• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2012.05a
• /
• pp.799-800
• /
• 2012

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.18 no.4
• /
• pp.175-182
• /
• 2017

In light emitting diode (LED) chip packaging, wire bonding is an important process that connects the LED chip on the lead frame pad with the Au wire and enables electrical operation for the next process. The wire bonding process is divided by two types: thermo compression bonding and ultrasonic bonding. Generally, the wire bonding process consists of three steps: 1st ball bonding that bonds the shape of the ball on the LED chip electrode, looping process that hangs the wire toward another connecting part with a loop shape, and 2nd stitch bonding that forms and bonds to another electrode. This study analyzed the factors affecting the LED die bonding processes to optimize the process capability that bonds a small Zener diode chip on the PLCC (plastic-leaded chip-carrier) LED package frame, and then applied response surface analysis. The design of experiment (DOE) was established considering the five factors, three levels, and four responses by analyzing the factors. As a result, the optimal conditions that meet all the response targets can be derived.

• Proceedings of the KIEE Conference
• /
• 2002.11a
• /
• pp.197-199
• /
• 2002

This paper describes the effects of chip arrangement configurations and the dimension of a reflecting cup upon the light output characteristics of a white lamp composed of RGB LED chips. As a result of simulation, the shorter distance between adjacent chips leads to a relative decrease in the light output efficiency due to inter-chip absorption of quanta, but rather uniform color mixing is expected. Among the factors of designing a reflecting cup it is the tilt angle of the cup wall that plays a determining role upon the variation of the light distribution. The light distribution shows a sudden change of pattern from Lambertian to Batwing at about $35^{\circ}{\sim}40^{\circ}$ of tilt angle in case of a silver-coated wall cup.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2007.11a
• /
• pp.457-458
• /
• 2007

We investigated a resistor network model for the horizontal AlInGaN LED. Adding the proposed current density dependent relative quantum efficiency, the power simulation can be also obtained. Comparing the simulation and the measurement results for the LED with the size of $350{\mu}m$, the model is reasonable to simulate the forward voltage and the light output power. Using this model we investigated the optimization of the position and the number of the finger electrodes in a given chip area. It shows that the center disposition of the p-finger electrode in p-area is optimal for the voltage and best for the power. And the minimum number of the n-finger electrodes is best for the power.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.14 no.6
• /
• pp.2624-2630
• /
• 2013

In LED chip packaging, die bonding is a very important process which fixes the LED chip on the lead flame to provide enough strength for the next process. During the process, inspection processes are very important to detect exact locations of dispensed epoxy dots and to determine bonding status of dies whether they are lies at exact positions with sufficient bonding strength. In this study, a useful machine vision based inspection system is proposed for the LED die bonder. In the proposed system, 2 cameras are used for epoxy dot position detection and 2 cameras are sued for die attaching status determination. New vision processing algorithm is proposed, and its efficiency is verified through required field experiments. Measured position error is less than $X:-29{\mu}m$, $Y:-32{\mu}m$ and rotation error:$3^{\circ}$ using proposed vision algorithm. It is concluded that the proposed machine vision based inspection system can be successfully implemented on the developed die bonding system.

• Transactions on Electrical and Electronic Materials
• /
• v.15 no.2
• /
• pp.66-68
• /
• 2014

Most commercial white LED lamps use blue chip coated with yellow emitting phosphor. The use of blue excitable red and green phosphors is expected to improve the CRI. Several phosphors, such as $SrGa_2S_4:Eu^{2+}$ and $(Sr,Ba)SiO_4:Eu^{2+}$, have been suggested in the past as green components. However, there are issues of the sensitivity and stability of such phosphors. Here, we describe gallium substituted $YAG:Ce^{3+}$ phosphor, as a green emitter. YAG structures are already accepted by the industry, for their stability and efficiency. LEDs with improved CRI could be fabricated by choosing $Y_3Al_4GaO_{12}:Ce^{3+}$ (green and yellow), and $SrS:Eu^{2+}$ (red) phosphors, along with blue chip. Also, the effect of a slight change in chip wavelength is studied, for two phosphor-coated w-LEDs. The reduction in particle size of the coated phosphors also gives improved w-LED characteristics.

• Journal of the Microelectronics and Packaging Society
• /
• v.25 no.4
• /
• pp.149-154
• /
• 2018

This paper describes the fabrication and heat transfer property of 50 watts rated LED array module where multiple chips are mounted on chip-on-board type ceramic-metal hybrid substrate with high heat dissipation property for high power street and anti-explosive lighting system. The high heat transfer ceramic-metal hybrid substrate was fabricated by conformal coating of thick film glass-ceramic and silver pastes to form insulation and conductor layers, using thick film screen printing method on top of the high thermal conductivity aluminum alloy heat-spreading panel, then co-fired at $515^{\circ}C$. A comparative LED array module with the same configuration using epoxy resin based FR-4 PCB with thermalvia type was also fabricated, then the thermal properties were measured with multichannel temperature sensors and thermal resistance measuring system. As a result, the thermal resistance of the ceramic-metal hybrid substrate in the $4{\times}9$ type LEDs array module exhibited about one third to the value as that of FR-4 substrate, implying that at least triple performance of heat transfer property as that of FR-4 substrate was realized.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.13 no.8
• /
• pp.3301-3306
• /
• 2012

In LED chip packaging, die bonding is a very important process which fixes the LED chip on the lead frame to provide enough strength for the next process. Conventional pick-up device of the die bonder is simply operated by up and down motion of a collet and an ejector pin. However, this method may cause undesired problems such as position misalignment and/or severe die damage when the pick-up device reaches the die. In this study, to minimize the position alignment error and die damage, a die bonder is developed by adopting a new pick-up head for precise alignment and high speed feeding. To evaluate structural stability of the designed system, required finite element model of the die bonder is generated, and structural analysis is performed. Vibration analysis of the pick-up head is also performed using developed finite element model at operation frequency range. As a result of the analysis, deformation, stress, and natural frequency of the die bonder are investigated.

• Journal of the Korean Society of Fisheries and Ocean Technology
• /
• v.51 no.2
• /
• pp.163-170
• /
• 2015

Recently LED fish-attracting lamps have been more widely used in fisheries as low-cost and high-efficiency fishing gear, and development of long-life high-efficiency lamps is required through the design of LED packages to optimize heat resistance. This study developed an improved LED fish-attracting lamp with excellent heat performance, which was verified using a numerical model. Heat-resistance design factors such as the heat-radiation fin shape, PCB type, and LED chip count were investigated and optimized. Comparison with a commercial 180-W LED fishing lamp showed that the increase in initial temperature was 40% higher than that of the surrounding LED chip because of design errors in contact thermal resistance. The 250-W LED lamp developed in this study has a characteristic with thermal rising in linearly stable according to the heat source. In addition, luminance efficiency was improved by 20-65% by using flow-visualization simulation. A decrease of 45% in total power consumption with a fuel-cost reduction of over 55% can be expected when using these optimized heat release design factors.

• Korean Journal of Optics and Photonics
• /
• v.24 no.6
• /
• pp.342-346
• /
• 2013

We present the thermal analysis result of die bonding for a high power LED package using a metal hybrid silicone adhesive structure. The simulation structure consists of an LED chip, silicone die adhesive, package substrate, silicone-phosphor encapsulation, Al PCB and a heat-sink. As a result, we demonstrate that the heat generated from the chip is easily dissipated through the metal structure. The thermal resistance of the metal hybrid structure was 1.662 K/W. And the thermal resistance of the total package was 5.91 K/W. This result is comparable to the thermal resistance of a eutectic bonded LED package.