• Journal of Dental Rehabilitation and Applied Science
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• v.27 no.3
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• pp.253-265
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• 2011

When restoring endodontically treated teeth is the mismatch between fiber post size and post space diameter, the resin cement layer is excessively thick in post space and voids are likely to form in it, thus predisposing to de-bonding. The method to overcome this problem is to reline the fiber post with composite resin. This individual anatomic post improves the adaptation of post to root walls and decreases the resin cement thickness. The purpose of this in vivo study was to evaluate the push-out bond strength of fiber post according to relining procedure and luting agents type used for simplicity of clinical procedure. Forty-two extracted teeth were divides into six groups.(n=7) A1: relined fiber post cemented with Luxacore/all-bons 2, A2: non-relined fiber post cemented with Luxacore/all-bond2, B1: relinind fiber post cemented with Calibra/XP-bond, B2: non-relined fiber post cemented with Calibra/XP-bond, C1: relined fiber post cemented with RelyX Unicem, C2: non-relined fiber post cemented with RelyX Unicem Push-out bond strength was affected by interaction between relining procedure and luting agent type. Relined fiber post presented higher push-out bond strength value than non-relined fiber post and statically significant differences(p<0.05) Cementation with RelyX Unicem showed significantly higher bond strength than other luting agents(p<0.05).

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.2 s.332
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• pp.1-8
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• 2005

An area-efficient DC-DC voltage up-converter in a poly-Si TFT technology for system-on-glass is described which provides low-ripple output. The voltage up-converter is composed of charge-pumping circuit, comparator with threshold voltage mismatch compensation, oscillator, buffer, and delay circuit for multi-phase clock generation. The low ripple output is obtained by multi-phase clocking without increasing neither clock frequency nor filtering capacitor The measurement results have shown that the ripple on the output voltage with 4-phase clocking is 123mV, while Dickson and conventional cross-coupled charge pump has 590mV and 215mV voltage ripple, respectively, for $Rout=100k\Omega$, Cout-100pF, and fclk=1MHz. The filtering capacitor required for 50mV ripple voltage is 1029pF and 575pF for Dickson and conventional cross-coupled structure, for Iout=100uA, and fclk=1MHz, while the proposed multi-phase clocking DC-DC converter with 4-phase and 6-phase clocking requires only 290pF and 157pF, respectively. The efficiency of conventional and the multi-phase clocking DC-DC converter with 4-phase clocking is $65.7\%\;and\;65.3\%$, respectively, while Dickson charge pump has $59\%$ efficiency.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.122-122
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• 1999

Graphite with its advantages of high thermal conductivity, low thermal expansion coefficient, and low elasticity, has been widely used as a structural material for high temperature. However, graphite can easily react with oxygen at even low temperature as 40$0^{\circ}C$, resulting in CO2 formation. In order to apply the graphite to high temperature structural material, therefore, it is necessary to improve its oxidation resistive property. Silicon Carbide (SiC) is a semiconductor material for high-temperature, radiation-resistant, and high power/high frequency electronic devices due to its excellent properties. Conventional chemical vapor deposited SiC films has also been widely used as a coating materials for structural applications because of its outstanding properties such as high thermal conductivity, high microhardness, good chemical resistant for oxidation. Therefore, SiC with similar thermal expansion coefficient as graphite is recently considered to be a g행 candidate material for protective coating operating at high temperature, corrosive, and high-wear environments. Due to large lattice mismatch (~50%), however, it was very difficult to grow thick SiC layer on graphite surface. In theis study, we have deposited thick SiC thin films on graphite substrates at temperature range of 700-85$0^{\circ}C$ using single molecular precursors by both thermal MOCVD and PEMOCVD methods for oxidation protection wear and tribological coating . Two organosilicon compounds such as diethylmethylsilane (EDMS), (Et)2SiH(CH3), and hexamethyldisilane (HMDS),(CH3)Si-Si(CH3)3, were utilized as single source precursors, and hydrogen and Ar were used as a bubbler and carrier gas. Polycrystalline cubic SiC protective layers in [110] direction were successfully grown on graphite substrates at temperature as low as 80$0^{\circ}C$ from HMDS by PEMOCVD. In the case of thermal MOCVD, on the other hand, only amorphous SiC layers were obtained with either HMDS or DMS at 85$0^{\circ}C$. We compared the difference of crystal quality and physical properties of the PEMOCVD was highly effective process in improving the characteristics of the a SiC protective layers grown by thermal MOCVD and PEMOCVD method and confirmed that PEMOCVD was highly effective process in improving the characteristics of the SiC layer properties compared to those grown by thermal MOCVD. The as-grown samples were characterized in situ with OES and RGA and ex situ with XRD, XPS, and SEM. The mechanical and oxidation-resistant properties have been checked. The optimum SiC film was obtained at 85$0^{\circ}C$ and RF power of 200W. The maximum deposition rate and microhardness are 2$mu extrm{m}$/h and 4,336kg/mm2 Hv, respectively. The hardness was strongly influenced with the stoichiometry of SiC protective layers.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.27 no.9
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• pp.834-843
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• 2016

