with general LED lighting devices for street lamps, advertisement or transportation devices. Therefore, while shooting a broadcast image if you use LEDs as a substitute light source for halogen lamps and fluorescent lamps that are large in size and uncomfortable to handle it is expected that the lightening of the equipment will activate the broadcasting image lighting equipment industry. After considering the mass production of the LED module board and the SMT production size of the chip mounter, the board size was determined considering the overall size of the product by model. In this paper, four 20W LED boards are arranged vertically in order to produce an 80W board. In other words, by sharing LED module board size by model, high power LED lighting equipments of 120W and 200W can be selected as an increase in the number of boards.

Comparisons of the Heat Dissipation Performances of MPCB and FPCB in LED Lights (LED조명에서 MPCB와 FPCB의 방열 성능 비교 연구)

  • Shin, Sang-Muk;Moon, Duk-Young;Yoo, Kyung-Sun;Hyun, Dong-Hoon
    • Journal of the Korean Society of Manufacturing Technology Engineers
    • /
    • v.26 no.4
    • /
    • pp.371-377
    • /
    • 2017
  • In this study, the heat dissipation performances of metal printed circuit boards (MPCBs) and flexible printed circuit boards (FPCBs) used in light-emitting diode (LED) lights were compared and analyzed by performing a heat dissipation simulation using a thermal flow analysis program. The results were summarized graphically. The temperature distribution of the MPCB was found to be better than that of the FPCB, indicating the better heat dissipation performance of the MPCB. For the two FPCB structures studied, we confirmed the LED temperature and temperature distribution by thermal flow analysis and found that for better overall heat dissipation performance, PCBs should preferably have an asymmetric structure. We confirmed the possibility of using FPCBs, which are characterized by a flexible structure, for LED lighting.

The preliminary study of developing strong corrugated box board against aggravated service condition(I) (환경변화에 강한 골판지 개발을 위한 기초연구(제1보))

  • 서영범;오영순
    • Journal of Korea Technical Association of The Pulp and Paper Industry
    • /
    • v.30 no.1
    • /
    • pp.29-43
    • /
    • 1998
  • This study was to investigate the effect of .compressive load and cyclic humidity(2$0^{\circ}C$, 65% and 90% RH) on the physical and mechanical properties of corrugated board. Corrugated boards in the study were under compressive load and under cyclic humidity, and their properties were compared to those without load. Results were summarized as follows ; 1 Statistically significant correlation was shown between the ring crush of the boards and the compressive strength of cylinder specimen made from the boards. So we could study the compressive behavior of board with cylinder specimen. 2. The boards under the compressive load increased their moisture content and thickness much more than those without load both in constant and in cyclic RH. 3. The compressive and tensile strength of board samples were inversely and closely proportional to the sheet moisture content regardless of their load and humidity history. 4. The moisture content did not show any significant proportionality to the change of burst strength of boards within this experiment. 5. Board reconditioning in standard condition led to the recovery of the strength loss that had occurred under various load and humidity condition. 6. The handsheets prepared from the boards that had experienced compressive load and cyclic humidity, and those with no-load and 65% RH did not show any significant difference in strength properties. No physical damage or load-carrying properties of the wood fiber were observed by the compressive load and cyclic humidity history.

  • PDF

Flame Retardant and Thermal Properties of Wood-based Composite Boards Prepared by Graphene Nanoplatelet/Reused Phenolic Foam (그래핀나노플레이트렛 및 재활용 페놀폼으로 제조된 목재기반 복합보드의 난연 및 열적 특성)

