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A Re-configurable 0.8V 10b 60MS/s 19.2mW 0.13um CMOS ADC Operating down to 0.5V (0.5V까지 재구성 가능한 0.8V 10비트 60MS/s 19.2mW 0.13um CMOS A/D 변환기)

  • Lee, Se-Won;Yoo, Si-Wook;Lee, Seung-Hoon
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.45 no.3
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    • pp.60-68
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    • 2008
  • This work describes a re-configurable 10MS/s to 100MS/s, low-power 10b two-step pipeline ADC operating at a power supply from 0.5V to 1.2V. MOS transistors with a low-threshold voltage are employed partially in the input sampling switches and differential pair of the SHA and MDAC for a proper signal swing margin at a 0.5V supply. The integrated adjustable current reference optimizes the static and dynamic performance of amplifiers at 10b accuracy with a wide range of supply voltages. A signal-isolated layout improves the capacitor mismatch of the MDAC while a switched-bias power-reduction technique reduces the power dissipation of comparators in the flash ADCs. The prototype ADC in a 0.13um CMOS process demonstrates the measured DNL and INL within 0.35LSB and 0.49LSB. The ADC with an active die area of $0.98mm^2$ shows a maximum SNDR and SFDR of 56.0dB and 69.6dB, respectively, and a power consumption of 19.2mW at a nominal condition of 0.8V and 60MS/s.

Distributed Multi-view Video Coding Based on Illumination Compensation (조명보상 기반 분산 다시점 비디오 코딩)

  • Park, Sea-Nae;Sim, Dong-Gyu;Jeon, Byeung-Woo
    • Journal of the Institute of Electronics Engineers of Korea SP
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    • v.45 no.6
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    • pp.17-26
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    • 2008
  • In this paper, we propose a distributed multi-view video coding method employing illumination compensation for multi-view video coding. Distributed multi-view video coding (DMVC) methods can be classified either into a temporal or an inter-view interpolation-based ones according to ways to generate side information. DMVC with inter-view interpolation utilizes characteristics of multi-view videos to improve coding efficiency of the DMVC by using side information based on the inter-view interpolation. However, mismatch of camera parameters and illumination change between two views could bring about inaccurate side information generation. In this paper, a modified distributed multi-view coding method is presented by applying illumination compensation in generating the side information. In the proposed encoder system, in addition to parity bits for AC coefficients, DC coefficients are transmitted as well to the decoder side. By doing so, the decoder can generate more accurate side information by compensating illumination changes with the transmitted DC coefficients. We found that the proposed algorithm is $0.1{\sim}0.2\;dB$ better than the conventional algorithm that does not make use of illumination compensation.

A 12b 130MS/s 108mW $1.8mm^2$ 0.18um CMOS ADC for High-Quality Video Systems (고화질 영상 시스템 응용을 위한 12비트 130MS/s 108mW $1.8mm^2$ 0.18um CMOS A/D 변환기)

  • Han, Jae-Yeol;Kim, Young-Ju;Lee, Seung-Hoon
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.45 no.3
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    • pp.77-85
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    • 2008
  • This work proposes a 12b 130MS/s 108mW $1.8mm^2$ 0.18um CMOS ADC for high-quality video systems such as TFT-LCD displays and digital TVs requiring simultaneously high resolution, low power, and small size at high speed. The proposed ADC optimizes power consumption and chip area at the target resolution and sampling rate based on a three-step pipeline architecture. The input SHA with gate-bootstrapped sampling switches and a properly controlled trans-conductance ratio of two amplifier stages achieves a high gain and phase margin for 12b input accuracy at the Nyquist frequency. A signal-insensitive 3D-fully symmetric layout reduces a capacitor and device mismatch of two MDACs. The proposed supply- and temperature- insensitive current and voltage references are implemented on chip with a small number of transistors. The prototype ADC in a 0.18um 1P6M CMOS technology demonstrates a measured DNL and INL within 0.69LSB and 2.12LSB, respectively. The ADC shows a maximum SNDR of 53dB and 51dB and a maximum SFDR of 68dB and 66dB at 120MS/s and 130MS/s, respectively. The ADC with an active die area of $1.8mm^2$ consumes 108mW at 130MS/s and 1.8V.

