• Title/Summary/Keyword: Junction field

Search Result 350, Processing Time 0.027 seconds

Efficiency on the Field Edge Block which was used at Junction Field of Head & Neck Cancer in the Radiotherapy (두경부 종양의 방사선치료 시 접합 조사야에 사용된 조사면 끝단 차폐물의 유용성)

  • Lee, Jae-Seung;Kim, Jung-Nam
    • The Journal of the Korea Contents Association
    • /
    • v.8 no.11
    • /
    • pp.235-241
    • /
    • 2008
  • If the target volume cannot be included with one field at head and neck cancer, we commonly used two or more field. It is very important to irradiate uniform dose at junction area of the fields. However, according to body shape of patient or general condition of patient, skin junction area can be matched incorrect, So overdose area or underdose area can be appeared in the junction area. This study researched therapy technique which can give uniform dose at skin junction owing to applying the edge block of lateral field at head and neck cancer. We measured the changed distance and rotational angle between central line of anterior supraclavicle lymph node and low margin of right lateral field on simulation process using the shielding block of variable rotation. As a result, the changed distance between central line of anterior supraclavicle lymph node and low margin of right lateral field was below 2mm to ${\pm}$10cm distance at central line of Y axis, changed angle was average 1.28 degree. But by using it the shielding block of variable rotation, the incorrect match at junction can be minimized. We think that this technique is very efficient one to apply this technique at head and neck cancered by the movement of organs can be not included, Therefore we have to pay attention on the process to imput MLC layer

Effect of temperature gradient on junction magnetoresistance of magnetic tunnel junction devices

  • No, Seong-Cheol;Park, Min-Gyu;Lee, Yeo-Reum
    • Proceeding of EDISON Challenge
    • /
    • 2014.03a
    • /
    • pp.495-497
    • /
    • 2014
  • Combining the quantum transport theory with new field of Spin Caloritronics, we investigate on the influence of thermal gradient on the magneto tunnel junction structure under various circumstances. The results indicate enhancement in performance of spintronic device is possible using thermal energy.

  • PDF

Current Limitation Characteristics of Josephson Junction Array (조셉슨 접합 어레이의 전류 차단특성)

  • Kang, C.S.;Kim, K.;Yu, K.K.;Lee, S.J.;Kwon, H.;Hwang, S.M.;Lee, Y.H.;Kim, J.M.;Lee, S.K.
    • Progress in Superconductivity
    • /
    • v.10 no.2
    • /
    • pp.144-148
    • /
    • 2009
  • A current limiter was manufactured using a Josephson junction array to cut off an excessive current flowing into the SQUID sensor. The Fabricateed Josephson junction array was connected in series with a flux transformer that consists of a pick-up coil and an input coil, and the flux transformer was inductively coupled with a Double Relaxation Oscillation SQUID(DROS). The flux-voltage modulation curve was induced by applying an AC magnetic field whose magnitude was far smaller than that of the DC magnetic field. A change in the flux-voltage modulation curve of the SQUID was observed while the DC magnetic field was increased, to qualitatively examine the current limiting characteristic of the Josephson junction array. As a result, it was found that the SQUID flux-voltage modulation curve disappeared at the critical current of the Josephson junction array, which indicates that the Josephson junction array properly works as a current limiter.

  • PDF

Low Resistance SC-SJ(Shielding Connected-Super Junction) 4H-SiC UMOSFET with 3.3kV Breakdown Voltage (3.3kV 항복 전압을 갖는 저저항 SC-SJ(Shielding Connected-Super Junction) 4H-SiC UMOSFET)

  • Kim, Jung-hun;Kim, Kwang-Soo
    • Journal of IKEEE
    • /
    • v.23 no.3
    • /
    • pp.756-761
    • /
    • 2019
  • In this paper, we propose SC-SJ(Shielding Connected-Super Junction) UMOSFET structure in which p-pillars of conventional 4H-SiC Super Junction UMOSFET structures are placed under the shielding region of UMOSFET. In the case of the proposed SC-SJ UMOSFET, the p-pillar and the shielding region are coexisted so that no breakdown by the electric field occurs in the oxide film, which enables the doping concentration of the pillar to be increased. As a result, the on-resistance is lowered to improve the static characteristics of the device. Through the Sentaurus TCAD simulation, the static characteristics of proposed structure and conventional structure were compared and analyzed. The SC-SJ UMOSFET achieves a 50% reduction in on-resistance compared to the conventional structure without any change in the breakdown voltage.

