• 마이크로전자및패키징학회지
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• 제9권3호
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• pp.1-6
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• 2002

A low temperature process technology of copper thin films has been developed by a chemical vapor deposition technology for multi-level metallzations in ULSI fabrication. The copper films were deposited on TiN/Si substrates in helium atmosphere with the substrate temperature between $130^{\circ}C$ and $250^{\circ}C$. In order to get more reliable metallizations, effects on the post-annealing treatment to the electrical properties of the copper films have been investigated. The Cu films were annealed at the $5 \times10^{-6}$ Torr vacuum condition and the electrical resistivity and the nano-structures were measured for the Cu films. The electrical resistivity of Cu films shown to be reduced by the post-annealing. The electrical resistivity of 2.0 $\mu \Omega \cdot \textrm{cm}$ was obtained for the sample deposited at the substrate temperature of $180^{\circ}C$ after vacuum annealed at $300^{\circ}C$. The resistivity variations of the films was not exactly matched with the size of the nano-structures of the copper grains, but more depended on the contamination of the copper films.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.180-182
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• 2002

Copper thin films are prepared by a chemical vapor deposition technology for multi-level metallzations in ULSI fabrication. The copper films were deposited on TiN/Si substrates in helium atmosphere with the substrate temperature between $120^{\circ}C$ and $300^{\circ}C$. In order to get more reliable metallizations, effects on the post-annealing treatment to the electrical properties of the copper films have been investigated. The Cu films were annealed at the $5\times$10^{-6}$ Torr vacuum condition, and the electrical resistivity and the nano-structures were measured for the Cu films. The electrical resistivity of Cu films shown to be reduced by the post-annealing. The electrical resistivity of 2.2 $\mu$$\Omega$.cm was obtained for the sample deposited at the substrate temperature of $180^{\circ}C$ after vacuum annealed at $300^{\circ}C$. The resistivity variations of the films was not exactly matched with the size of the nato-structures of the copper grains, but more depended on the deposition temperature of the copper films.

• 한국표면공학회지
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• 제48권2호
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• pp.50-55
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• 2015

$Al_2O_3$ thin films were deposited on the moth eye anti-reflective nanostructured polycarbonate films by atomic layer deposition (ALD) techniques. Without ALD-$Al_2O_3$ thin films, moth eye anti-reflective nanostructured films had a high optical transmittance of 95.47% at a wavelength of 550 nm and a very poor hardness of 0.1381 GPa. With increasing the thickness of $Al_2O_3$ thin films from 5 to 25 nm, the transmittance of moth eye anti-reflective nanostructured films was gradually decreased from 94.94 to 93.12%. On the other hand, the hardness of the films was greatly increased from 0.3498 to 0.7806 GPa with increasing the thickness of $Al_2O_3$ thin films. This result shows that ALD thin films can be applied to improve mechanical properties with an adequate optical transmittance of the conventional moth eye anti-reflection nanostructure films.

• 대한금속재료학회지
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• 제48권10호
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• pp.884-892
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• 2010

To modify the physical properties of Cu thin films, gelatin is generally used as an additive. In this study, we assessed the effect of gelatin on the mechanical properties of electrodeposited Cu films. For this purpose, Cu/gelatin composite films were fabricated by adding 100 ppm of gelatin to an electrolyte, and tension and indentation tests were then performed. Additional tests based on pure Cu films were also performed for comparison. The Cu films containing gelatin presented a smaller grain size compared to that of pure Cu films. This increased the hardness of the Cu films, but addition of gelatin did not significantly affect the elastic modulus of the films. Cu films prepared at room temperature showed no significant change in the yield strength and tensile strength with an addition of gelatin, but we observed a dramatic decrease in the elongation. In contrast, Cu films prepared at $40^{\circ}C$ with gelatin presented a significant increase in the yield strength and tensile strength after the addition of gelatin. Elongation was not affected by adding gelatin. Presumably, the results would be closely related to the preferred orientation of the Cu thin film with the addition of gelatin and at temperatures that lead to a change in the microstructure of the Cu thin films.

• 전자공학회논문지A
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• 제32A권1호
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• pp.179-184
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• 1995

Phosphorous was deped in silicon thin films by Ion Mass Doping and Changes in the electrical resistance with respect tko heat treatments were investigated. SOI(Silicon On Insulator) thin films which contain few grain boundaries prepared by ZMR(Zone Melting Recrystallization) of polysilicon films, polysilicon films which have about 1500 $A^{\rarw}$ of grain size prepared by LPCVD at 625.deg. C, and amorphous silicon thin films prepared by LPCVD at low temperature were used as substrates and thermal behavior of phosphorous after RTA(Rapid Thermal Annealing) and furnace annealing was carefully studied. Amorphous thin films showed about 10$^{6}$ .OMEGA./ㅁbefore any heat treatment, while polycrystalline and SOI films about 10$^{3}$.OMEGA./¤. All these films, however, showed about 10.OMEGA./ㅁafter furnace annealing at 700.deg. C for 3hrs and RTA showed about the same trend. Films with grain boundaries showed a certain range of heat treatment which rendered increase of the electrical resistance upon annealing, which could not be observed in amorphous films and segregation of doped phosphorous by diffusion with annealing was thought to be responsible for this abnormal behavior.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.103-108
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• 2000