In this paper, the design of a PIN diode S-band transfer-type SP4T including its driver circuit is presented. Each path of the SP4T is composed of the cascade connection of series-shunt PIN diodes to improve the isolation performance. The SP4T is implemented using chip type PIN diodes and a 20 mil AIN substrate fabricated using thin film technology. The driver circuit for the SP4T is designed using a multiplexer and four NMOS-PMOS push-pull pair. From on-wafer measurement, the fabriacted SP4T shows a maximum insertion loss of 1.1 dB and a minimum isolation of 41 dB. The time performance of the driver circuit is evaluated using the packaged PIN diodes with the identical PIN diode chip, and the transition time for on-off and off-on are below 100 nsec. For an input power level of 150 W, the measured insertion loss and isolation are close to those of the on-wafer measurement taking into consideration of the coaxial package mismatch and insertion loss.

• Journal of Life Science
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• v.19 no.1
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• pp.152-155
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• 2009

The old-gold-crimson ($og^c$) fruit color mutation produces deep red tomato fruit with high lycopene content. age is a null mutation allele of lycopene-${\beta}$-cyclase (Crt-b) gene (B locus) that converts lycopene to ${\beta}$-carotene in the cartenoid biosynthesis pathway in tomato. Breeding of high lycopene tomato cultivars can be accelerated by marker-assisted selection (MAS) for introgression of $og^c$ allele by using a gene-based DNA marker. In order to develop a marker, single nucleotide deletion of adenine(A) with. in a poly-A repeat that has been known to be responsible for frame-shift mutation of $og^c$ was confirmed by resequencing mutant allele and wild-type allele at B locus of several tomato lines. For allele discrimination and detection of $og^c$, derived CAPS (dCAPS) approach was used by designing a primer that artificially introduced restriction enzyme recognition site of Hin fI in PCR products from $og^c$ allele. This dCAPS marker is co-dominant gene-based PCR marker that can be efficiently used for MAS breeding program aiming the development of high lycopene tomato.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.5 s.347
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• pp.54-63
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• 2006

This work proposes a 14b 100MS/s 0.18um CMOS ADC with optimized resolution, conversion speed, die area, and power dissipation to obtain the performance required in the fourth-generation mobile communication systems. The 3-stage pipeline ADC, whose optimized architecture is analyzed and verified with behavioral model simulations, employs a wide-band low-noise SHA to achieve a 14b level ENOB at the Nyquist input frequency, 3-D fully symmetric layout techniques to minimize capacitor mismatch in two MDACs, and a back-end 6b flash ADC based on open-loop offset sampling and interpolation to obtain 6b accuracy and small chip area at 100MS/s. The prototype ADC implemented in a 0.18um CMOS process shows the measured DNL and INL of maximum 1.03LSB and 5.47LSB, respectively. The ADC demonstrates a maximum SNDR and SFDR of 59dB and 72dB, respectively, and a power consumption of 145mW at 100MS/s and 1.8V. The occupied active die area is $3.4mm^2$.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.7-15
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• 2012