  • Han, Jeong-In;Kim, Min-Ji;Song, Eun Ji;Kim, Kyung Hoon;In, Se-Jin;Lee, Young-Seak
    • Applied Chemistry for Engineering
    • /
    • v.30 no.3
    • /
    • pp.371-378
    • /
    • 2019
  • Graphene nanoplatelet (GnP)/reused phenolic foam (re-PF)/wood composite boards were fabricated with different GnP content as 5, 10 and 20 w/w% to investigate the effect of GnP on thermal- and flame retardant properties of wood-based composite boards. The thermal- and flame retardant properties of fabricated composite boards were investigated by thermogravimetric analysis (TGA) and limiting oxygen index (LOI), respectively. The thermal stability of the composite boards increased proportionally with respect to the amount of GnP, and the char yield of these boards increased up to 22% compared to that of the pure wood board. The LOI values of composite boards were about 4.8~7.8% higher than those of using pure wood boards. It was also confirmed that the flame retardant properties of composite boards were remarkably improved by the addition of re-PF and GnP. These results were because of the fact that the re-PF and GnP with a high thermal stability delayed the initial thermal degradation temperature of composite boards and made their char layers denser and thicker which led the overall combustion delay effect of the composite board. Especially, GnP as a carbon-based material, facilitated the char layer formation and increased remarkedly the char yield, which showed higher effect on flame retardant properties than those of the re-PF.

Study on the Electrical Safety Management Method through the Electrical Characteristic Analysis of LED Lamps (LED 램프의 특성 분석을 통한 전기안전 관리 방안에 관한 연구)

  • Lee, Ki-Yeon;Moon, Hyun-Wook;Kim, Dong-Woo;Lim, Young-Bea;Ryu, In-Ho
    • The Transactions of The Korean Institute of Electrical Engineers
    • /
    • v.65 no.11
    • /
    • pp.1931-1936
    • /
    • 2016
  • In this paper, we analyzed causes of accidents that recently increased in the illegal and defective LED lamps. They were analyzed by the electrical characteristics calculation and reappearance experiments. The causes of the accidents were analyzed from the circuit affected by the variation of voltage, current and power by harmonics. We drew a conclusion for electrical safety in illegal or degraded LED lamps from the analysis result. The management factors for electrical safety in LED lamps were harmonics, reactive power and power factor. It is possible to secure the electrical safety through monitoring of power factor in failure products and available in smart meters or smart distribution boards.

Development of a Punching System for Pin-hole Type LED Display Board (핀홀형 LED 디스플레이 보드 펀칭 시스템 개발)

  • Choi, Hyeung-Sik;Kang, Jin-Il;Her, Jae-Gwan;Han, Jong-Suk
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.27 no.7
    • /
    • pp.63-70
    • /
    • 2010
  • We developed a new punching system that generates pinholes expressing texts or images on a plastic plate. The pin-holed plate is used as a new glamorous display board reflecting colorful lights from the light emitting diode (LED) installed on the edge side of the plate. The four degree-of-freedom punching system was designed to make same multiple holes on four plastic plates simultaneously. For this motion, we designed a structure for a simultaneous motion of the system. For even reflection of the lights from texts or images on the board and fast production of the pin-holed boards, fast motion including precise position control is very important. We also built a PC-based integrated control system including a GUI program to help users easily design luminous texts or images on the plastic plate. Also, we conducted a performance test of the system to verify the punching speed and position control of the pin holes on the plate.

Practical countermeasures for the aerodynamic performance of long-span cable-stayed bridges with open decks

  • Zhou, Rui;Yang, Yongxin;Ge, Yaojun;Mendis, Priyan;Mohotti, Damith
    • Wind and Structures
    • /
    • v.21 no.2
    • /
    • pp.223-239
    • /
    • 2015
  • Open decks are a widely used deck configuration in long-span cable-stayed bridges; however, incorporating aerodynamic countermeasures are advisable to achieve better aerodynamic performance than a bluff body deck alone. A sectional model of an open deck cable-stayed bridge with a main span of 400 m was selected to conduct a series of wind tunnel tests. The influences of five practical aerodynamic countermeasures on flutter and vortex-induced vibration (VIV) performance were investigated and are presented in this paper. The results show that an aerodynamic shape selection procedure can be used to evaluate the flutter stability of decks with respect to different terrain types and structural parameters. In addition, the VIV performance of $\prod$-shaped girders for driving comfortableness and safety requirements were evaluated. Among these aerodynamic countermeasures, apron boards and wind fairings can improve the aerodynamic performance to some extent, while horizontal guide plates with 5% of the total deck width show a significant influence on the flutter stability and VIV. A wind fairing with an angle of $55^{\circ}C$ showed the best overall control effect but led to more lock-in regions of VIV. The combination of vertical stabilisers and airflow-depressing boards was found to be superior to other countermeasures and effectively boosted aerodynamic performance; specifically, vertical stabilisers significantly contribute to improving flutter stability and suppressing vertical VIV, while airflow-depressing boards are helpful in reducing torsional VIV.

