• 제목/요약/키워드: LCD Glass

검색결과 294건 처리시간 0.04초

Investigation of Dark Spots Occurred in Plastic LCDs.

  • Park, Seo-Kyu;Min, Kwan-Sik;Choi, Man-Seob;Im, Jang-Soon;Woo, Sung-Il;Kwon, Soon-Bum
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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    • pp.524-527
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    • 2003
  • Plastic LCDs have remarkable advantages as compared to glass LCDs, but there still exist reliability issue. Regarding the reliability issue of plastic LCDs, we investigated the phenomena of dark spots that often occurred in plastic LCDs. It was recognized that dark spots are mainly caused by air bubbles that are induced from outside of LCD panel due to cell volume change with external stress and incomplete encapsulation. We have found that cell gap uniformity, spacer density and size and film deformation are important factors influencing dark spot behavior. In this paper, we discuss the phenomena and origin of dark spots in plastic LCDs

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Chip on Glass Technologies for High-Performance LCD Applications

  • Kim, Young-Ho
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2002년도 International Symposium
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    • pp.203-215
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    • 2002
  • Using eutectic In-Ag and Bi-Sn solder materials, we developed the COG technique having a minimum pitch of 50 ${\mu}{\textrm}{m}$. The maximum temperature in this process is $160^{\circ}C$. We fabricated spherical and uniform solder bumps by controlling the microstructure of Bi-Sn solder bumps. The contact resistances of Bi-Sn solder joints were 19 m$\Omega$ at $80{\mu}{\textrm}{m}$ pitch and 60 m$\Omega$ at $80{\mu}{\textrm}{m}$ pitch, respectively. These values are much lower than the contact resistance of the conventional ACF bonding. The contact resistances of the solder joint are almost the same before and after the underfill process. The contact resistance of the underfilled Bi-Sn solder joint did not change even after reliability test.

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직병렬 유도결합형 안테나를 이용한 대면적 플라즈마 소스 연구

  • 김봉주;이승걸;오범환;이일항;박세근
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2002년도 하계종합학술대회 논문집(2)
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    • pp.201-204
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    • 2002
  • A large area inductively coupled plasma which is applicable to LCD processing is built with a modified single loop RF antenna. Combination of parallel and series paths of RF current through the antenna induces local enhancement of plasma density, which in turn provides uniform plasma density near the substrate. The plasma density distribution is measured and compared with that of the conventional single loop antenna. Aisotropic etching of photoresist is performed, and it is found that etch uniformity is improved by 3% from 15% of the conventional etcher over 350$\times$300mm glass substrates. Photoresist etching rate and uniformity can be further improved by applying a periodic weak axial magnetic fieid.

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Characteristics of Ag Etching using Inductively Coupled Halogen-based Plasmas

  • Park, Sang-Duk;Lee, Young-Joon;Kim, Sang-Gab;Choe, Hee-Hwan;Hong, Moon-Poe;Yeom, Geun-Young
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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    • pp.860-863
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    • 2002
  • In this study, Ag thin films deposited on LCD-grade glass were etched using inductively coupled fluorine-based plasmas and the effect of various $CF_4$-based gas mixtures on the Ag etching characteristics were studied. When $CF_4$-based gas mixtures were used with $N_2$, due to the very low vapor pressure of etch products, etch products remained on the substrate after the etching. However, when $CF_4$ used with Ar, residue-free Ag etching could be obtained due to the removal of etch product by sputtering by $Ar^+$ ions.

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자외선 레이저를 이용한 폴리머 박막 가공의 수치해석 (Numerical Analysis of UV Laser Patterning of Polymeric Thin-Film)

  • 오부국;이승기;송민규;김종원;홍순국
    • 한국레이저가공학회지
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    • 제12권4호
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    • pp.1-5
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    • 2009
  • Conventional patterning based on wet-process for multi-layered film is a relatively complex and costly process though it is a necessary step for fabrication of TFT-LCD module. Recently, a direct pattering by laser has been studied because it is low cost and simple process compared to the wet process. In this work, the selective removal process of multi-layered film (polyimide/indium tin oxide/glass) is studied by modeling the thermal and mechanical behavior for multi-layered structure. Especially, the effects of thickness of polyimide layer are examined.

