• Journal of IKEEE
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• v.25 no.2
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• pp.280-284
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• 2021

In this paper, a new ESD protection circuit is proposed to improve the snapback characteristics. The proposed a new structure ESD protection circuit applying the conventional SCR structural change and stack structure. The electrical characteristics of the structure using penta-well and double trigger were analyzed, and the trigger voltage and holding voltage were improved by applying the stack structure. The electron current and total current flow were analyzed through the TCAD simulation. The characteristics of the latch-up immunity and excellent snapback characteristics were confirmed. The electrical characteristics of the proposed ESD protection circuit were analyzed through HBM modeling after forming a structure through TCAD simulator.

• Journal of Semiconductor Engineering
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• v.3 no.2
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• pp.161-167
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• 2022

Electrical characteristics of LDMOS power device with LDD(Lightly Doped Drain) structure is studied with variation of the region of channel and LDD. The channel in LDMOSFET encloses a junction-type source and is believed to be an important parameter for determining the circuit operation of CMOS inverter. Two-dimensional TCAD MEDICI simulation is used to study hot-carrier effect, on-resistance Ron, breakdown voltage, and transient switching characteristic. The voltage-transfer characteristics and on-off switching properties are studied as a function of the channel length and doping levels. The digital logic levels of the output and input voltages are analyzed from the transfer curves and circuit operation. Study indicates that drain current significantly depends on the channel length rather than the LDD region, while the switching transient time is almost independent of the channel length. The high and low logic levels of the input voltage showed a strong dependency on the channel length, while the lateral substrate resistance from a latch-up path in the CMOS inverter was comparable to that of a typical CMOS inverter with a guard ring.

• Journal of IKEEE
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• v.26 no.1
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• pp.119-123
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• 2022

This paper propose a new ESD protection device suitable for 12V class applications by adding a self-biasing structure to an ESD protection device with high holding voltage due to additional parasitic bipolar BJT. To verify the operating principle and electrical characteristics of the proposed device, current density simulation and HBM simulation were performed using Synopsys' TCAD Simulation, and the operation of the additional self-biasing structure was confirmed. As a result of the simulation, it was confirmed that the proposed ESD protection device has a higher level of holding voltage compared to the existing ESD protection device. It is expected to have high area efficiency due to the dual structure and sufficient latch-up immunity in 12V-class applications.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.10
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• pp.499-508
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• 2016

Injection molding is a method for manufacturing many products, wherein a plasticized resin is injected into a mold at high pressure and hardened. According to the method, the product can be manufactured into various forms, and the mass production of up to tens of thousands of products is possible. The purpose of this study was to determine the process conditions for manufacturing a door latch for automobiles, through an analysis of the injection molding method. To calculate an appropriate injection flow for injection molding, a primary analysis for comparing the injection time, pressure, flow pattern, consolidation range, shear stress, shear rate, and weld line, as well as a secondary analysis for determining the conditions for stabilizing the molding temperature, holding pressure, and cooling process, were conducted. The characteristics of injection molding, and their influence on the product quality are discussed. No weld line and pores were observed on the products that had been manufactured based on the process conditions determined above. In addition, there were no flaws regarding the deformation compared to the prototype. Therefore, the manufacture of a product under the conditions determined in this study can reduce the defect rate compared to the existing production, and the process is also more competitive due to reduced production time.

• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.145-148
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• 2000

A 16bit asynchronous multiplier has been designed using micropipelind structure with 2 phase and data bundling. And 4-radix modified Booth algorithm, CPlatch(Cature-Pass latch) and modified 4-2 counters have adopted in this design. It is implemented in 0.65$\mu\textrm{m}$ double-poly/double-metal CMOS technology by using 12,074 transistors with core size of 1.4${\times}$1.8$\textrm{mm}^2$. And our design results in a computation rate 55MHz a supply voltage of 3.3V.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.7
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• pp.32-37
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• 1993

A novel insulated gate bipolar transister (IGBT), called insulated trench cathode IGBT (ISTC-IGBT), is proposed. ISTC-IGBT has a trenched well with the shallow P$^{+}$ juction in the conventional IGBT structure. The proposed structure has the capability of effectively suppressing the parasitic thyristor latchup. The holding current of ISTC-IGBT is about 2.2 times greater than that of the conventional IGBT. Detailed analysis of the latchup characteristics of ISTC-IGBT is performed by using the two-dimensional device simulator, PISCES-II B.

• Proceedings of the IEEK Conference
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• 1998.06a
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• pp.445-448
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• 1998

본 논문은 triple-well과 twin-well에서의 고에너지 이온주입 에너지와 도즈량 변화에 따른 래치업 특성을 비교하였다. 공정시뮬레이터인 ATHENA로 소자를 제작하고 도핑프로파일 형태와 구조를 조사한 후, 래치업 특성은 소자 시뮬레이터인 ATLAS를 이용하였다. triple-well 공정이 마스크 스텝수를 줄이고, 이온주입 후 열처리시간을 단축하며 별도의 열처리 공정없이 도핑르로파일을 넓은 형태로 분포시켜 래치업 면역특성이 매우 좋은 결과를 얻었다.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1469-1471
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• 2001

A Dual Channel Trench IGBT (Insulated Gate Bipolar Transistor) is proposed to improve the latch-up characteristics. Simulation results by MEDICI have shown that the latching current density of proposed device was found to be 2850 A/$cm^2$ while that of conventional device was 1610 A/$cm^2$. The latching current desity of the proposed strucutre was 77.02% higher than that of conventional structre.

• Proceedings of the IEEK Conference
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• 2002.06b
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• pp.197-200
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• 2002

In this paper, presents a 1.8V 8-bit 300MSPS CMOS Subranging Analog to Digital Converter (ADC) with a novel reference multiplex is described. The proposed hか converter is composed of Sub A/D Converter block, MUX (Multiplexer) block and digital block. In order to obtain a high-speed operation, further, a novel dynamic latch, an encoder of novel algorithm and a MUX block are proposed. As a result, this A/D Converter is operated 100MHz input frequence by 300MHz sampling rate.

• Proceedings of the Korea Society for Industrial Systems Conference
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• 2002.06a
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• pp.195-199
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• 2002

This paper describes the effect of substrate back bias of CMOS Inverter. When the substrate back bias applied in body, the MOS transistor threshold voltage increased and drain saturation current decreased. The back gate reverse bias or substrate bias has been widely utilized and the following advantage has suppressing subthreshold leakage, lowering parasitic junction capacitance, preventing latch up or parasitic bipolar transistor, etc. When the reverse voltage applied substrate, this paper stimulated the propagation delay time CMOS inverter.