Fabrication of the Wafer Level Packaged LED Integrated Temperature Sensor and Configuration of The Compensation System for The LED's Optical Properties (온도센서가 집적된 WLP LED의 제작과 이를 통한 광 특성 보상 시스템의 구현)

  • Kang, In-Ku;Kim, Jin-Kwan;Lee, Hee-Chul
    • Journal of the Institute of Electronics Engineers of Korea SD
    • /
    • v.49 no.7
    • /
    • pp.1-9
    • /
    • 2012
  • In this paper, resistance temperature detector (RTD) integrated into the LED package is proposed in order to solve the temperature dependence of LED's optical properties. To measure the package temperature in real time, the RTD type temperature sensor having excellent accuracy and linearity between temperature change and resistance change was adopted. A stable metallic film is required for long term reliability and stability of the RTD type temperature sensor. Therefore, deposition and annealing condition for the film were determined. Based on the determined condition, the RTD type temperature sensor with the sensitivity of about $1.560{\Omega}/^{\circ}C$ was fabricated inside the LED package. In order to configurate the LED package system keeping the constant brightness regardless of the temperature, additional conversion circuit and control circuit boards were fabricated and added to the fabricated LED package. The proposed system was designed to compensate the light intensity caused by temperature change using the variable duty rate of driving current. As a result, the duty rate of PWM signal which is the output signal of the configurated system was changed with the temperature change, and the duty rate was similarly varied with the target duty rate. Consequently, it was focused the fabricated RTD can be used for compensating the optical properties of LED and the LED package which exhibits constant brightness regardless of the temperature change.

Study on an Automatic Punching System for a LED Display using Flexible Plates (LED 디스플레이용 유연 보드의 자동 펀칭 시스템 연구)

  • Choi, Hyeung-Sik;Kang, Jin-Il;Her, Jae-Gwan;Han, Jong-Suk
    • Journal of Advanced Marine Engineering and Technology
    • /
    • v.34 no.5
    • /
    • pp.711-717
    • /
    • 2010
  • In this paper, a new automatic punching system that generates pinholes expressing texts or images on a plastic plate is developed. The pin-holed plate is used as a new glamorous display board reflecting colourful lights from the light emitting diode (LED) installed on the edge side of the plate. The punching system has four actuators which work together to make multiple holes with accurate position and depth on the plastic plate. For even reflection of the lights from texts or images on the board and fast production of the pin-holed boards, we developed an accurate actuating structure of the system cooperating with a PID control algorithm. We also built a GUI-based integrated control system to help users easily design luminous texts or images on the plastic plate. Also, we conducted a performance test of the system to verify the punching speed and depth control of the pin holes on the plastic plate.

A Study on the Deposit Uniformity and Profile of Cu Electroplated in Miniaturized, Laboratory-Scale Through Mask Plating Cell for Printed Circuit Board (PCBs) Fabrication

  • Cho, Sung Ki;Kim, Jae Jeong
    • Korean Chemical Engineering Research
    • /
    • v.54 no.1
    • /
    • pp.108-113
    • /
    • 2016
  • A miniaturized lab-scale Cu plating cell for the metallization of electronic devices was fabricated and its deposit uniformity and profile were investigated. The plating cell was composed of a polypropylene bath, an electrolyte ejection nozzle which is connected to a circulation pump. In deposit uniformity evaluation, thicker deposit was found on the bottom and sides of substrate, indicating the spatial variation of deposit thickness was governed by the tertiary current distribution which is related to $Cu^{2+}$ transport. The surface morphology of Cu deposit inside photo-resist pattern was controlled by organic additives in the electrolyte as it led to the flatter top surface compared to convex surface which was observed in the deposit grown without organic additives.