Investigation of Curvature Effect on Planar InP/InGaAs Avalanche Photodiodes for Edge Breakdown Suppression (경계항복 억제를 위한 평판형 InP/InGaAs 애벌랜치 포토다이오드의 곡률 효과 분석)

  • 이봉용;정지훈;윤일구
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2002.07a
    • /
    • pp.206-209
    • /
    • 2002
  • With the progress of semiconductor processing technology, avalanohe photodiodes (APDs) based on InP/InGaAs are used for high-speed optical receiver modules. Planar-type APDs give higher reliability than mesa-type APDs. However, Planar-type APDs are struggled with a problem of intensed electric field at the junction curvature, which causes edge breakdown phenomena at the junction periphery. In this paper, we focused on studying the effects of junction curvature for APDs performances by different etching processes followed by single diffusion to from p-n junction. The performance of each process is characterized by observing electric field profiles and carrier generation rates. From the results, it can be understood to predict the optimum structure, which can minimize edge breakdown and improve the manufacturability.

  • PDF

A New Junction Termination Structure by Employing Trench and FLR (Trench와 FLR을 이용한 새로운 접합 마감 구조)

  • 하민우;오재근;최연익;한민구
    • The Transactions of the Korean Institute of Electrical Engineers C
    • /
    • v.52 no.6
    • /
    • pp.257-260
    • /
    • 2003
  • We have proposed the junction termination structure of IGBT (Insulated Gate Bipolar Transistor) by employing trench and FLR (Field Limiting Ring), which decrease the junction termination area at the same breakdown voltage. Our proposed junction termination structure, trench FLR is verified by numerical simulator MEDICI. In 600V rated device, the junction termination area is decreased 20% compared with that of the conventional FLR structure. The breakdown voltage of trench FLR with 4 trenches is 768 V, 99 % of ideal parallel-plane junction(1-D) $BV_ceo$.

Structure Modeling of 100 V Class Super-junction Trench MOSFET with Specific Low On-resistance

  • Lho, Young Hwan
    • Journal of IKEEE
    • /
    • v.17 no.2
    • /
    • pp.129-134
    • /
    • 2013
  • For the conventional power metal-oxide semiconductor field-effect transistor (MOSFET) device structure, there exists a tradeoff relationship between specific on-resistance ($R_{ON.SP}$) and breakdown voltage ($V_{BR}$). In order to overcome the tradeoff relationship, a uniform super-junction (SJ) trench metal-oxide semiconductor field-effect transistor (TMOSFET) structure is studied and designed. The structure modeling considering doping concentrations is performed, and the distributions at breakdown voltages and the electric fields in a SJ TMOSFET are analyzed. The simulations are successfully optimized by the using of the SILVACO TCAD 2D device simulator, Atlas. In this paper, the specific on-resistance of the SJ TMOSFET is successfully obtained 0.96 $m{\Omega}{\cdot}cm^2$, which is of lesser value than the required one of 1.2 $m{\Omega}{\cdot}cm^2$ at the class of 100 V and 100 A for BLDC motor.

