• 한국정보디스플레이학회:학술대회논문집
• /
• 2003.07a
• /
• pp.524-527
• /
• 2003

Plastic LCDs have remarkable advantages as compared to glass LCDs, but there still exist reliability issue. Regarding the reliability issue of plastic LCDs, we investigated the phenomena of dark spots that often occurred in plastic LCDs. It was recognized that dark spots are mainly caused by air bubbles that are induced from outside of LCD panel due to cell volume change with external stress and incomplete encapsulation. We have found that cell gap uniformity, spacer density and size and film deformation are important factors influencing dark spot behavior. In this paper, we discuss the phenomena and origin of dark spots in plastic LCDs

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2002.09a
• /
• pp.203-215
• /
• 2002

Using eutectic In-Ag and Bi-Sn solder materials, we developed the COG technique having a minimum pitch of 50 ${\mu}{\textrm}{m}$. The maximum temperature in this process is $160^{\circ}C$. We fabricated spherical and uniform solder bumps by controlling the microstructure of Bi-Sn solder bumps. The contact resistances of Bi-Sn solder joints were 19 m$\Omega$ at $80{\mu}{\textrm}{m}$ pitch and 60 m$\Omega$ at $80{\mu}{\textrm}{m}$ pitch, respectively. These values are much lower than the contact resistance of the conventional ACF bonding. The contact resistances of the solder joint are almost the same before and after the underfill process. The contact resistance of the underfilled Bi-Sn solder joint did not change even after reliability test.

• Proceedings of the IEEK Conference
• /
• 2002.06b
• /
• pp.201-204
• /
• 2002

A large area inductively coupled plasma which is applicable to LCD processing is built with a modified single loop RF antenna. Combination of parallel and series paths of RF current through the antenna induces local enhancement of plasma density, which in turn provides uniform plasma density near the substrate. The plasma density distribution is measured and compared with that of the conventional single loop antenna. Aisotropic etching of photoresist is performed, and it is found that etch uniformity is improved by 3％ from 15% of the conventional etcher over 350$\times$300mm glass substrates. Photoresist etching rate and uniformity can be further improved by applying a periodic weak axial magnetic fieid.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2002.08a
• /
• pp.860-863
• /
• 2002

In this study, Ag thin films deposited on LCD-grade glass were etched using inductively coupled fluorine-based plasmas and the effect of various $CF_4$-based gas mixtures on the Ag etching characteristics were studied. When $CF_4$-based gas mixtures were used with $N_2$, due to the very low vapor pressure of etch products, etch products remained on the substrate after the etching. However, when $CF_4$ used with Ar, residue-free Ag etching could be obtained due to the removal of etch product by sputtering by $Ar^+$ ions.

• Laser Solutions
• /
• v.12 no.4
• /
• pp.1-5
• /
• 2009

Conventional patterning based on wet-process for multi-layered film is a relatively complex and costly process though it is a necessary step for fabrication of TFT-LCD module. Recently, a direct pattering by laser has been studied because it is low cost and simple process compared to the wet process. In this work, the selective removal process of multi-layered film (polyimide/indium tin oxide/glass) is studied by modeling the thermal and mechanical behavior for multi-layered structure. Especially, the effects of thickness of polyimide layer are examined.

• Proceedings of the KAIS Fall Conference
• /
• 2008.11a
• /
• pp.439-441
• /
• 2008

LCD, PDP 공정에서 사용하는 유리접합법은 유리용 본드를 사용하는 방법을 사용하고 있다. 그러나 접합부의 내구성 증대 및 경제성을 고려하기 위한 유리접합 방법의 고안이 필요하다. 본 논문에서는 전기로 안에서 유리용접을 수행하기 위한 공정변수를 실험적으로 도출하여 유리를 접합하는 방안을 제시하고자 한다. 이를 위하여 유리용접에 필요한 이송기와 유리용접 전기로, 브라운 가스 발생기, 브라운 가스 토치를 사용하였으며, 유리용접 공정변수인 토치의 이송속도, 전기로의 공정온도, 토치와 유리모재사이의 거리를 측정하여 분석하였다.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2000.01a
• /
• pp.161-162
• /
• 2000

We propose multi-layer aspheric lenticular lens for rear projection screen to provide wide viewing angle. Each pitch of lenticular lens sheet is divided by three region and image light from projection optical system is propagated widely on each region due to different focal point. Besides, to improve vertical viewing angle of screen, we propose glass bead embedded screen on observer side of lenticular lens.

• 전자공학회논문지 IE
• /
• v.48 no.2
• /
• pp.47-51
• /
• 2011

In this paper, we propose the cleaning process system to remove micro-particles, various impurities, unnecessary residues, etc. for liquid crystal display manufacturing processes. This system is structured with cleaning, rinse and drying process using the chemical cleaning of alkaline water and the physical cleaning of SHS(supper heating steam). And we shows cleaning effects of alkaline water and remove effects of SHS.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2007.08a
• /
• pp.409-412
• /
• 2007

A lot of research for system-on-panel(SOP) have been done to integrate display systems including data driver, gate driver, timing controller, DC-DC converter, and smart functions such as embedded touch screen, ambient brightness sensing and luminance control, finger printing on the glass. Recently, the cost of an one-chip driver IC with various functions has decreased rapidly, and new mobile display interface technologies have been introduced. So it is necessary to examine the feasibility of SOP for practical mobile applications. In this paper, we will re-examine LTPS technologies for mobile displays in terms of various aspects and discuss the practical limitations on SOP technology and future technology trend of mobile displays.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.41 no.8
• /
• pp.31-36
• /
• 2004

we developed a technique to manufacture more reliable polycrystalline silicon TFT-LCDs using UV cleaning and buffered oxide etch(BOE) cleaning which remove the native oxide of the silicon surface before laser annealing. To investigate the effects of pre-treatments on the surface roughness of polycrystalline silicon, we measured atomic force microscopy(AFM). Also the electrical characteristics of polysilicon TFTs, breakdown characteristic and switching Performance, were tested for various pre-treatment conditions and several locations in large glass substrate.