The texture of Al/Ti thin films deposited on low-dielectric polymer substrates has been investigated. Fifty-nm-thick Ti films and 500-nm-thick Al-1%Si-0.5%Cu (wt%) films were deposited sequentially onto low-k polymers and SiO$_2$ by using a DC magnetron sputtering system. The texture of Al thin film was determined using X-ray diffraction (XRD) theta-2theta ($\theta$-2$\theta$) and rocking curve and the microstructure of Al/Ti films on low-k polymer and SiO$_2$ substrates was characterized by Transmission electron microscopy (TEM). hall thin films deposited on SiO$_2$ had stronger texture than those deposited on low-k polymer. The texture of Al thin films strongly depended on that of Ti films. Cross-sectional TEM resealed that Brains of Ti films on SiO$_2$ substrates had grown perpendicular to the substrate, while the grains of Ti films on SiLK substrates were farmed randomly. The lower degree of 111 texture of Al thin films on low-k polymer was due to Ti underlayer.

• Transactions on Electrical and Electronic Materials
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• 제12권3호
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• pp.110-114
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• 2011

Polymeric films of high chemical stability and mechanical strength covered with a thin metallic film have been extensively used in various fields as electric and electronic materials. In this study, we have chosen polypropylene (PP) as the polymer due to its outstanding chemical resistance and good creep resistance. We coated thin nickel film on PP films by the electroless plating process. The surfaces of PP films were pre-treated and modified to increase the adhesion strength of metal layer on PP films, prior to the plating process, by an environment-friendly process with atmospheric plasma generated using dielectric barrier discharges in air. The surface morphologies of the PP films were observed before and after the surface modification process using a scanning electron microscope (SEM). The static contact angles were measured with deionized water droplets. The cross-sectional images of the PP films coated with thin metal film were taken with SEM to see the combined state between metallic and PP films. The adhesion strength of the metallic thin films on the PP films was confirmed by the thermal shock test and the cross-cutting and peel test. In conclusion, we made a composite material of metallic and polymeric films of high adhesion strength.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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• pp.448-451
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• 2007

DuPont Teijin $Films^{TM}$ (DTF) have developed engineered substrates specifically for the flexible electronics market. $Teonex^{(R)}$ Q65, $Melinex^{(R)}$ ST506 and ST504 are biaxially oriented crystalline polyesters with the option of planarised surfaces. These films are emerging as competitive materials for the base substrate in OLED displays and active matrix backplanes. Given the demanding dimensional reproducibility requirements in the display applications, it is critical to control the several factors that can influence the film distortion in order to achieve the ultimate performance. This paper will discuss the impact of thermal stress, mechanical stress and the processing environment on dimensional reproducibility of polyester film and give examples of how this impacts on the film in device manufacture.

• 반도체디스플레이기술학회지
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• 제9권3호
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• pp.41-45
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• 2010

The ZnO thin films doped with Ga(GZO) and both Ga and Ge(GZO:Ge) were deposited on glass substrate by using RF sputtering system respectively. Structural, morphological and optical properties of the films deposited in the same condition were investigated. Structural properties of the films were investigated by Field Emission Scanning Electron Microscopy, FE-SEM images and X-ray diffraction, XRD analysis. These studies showed shape of films' surface and direction of film growth respectively. It's showed that all films were deposited by vertical orientation strongly. It can be confirmed that all dopants of targets were included in deposited films by results of EDX analysis. UV-Vis spectrometer results showed that all samples had highly transparent characteristics in visible region and have similar 3.28~3.31 eV band gap. It was found that existence of all dopants by EDX analysis. Morphology and roughness of surface of each film were clearly shown by Atomic Force Microscopy, AFM images. It was found in this research that film doped with Ge more dense and stable with hardly any difference in gap energy compared to ZnO films.

• 보건교육건강증진학회지
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• 제31권2호
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• pp.27-40
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• 2014

Objectives: While cinema is regarded in the contemporary popular leisure activities, the presentation smoking scenes in films has not been fully studied. We investigated Korean box-office hit movies by using content analysis. Methods: We sampled fifty-one hit films played in Korean cinemas during the period 2000-2013. Here, a hit film is defined as a movie viewed by at least 5,000,000 audiences. Results: We found that 78.1% of the Korean hit films contained smoking scenes, whereas only 15.6% of the American hit films were so. Films with the more frequent number of smoking scenes could be lined up in the order of crime, thriller, and action genres (p<.05). Smoking actors were leading roles, hence attractive characters appealing to the audience. Moreover, the smoking rate of female characters in the films was determined to be 3.66 times greater than the actual smoking rate of females in reality. Conclusions: Smoking scenes are likely to affect the audiences' cognitive priming and/or social learning with respect to smoking. Therefore, it would be necessary to set a restriction standard to the frequency of smoking scenes to appear Korean films, and to consider it as an important factor in the assigning a screening grade to such films.