Roles of i-SiC Buffer Layer in Amorphous p-SiC/i-SiC/i-Si/n-Si Thin Film Solar Cells (비정질 p-SiC/i-SiC/i-Si/n-Si 박막 태양전지에서 i-SiC 완충층의 역할)

  • Kim, Hyun-Chul;Shin, Hyuck-Jae;Lee, Jae-Shin
    • Korean Journal of Materials Research
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    • v.9 no.12
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    • pp.1155-1159
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    • 1999
  • Thin film solar cells on a glass/$SnO_2$ substrate with p-SiC/i-Si/n-Si heterojunction structures were fabricated using a plasma-enhanced chemical-vapor deposition system. The photovoltaic properties of the solar cells were examined with varying the gas phase composition, x=$CH_4/\;(SiH_4+CH_4)$, during the deposition of the p-SiC layer. In the range of x=0~0.4, the efficiency of solar cell increased because of the increased band gap of the p-SiC window layer. Further increase in the gas phase composition, however, led to a decrease in the cell efficiency probably due to in the increased composition mismatch at the p-SiC/i-Si layers. As a result, the efficiency of a glass/$SnO_2$/p-SiC/i-SiC/i-Si/n-Si/Ag thin film solar cell with $1cm^2$ area was 8.6% ($V_{oc}$=0.85V, $J_{sc}$=16.42mA/$cm^2$, FF=0.615) under 100mW/$cm^2$ light intensity.

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Role of Crystallographic Tilt Angle of GaAs Substrate Surface on Elastic Characteristics and Crystal Quality of InGaP Epilayers (GaAs 기판표면의 Tilt각도가 InGaP 에피막의 탄성특성 및 결정질에 미치는 영향)

  • 이종원;이철로;김창수;오명석;임성욱
    • Journal of the Microelectronics and Packaging Society
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    • v.6 no.1
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    • pp.1-10
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    • 1999
  • InGaP epilayers were grown on the flat, $2^{\circ}$off, $6^{\circ}$ off, and $10^{\circ}$off GaAs substrates by organo-metallic vapor phase epitaxy, and influences of crystallographic misorientation of the substrate on the structural and optical properties such as lattice mismatch, elastic strain, lattice curvature, misfit stress, and PL intensity /line-width were investigated in this study. Material characterizations were carried out by TXRD( tripple-axis x-ray diffractometer) and low temperature (11K) PL (photoluminescence). With increase of the substrate misorientation angle (S.M.A.), the relative incorporation of Ga atoms on the substrate surface was found to be enhanced. Also, with increase of the S. M. A., the x-ray line-width of the InGaP epilayer was reduced, indicating that the crystal quality of the epilayer could be improved tilth a misoriented substrate. It was also found that the elastic accommodation of the strain-free lattice misfit was more remarkable in a misoriented sample. PL intensity increased, and PL line-width and emission wavelength decreased with the increase of S. M. A. The results conclude that the elastic characteristics and the crystal quality of the InGaP epilayer could be remarkably enhanced when the misoriented substrates were employed.

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Numerical Study of Warpage and Stress for the Ultra Thin Package (수치해석에 의한 초박형 패키지의 휨 현상 및 응력 특성에 관한 연구)

  • Song, Cha-Gyu;Choa, Sung-Hoon
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.4
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    • pp.49-60
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    • 2010
  • Semiconductor packages are increasingly moving toward miniaturization, lighter and high performance. Futhermore, packages become thinner. Thin packages will generate serious reliability problems such as warpage, crack and other failures. Reliability problems are mainly caused by the CTE mismatch of various package materials. Therefore, proper selection of the package materials and geometrical optimization is very important for controlling the warpage and the stress of the package. In this study, we investigated the characteristics of the warpage and the stress of several packages currently used in mobile devices such as CABGA, fcSCP, SCSP, and MCP. Warpage and stress distribution are analyzed by the finite element simulation. Key material properties which affect the warpage of package are investigated such as the elastic moduli, CTEs of EMC molding and the substrate. Geometrical effects are also investigated including the thickness or size of EMC molding, silicon die and substrate. The simulation results indicate that the most influential factors on warpage are EMC molding thickness, CTE of EMC, elastic modulus of the substrate. Simulation results show that warpage is the largest for SCSP. In order to reduce the warpage, DOE optimization is performed, and the optimization results show that warpage of SCSP becomes $10{\mu}m$.