Semiconductor packages are increasingly moving toward miniaturization, lighter and multi-functions for mobile application, which requires highly integrated multi-stack package. To meet the industrial demand, the package and silicon chip become thinner, and ultra-thin packages will show serious reliability problems such as warpage, crack and other failures. These problems are mainly caused by the mismatch of various package materials and geometric dimensions. In this study we perform the numerical analysis of the warpage deformation and thermal stress of 4-layer stacked FBGA package after EMC molding and reflow process, respectively. After EMC molding and reflow process, the package exhibits the different warpage characteristics due to the temperature-dependent material properties. Key material properties which affect the warpage of package are investigated such as the elastic moduli and CTEs of EMC and PCB. It is found that CTE of EMC material is the dominant factor which controls the warpage. The results of RSM optimization of the material properties demonstrate that warpage can be reduced by $28{\mu}m$. As the silicon die becomes thinner, the maximum stress of each die is increased. In particular, the stress of the top die is substantially increased at the outer edge of the die. This stress concentration will lead to the failure of the package. Therefore, proper selection of package material and structural design are essential for the ultra-thin die packages.

• Journal of the Korean Solar Energy Society
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• v.37 no.4
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• pp.1-11
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• 2017

Most PV modules are fabricated by 6 cell-strings with solar cells connected in series. Moreover, bypass diodes are generally installed every 2 cell-strings to prevent PV modules from a damage induced by current mismatch or partial shading. But, in the case of special purpose PV module, like as BIPV (Building Integrated Photovoltaic), the number of cell-strings per module varies according to its size. Differ from a module employing even cell-strings, the configuration of bypass diode should be optimized in the PV module with odd strings because of oppositely facing electrodes. Hence, in this study, electrical characteristics of special purposed PV module with odd string was empirically and theoretically studied depending on arrangement of bypass diode. Here, we assumed that PV module has 3 strings and the number of bypass diodes in the system varies from 2 to 6. In case of 2 bypass diodes, shading on a center string increases short circuit current of the module, because of a parallel circuit induced by 2 bypass diodes connected to center string. Also, the loss is larger, as the shading area in the center string is enlarged. Thus, maximum power of the PV module with 2 bypass diode decreases by up to 59 (%) when shading area varies from 50 to 90 (%). On the other hand, In case of 3 and 6 bypass diodes, the maximum power reduction was within about 3 (W), even the shading area changes from 50 to 90 (%). As a result, It is an alternative to arrange the bypass diode by each string or one bypass diode in the PV module in order to completely bypass current in case of shading, when PV module with odd string are fabricated.

• Journal of Korean Society of Coastal and Ocean Engineers
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• v.26 no.5
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• pp.278-284
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• 2014

Water temperature due to climate change can be estimated using the air temperature because the air and water temperatures are closely related and the water temperatures have been widely used as the indicators of the environmental and ecological changes. It is highly necessary to estimate the frequency distribution of the air and water temperatures, for the climate change derives the change of the coastal water temperatures. In this study, the distribution function of the air temperatures is estimated by using the long-term coastal air temperature data sets in Korea. The candidate distribution function is the bi-modal distribution function used in the previous studies, such as Cho et al.(2003) on tidal elevation data and Jeong et al.(2013) on the coastal water temperature data. The parameters of the function are optimally estimated based on the least square method. It shows that the optimal parameters are highly correlated to the basic statistical informations, such as mean, standard deviation, and skewness coefficient. The RMS error of the parameter estimation using statistical information ranges is about 5 %. In addition, the bimodal distribution fits good to the overall frequency pattern of the air temperature. However, it can be regarded as the limitations that the distribution shows some mismatch with the rapid decreasing pattern in the high-temperature region and the some small peaks.

• Journal of the Korean association of regional geographers
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• v.21 no.3
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• pp.474-488
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• 2015

Conflicts in the construction of large public facilities carried out as national projects are crucial issues we have to deal with. There are growing concerns for and oppositions to large construction projects in terms of environmental deterioration and the dissolution of local communities. In the case of projects that promise the creation of jobs and investment, the competition and disputes are increasing and being intensified. Therefore, there is a considerable amount of study on the competitions and conflicts between regions. Previous studies have focused on the procedures of public policy, governance structure, the role of local media. Contrary to the previous studies, this study investigates the spatial ways of constructing conflicts. Based on the analysis of the project of "Southeastern New International Airport", there is a mismatch between the spatial boundary of cost/benefit and agents (regions) of disputes. The agents of conflicts also show the politics of multiple scales by constructing alliances and breaking the network in the process of the airport project. The findings suggest that the conflicts on regional development should be understood as the construction of dynamic regional politics on regional development rather than as the by-product in the practice of policies.