• Journal of Welding and Joining
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• v.31 no.6
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• pp.58-64
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• 2013

Several joining methods involving resistance welding, laser welding, ultrasonic welding and mechanical joining are currently applied in manufacturing lithium-ion batteries. Cu and Al alloys are used for tab and bus bar materials, and laser welding characteristics for these alloys were investigated with similar and dissimilar material combinations in this study. The base materials used were Al 1050 and oxygen-free Cu 1020P alloys, and a disk laser was used with a continuous wave mode. In bead-on-plate welding of both alloys, the joint strength was higher than the strength of O tempered base material. In overlap welding, the effect of welding parameters on the tensile shear strength and bead shape was evaluated. Tensile shear strength of overlap welded joint was affected by interfacial bead width and weld defect formation. The tensile-shear specimen was fractured at the heat affected zone by selecting proper laser welding parameters.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2002.05a
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• pp.33-38
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• 2002

Nowdays, related with vehicle weight reduction, many automotive maker are trying to develop spaceframe. If aluminum member and steel member are applied together in constructing spaceframe, there will be many advantages in aspect of inclosing strength and saving weight of automotive. In this case, joining method of aluminum and steel members has to be proposed. For this method, electomagnetic joining has many advantages compared to welding. In this paper, joining of aluminum tube and steel tube using eletomagnetic pressure was studied and strength of joint was evaluated through commission test.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.05a
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• pp.131-135
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• 2003

The form-joining process (or clinching) uses a set of die and punch to impose the plastic deformation-induced geometric constraint on a sheet metal pair, But their joining strength ranges 50-70 percent of that of the resistance spot welding. In this paper, a new form-joining process with the aid of adhesive is proposed in which an epoxy adhesive is applied to a sheet metal pair, to improve joining strength. The strength and mechanical properties of the new process are discussed and compared for other joining processes.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.102-110
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• 2023

This paper introduces scarf welding process of thin substrates using flexible laser transmission welding (f-LTW) technology. We examined the behavior of tensile strength relative to the scarf angle for flexible applications. Thin plastic substrates with the thickness of less than 100 ㎛ were bonded and a jig to form a slope at the edge of the substrate was developed. By developing the scarf welding process, we successfully created a flexible bonding technology that maintains joint's thickness after the process. The tensile strength of the joint was assessed through uniaxial test, and we found that the tensile strength increases as the slope of bonding interface decreases. By conducting stress analysis at the bonding interface with respect to the slope angle, design factor of bonding structure was investigated. These findings suggest that the tensile strength depends on the geometry of the joint, even under the same process conditions, and highlights the significance of considering the geometry of the joint in welding processes.

• Journal of Welding and Joining
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• v.30 no.4
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• pp.4-9
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• 2012

• Journal of Welding and Joining
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• v.34 no.3
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• pp.1-5
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• 2016

At present, FSW(friction stir welding) process is being considered as an actual way for production of various industrial products. However FSW process involves high temperature and load on the tool during welding. These are make a difference between FSW machine and general machine tools. From this reason, development of FSW machine needs very careful consideration on stiffness of machine structure, spindle and moving axis including machine control system. In this study authors investigate on the trends of technology development of FSW machine in order to share the information for more extension of FSW technology with related researchers and engineers.

• Nuclear Engineering and Technology
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• v.48 no.4
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• pp.1009-1014
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• 2016

SiC-based ceramic composites are currently being considered for use in fuel cladding tubes in light-water reactors. The joining of SiC ceramics in a hermetic seal is required for the development of ceramic-based fuel cladding tubes. In this study, SiC monoliths were diffusion bonded using a Ti foil interlayer and additional Si powder. In the joining process, a very low uniaxial pressure of ~0.1 MPa was applied, so the process is applicable for joining thin-walled long tubes. The joining strength depended strongly on the type of SiC material. Reaction-bonded SiC (RB-SiC) showed a higher joining strength than sintered SiC because the diffusion reaction of Si was promoted in the former. The joining strength of sintered SiC was increased by the addition of Si at the Ti interlayer to play the role of the free Si in RB-SiC. The maximum joint strength obtained under torsional stress was ~100 MPa. The joint interface consisted of $TiSi_2$, $Ti_3SiC_2$, and SiC phases formed by a diffusion reaction of Ti and Si.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.4-10
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• 2013

In electronic industry, the trend of future electronics will be flexible, bendable, wearable electronics. Until now, there is few study on bonding technology and reliability of bonding joint between chip with micro solder bump and flexible substrate. In this study, we investigated joint properties of Si chip with eutectic Sn-58Bi solder bump on Cu pillar bump bonded on flexible substrate finished with ENIG by flip chip process. After flip chip bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test, thermal shock test, and bending test. After thermal shock test, we observed that crack initiated between $Cu_6Sn_5IMC$ and Sn-Bi solder and then propagated within Sn-Bi solder and/or interface between IMC and solder. On the other hands, We observed that fracture propated at interface between Ni3Sn4 IMC and solder and/or in solder matrix after bending test.

• Journal of Welding and Joining
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• v.31 no.5
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• pp.71-76
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• 2013

The effect of zirconate having - NH functional group on the T-peel and lap shear strength of $CaCO_3$ containing structural epoxy adhesive for car body assembly was investigated. Curing behavior of epoxy adhesive samples were investigated by differential scanning calorimeter (DSC) techniques. The addition of zirconate up to 7.5 phr did not affect the curing mechanism of epoxy adhesive. While the small amount of zirconate addition less than 1.1 phr increased the cross-linking density, the excess addition of zirconate resulted in the increase of uncross-linked impurity. From the increase of T-peel and lap shear strength and the change of fracture mode from the adhesive failure to the mixed one, it was considered that the small addition of zirconate was effective in improving the adhesion strength of epoxy adhesive to the adherend and inorganic filler surfaces. The formation of uncross-linked impurity with the excess addition of zirconate was considered to decrease the joint strength by decreasing the cohesive strength of the cured epoxy.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.1-13
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• 2014

The paper gives an overview of the concepts, basic requirements, and trends regarding packaging technologies of power modules in hybrid (HEV) and electric vehicles (EV). Power electronics is gaining more and more importance in the automotive sector due to the slow but steady progress of introducing partially or even fully electric powered vehicles. The demands for power electronic devices and systems are manifold, and concerns besides aspects such as energy efficiency, cooling and costs especially robustness and lifetime issues. Higher operation temperatures and the current density increase of new IGBT (Insulated Gate Bipolar Transistor) generations make it more and more complicated to meet the quality requirements for power electronic modules. Especially the increasing heat dissipation inside the silicon (Si) leads to maximum operation temperatures of nearly $200^{\circ}C$. As a result new packaging technologies are needed to face the demands of power modules in the future. Wide-band gap (WBG) semiconductors such as silicon carbide (SiC) or gallium nitride (GaN) have the potential to considerably enhance the energy efficiency and to reduce the weight of power electronic systems in EVs due to their improved electrical and thermal properties in comparison to Si based solutions. In this paper, we will introduce various package materials, advanced packaging technologies, heat dissipation and thermal management of advanced power modules with extended reliability for EV applications. In addition, SiC and GaN based WBG power modules will be introduced.