Comparison of Drain-Induced-Barrier-Lowering (DIBL) Effect by Different Drain Engineering

  • Choi, Byoung-Seon;Choi, Pyung-Ho;Choi, Byoung-Deog
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2012.02a
    • /
    • pp.342-343
    • /
    • 2012
  • We studied the Drain-Induced-Barrier-Lowering (DIBL) effect by different drain engineering. One other drain engineering is symmetric source-drain n-channel MOSFETs (SSD NMOSs), the other drain engineering is asymmetric source-drain n-channel MOSFETs (ASD NMOSs). Devices were fabricated using state of art 40 nm dynamic-random-access-memory (DRAM) technology. These devices have different modes which are deep drain junction mode in SSD NMOSs and shallow drain junction mode in ASD NMOSs. The shallow drain junction mode means that drain is only Lightly-Doped-Drain (LDD). The deep drain junction mode means that drain have same process with source. The threshold voltage gap between low drain voltage ($V_D$=0.05V) and high drain voltage ($V_D$=3V) is 0.088V in shallow drain junction mode and 0.615V in deep drain junction mode at $0.16{\mu}m$ of gate length. The DIBL coefficients are 26.5 mV/V in shallow drain junction mode and 205.7 mV/V in deep drain junction mode. These experimental results present that DIBL effect is higher in deep drain junction mode than shallow drain junction mode. These results are caused that ASD NMOSs have low drain doping level and low lateral electric field.

  • PDF

Fabrication of Graphene p-n Junction Field Effect Transistors on Patterned Self-Assembled Monolayers/Substrate

  • Cho, Jumi;Jung, Daesung;Kim, Yooseok;Song, Wooseok;Adhikari, Prashanta Dhoj;An, Ki-Seok;Park, Chong-Yun
    • Applied Science and Convergence Technology
    • /
    • v.24 no.3
    • /
    • pp.53-59
    • /
    • 2015
  • The field-effect transistors (FETs) with a graphene-based p-n junction channel were fabricated using the patterned self-assembled monolayers (SAMs). The self-assembled 3-aminopropyltriethoxysilane (APTES) monolayer deposited on $SiO_2$/Si substrate was patterned by hydrogen plasma using selective coating poly-methylmethacrylate (PMMA) as mask. The APTES-SAMS on the $SiO_2$ surface were patterned using selective coating of PMMA. The APTES-SAMs of the region uncovered with PMMA was removed by hydrogen plasma. The graphene synthesized by thermal chemical vapor deposition was transferred onto the patterned APTES-SAM/$SiO_2$ substrate. Both p-type and n-type graphene on the patterned SAM/$SiO_2$ substrate were fabricated. The graphene-based p-n junction was studied using Raman spectroscopy and X-ray photoelectron spectroscopy. To implement low voltage operation device, via ionic liquid ($BmimPF_6$) gate dielectric material, graphene-based p-n junction field effect transistors was fabricated, showing two significant separated Dirac points as a signature for formation of a p-n junction in the graphene channel.

The Electrical Characterization of Magnetic Tunneling Junction Cells Using Conductive Atomic Force Microscopy with an External Magnetic Field Generator

  • Heo, Jin-Hee
    • Transactions on Electrical and Electronic Materials
    • /
    • v.11 no.6
    • /
    • pp.271-274
    • /
    • 2010
  • We examined the tunneling current behaviors of magnetic tunneling junction (MTJ) cells utilizing conductive atomic force microscopy (AFM) interfaced with an external magnetic field generator. By introducing current through coils, a magnetic field was generated and then controlled by a current feedback circuit. This enabled the characterization of the tunneling current under various magnetic fields. The current-voltage (I-V) property was measured using a contact mode AFM with a metal coated conducting cantilever at a specific magnetic field intensity. The obtained magnetoresistance (MR) ratios of the MTJ cells were about 21% with no variation seen from the different sized MTJ cells; the value of resistance $\times$ area (RA) were 8.5 K-12.5 K $({\Omega}{\mu}m^2)$. Since scanning probe microscopy (SPM) performs an I-V behavior analysis of ultra small size without an extra electrode, we believe that this novel characterization method utilizing an SPM will give a great benefit in characterizing MTJ cells. This novel method gives us the possibility to measure the electrical properties of ultra small MTJ cells, namely below $0.1\;{\mu}m\;{\times}\;0.1\;{\mu}m$.