Understanding the Experience of Visual Change Detection Based on the Experience of a Sensory Conflict Evoked by a Binocular Rivalry (양안경합의 감각적 상충 경험에 기초한 시각적 변화탐지 경험에 대한 이해)

  • Shin, Youngseon;Hyun, Joo-Seok
    • Science of Emotion and Sensibility
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    • v.16 no.3
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    • pp.341-350
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    • 2013
  • The present study aimed to understand the sensory characteristic of change detection by comparing the experience of detecting a salient visual change against the experience of detecting a sensory conflict evoked by a binocular mismatch. In Experiment 1, we used the change detection task where 2, 4, or 6 items were short-term remembered in visual working memory and were compared with following test items. The half of change-present trials were manipulated to elicit a binocular rivalry on the test item with the change by way of monocular inputs across the eyes. The results showed that change detection accuracy without the rivalry manipulation declined evidently as the display setsize increased whereas no such setsize effect was observed with the rivalry manipulation. Experiment 2 tested search efficiency for the search array where the target was designated as an item with the rivalry manipulation, and found the search was very efficient regardless of the rivalry manipulation. The results of Experiment 1 and 2 showed that when the given memory load varies, the experience of detecting a salient visual change become similar to the experience of detecting a sensory conflict by a binocular rivalry.

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Effect of Non-Conducting Filler Additions on Anisotropic Conductive Adhesives(ACAs) Properties and the Reliability of ACAs Flip Chip on Organic Substrates (이방성 전도 접착제 물성과 유기 기판 플립 칩의 신뢰성에 미치는 비전도성 충진재의 영향)

  • Im, Myeong-Jin;Baek, Gyeong-Uk
    • Korean Journal of Materials Research
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    • v.10 no.3
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    • pp.184-190
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    • 2000
  • We investigated the effect of filler content on the thermo-mechanical properties of modified ACA composite materials by incorporation of non-conducting fillers and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACA s composites with different content of non-conducting fillers, differential scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechnical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

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Performance of Adaptive Maximum Torque Per Amp Control at Multiple Operating Points for Induction Motor Drives (유도전동기 드라이브에서의 단위전류당 최대토크적응 제어기의 다운전점에서의 성능 연구)

  • Kwon, Chun-Ki;Kong, Yong-Hae
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.19 no.3
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    • pp.584-593
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    • 2018
  • The highly efficient operation of induction motors has been studied in the past years. Among the many attempts made to obtain highly efficient operation, Maximum Torque Per Amp (MTPA) controls in induction motor drives were proposed. This method enables induction motor drives to operate very efficiently since it achieves the desired torque with the minimal stator current. This is because the alternate qd induction motor model (AQDM) is a highly accurate mathematical model to represent the dynamic characteristics of induction motors. However, it has been shown that the variation of the rotor resistance degrades the performance of the MTPA control significantly, thus leading to its failure to satisfy the maximum torque per amp condition. To take into consideration the mismatch between the actual value of the rotor resistance and its parameter value in the design of the control strategy, an adaptive MTPA control was proposed. In this work, this adaptive MTPA control is investigated in order to achieve the desired torque with the minimum stator current at multiple operating points. The experimental study showed that (i) the desired torque was accurately achieved even though there was a deviation of the order of 5% from the commanded torque value at a torque reference of 25 Nm (tracking performance), and (ii) the minimum stator current for the desired torque (maximum torque per amp condition) was consistently satisfied at multiple operating points, as the rotor temperature increased.

Efficient De-quantization Method based on Quantized Coefficients Distribution for Multi-view Video Coding (다시점 영상 부호화 효율 향상을 위한 양자화 계수 분포 기반의 효율적 역양자화 기법)

  • Park, Seung-Wook;Jeon, Byeong-Moon
    • Journal of Broadcast Engineering
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    • v.11 no.4 s.33
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    • pp.386-395
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    • 2006
  • Multi-view video coding technology demands the very high efficient coding technologies, because it has to encode a number of video sequences which are achieved from a number of video cameras. For this purpose, multi-view video coding introduces the inter-view prediction scheme between different views, but it shows a limitation of coding performance enhancement by adopting only new prediction method. Accordingly, we are going to achieve the more coding performance by enhancing dequantizer perfermance. Multi-view video coding is implemented basically based on H.264/AVC and uses the same quantization/de-quantization method as H.264/AVC does. The conventional quantizer and dequantizer is designed with the assumption that input residual signal follows the Laplacian PDF. However, it doesn't follow the fixed PDF type always. This mismatch between assumption and real data causes degradation of coding performance. To solve this problem, we propose the efficient de-quantization method based on quantized coefficients distribution at decoder without extra information. The extensive simulation results show that the proposed algorithm produces maximum $1.5\;dB{\sim}0.6\;dB$ at high bitrate compared with that of conventional method.