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브라운가스를 이용한 유리접합법에 관한 연구 (A Study on the Glass Sealing for a Brown Gas Heat Source)

  • 이종곤;이종선;전의식
    • 한국산학기술학회:학술대회논문집
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    • 한국산학기술학회 2008년도 추계학술발표논문집
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    • pp.439-441
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    • 2008
  • LCD, PDP 공정에서 사용하는 유리접합법은 유리용 본드를 사용하는 방법을 사용하고 있다. 그러나 접합부의 내구성 증대 및 경제성을 고려하기 위한 유리접합 방법의 고안이 필요하다. 본 논문에서는 전기로 안에서 유리용접을 수행하기 위한 공정변수를 실험적으로 도출하여 유리를 접합하는 방안을 제시하고자 한다. 이를 위하여 유리용접에 필요한 이송기와 유리용접 전기로, 브라운 가스 발생기, 브라운 가스 토치를 사용하였으며, 유리용접 공정변수인 토치의 이송속도, 전기로의 공정온도, 토치와 유리모재사이의 거리를 측정하여 분석하였다.

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Wide Viewing Angle Screen Design of High Definition LCD Projection System

  • Na, Man-Ho;Moon, Hee-Jong;Lee, Han-Bae;Park, Man-Hyo;Park, Myung-Ho
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2000년도 제1회 학술대회 논문집
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    • pp.161-162
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    • 2000
  • We propose multi-layer aspheric lenticular lens for rear projection screen to provide wide viewing angle. Each pitch of lenticular lens sheet is divided by three region and image light from projection optical system is propagated widely on each region due to different focal point. Besides, to improve vertical viewing angle of screen, we propose glass bead embedded screen on observer side of lenticular lens.

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과열 수증기를 이용한 세정 시스템 설계 (Cleaning System Design using Supper Heating Steam)

  • 조도현
    • 전자공학회논문지 IE
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    • 제48권2호
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    • pp.47-51
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    • 2011
  • 본 논문은 LCD등에 사용되는 유리기판 가공 과정에서 표면에 발생하는 이물질을 제거하기 위한 세정 시스템을 제안한다. 이 세정 공정 시스템은 알카리 전해수의 화학적 세정과 과열 수증기 시스템의 물리적 세정방법을 사용한 세정, 린스, 건조 공정으로 구성된다. 또한 세정 시스템에서 사용되는 알카리 전해수의 화학적 세정효과를 실험을 통해, 알카리 전해수의 세정 효과와 과열 수증기 시스템의 제거효과를 보인다.

Technology Trend and Requirement of Mobile Displays Using Low-Temperature Poly-Si (LTPS) Technologies

  • Kwon, Oh-Kyong
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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    • pp.409-412
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    • 2007
  • A lot of research for system-on-panel(SOP) have been done to integrate display systems including data driver, gate driver, timing controller, DC-DC converter, and smart functions such as embedded touch screen, ambient brightness sensing and luminance control, finger printing on the glass. Recently, the cost of an one-chip driver IC with various functions has decreased rapidly, and new mobile display interface technologies have been introduced. So it is necessary to examine the feasibility of SOP for practical mobile applications. In this paper, we will re-examine LTPS technologies for mobile displays in terms of various aspects and discuss the practical limitations on SOP technology and future technology trend of mobile displays.

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Buffered Oxide Etch 세정에 의한 다결정 실리콘 TFT의 전기적 특성 개선 (Improvement of the Electrical Characteristics of a Polysilicon TFT Using Buffered Oxide Etch Cleaning)

  • 남영묵;배성찬;최시영
    • 대한전자공학회논문지SD
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    • 제41권8호
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    • pp.31-36
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    • 2004
  • 본 논문에서는 UV 처리와 BOE 세정을 이용하여 레이저 어닐링 전의 실리콘 표면에 자연 산화막을 제거하여 다결정 실리콘 TFT의 신뢰성을 향상시키는 방법을 제안하였다. 전처리 공정이 다결정 실리콘의 표면 거칠기에 미치는 영향을 AFM으로 측정하였으며, 다결정 실리콘 TFT의 전기적 특성인 스위칭 특성과 항복특성을 대형 유리기판의 위치와 전처리의 유무에 대해서 조사하였다.