• Bulletin of the Korean Chemical Society
• /
• 제29권9호
• /
• pp.1787-1789
• /
• 2008

• 한국소성가공학회:학술대회논문집
• /
• 한국소성가공학회 2003년도 춘계학술대회논문집
• /
• pp.295-298
• /
• 2003

High temperature deformation behavior of a Ti-Al intermetallic compound has been investigated. Specimens with a near gamma and a lamella structures were obtained by performing heat treatment at 1200 and 1330$^{\circ}C$, respectively, for 24 hr and stabilized at 900$^{\circ}C$ for 4 hr followed by air cooling. A series of load relaxation tests has been conducted on these samples at temperatures ranging from 850 to 950$^{\circ}C$ to construct flow curves in the strain rate range from 10$\^$-6//s to 10$\^$-3//s. Strain hardening was observed even at the temperature of 950$^{\circ}C$ in both the near gamma and the lamella structures. Further aging treatment for 12 hr at test temperatures has found to cause no softening in both microstructures.

• 한국재료학회지
• /
• 제13권1호
• /
• pp.24-30
• /
• 2003

The Raney Ni catalyst was fabricated by mechanochemically process(MC process) in the Al-Ni system. Intermetallic compound obtained by mechanical alloying was leached in an alkaline solution. The characteristics of the mechanically alloyed powder and Raney Ni catalyst were analyzed by XRD, ICP-AES and EXAFS. In Al-50wt.%Ni, the metastable intermetallic compound phase close to AlNi phase was obtained by mechanical alloying unlike Al-Ni equilibrium phase diagram. The metastable intermetallic compound was transformed into $Al_3$$Ni_2$phase via the annealing at $750^{\circ}C$. The microstructure of Raney Ni fabricated by MC process was mainly bcc Ni including fcc Ni.

• 대한기계학회논문집A
• /
• 제24권5호
• /
• pp.1146-1154
• /
• 2000

Fatigue strength of NiAl and Ni$_3$Al particulate reinforced aluminum alloy composites fabricated by the diecasting method was examined at room and elevated temperatures. The results were compared wit h that of SiC particulate reinforced one. The particulate reinforced composites showed some improvement in the static and fatigue strength at elevated temperatures when compared with that of Al alloy. The composites reinforced by intermetallic compound particles showed good fatigue strengths at elevated temperatures especially $Ni_3AI_{p}/Al$ alloy composite showed good fatigue limit up to high temperature of 30$0^{\circ}C$. Adopting intermetallic compound particle as a reinforcement phase, it will be possible to develop MMC representing better fatigue property at elevated temperature.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2008년도 추계학술대회A
• /
• pp.1295-1300
• /
• 2008

During the manufacturing and the service life of Au-Al wire bonded electronic packages, the ball bonds experience elevated temperatures and hence accelerated thermal diffusion reactions that promote the transformation of the Au-Al phases and the IMC growth. In this paper, the IC under high temperature storage (HTS) tests at $175^{\circ}C,\;200^{\circ}C$, and $250^{\circ}C$ are meticulously investigated. Thermal exposure resulted in the IMC growth, Kirkendall void and the crack of the Au-Al phases. The crack propagation occurs resulting in the failure of the Au-Al ball bonds. As the IC was exposed at the high temperature, decreased in the lifetime.

• 한국전기전자재료학회논문지
• /
• 제16권6호
• /
• pp.549-554
• /
• 2003

The purpose of this paper is to investigate the solder properties by the change of P mass percentage. Tension test, wetting balance test, spread test, and analysis of intermetallic compound after isothermal aging of Sn-2.5Ag-0.7Cu-0.005P, Sn-2.5Ag-0.7Cu-0.01P, Sn-2.5Ag-0.7Cu-0.02P, Sn-0.7Cu-0.005P were performed. Adding P in the solder alloys resulted in improvement of tensile strength, reduction of intermetallic compound growth, reduction of oxidization in fusible solders under wave soldering. After comparing solder alloy containing P with tin-lead eutectic solder alloy, P contained solders alloys showed much better solder properties than eutectic solder alloy. Furthermore, this solder alloy presented remarkable properties than any other lead-free solder alloy.

• Journal of Welding and Joining
• /
• 제20권5호
• /
• pp.72-77
• /
• 2002

Flip-chip interconnection that uses solder bump is an essential technology to improve the performance of microelectronics which require higher working speed, higher density, and smaller size. In this paper, the shear strength of Cr/Cr-Cu/Cu UBM structure of the high-melting solder b01p and that of low-melting solder bump after aging is evaluated. Observe intermetallic compound and bump joint condition at the interface between solder and UBM by SEM and TEM. And analyze the shear load concentrated to bump applying finite element analysis. As a result of experiment, the maximum shear strength of Sn-97wt%Pb which was treated 900 hrs aging has been decreased as 25% and Sn-37wt%Pb sample has been decreased as 20%. By the aging process, the growth of $Cu_6Sn_5$ and $Cu_3Sn$ is ascertained. And the tendency of crack path movement that is interior of a solder to intermetallic compound interface is found.

• 한국주조공학회지
• /
• 제21권3호
• /
• pp.179-186
• /
• 2001

Melt super-heating which promotes shape modification of ${\beta}$ intermetallic compounds was conducted to improve mechanical properties of recycled AC2B aluminum alloy. Modification of needle-shape ${\beta}$ intermetallic compounds was effective for the specimens of AC2B aluminum alloys containing 0.85wt.% Fe by melt super-heating, in which the melts had been held at $850^{\circ}C$ or $950^{\circ}C$ for 30 minutes respectively. Owing to the modification of needle-shape of ${\beta}$ intermetallic compounds by melt superheating of the alloy with containing 0.85wt.% Fe to $950^{\circ}C$, increases in elongation and tensile strength were prominent to be more than double and 55% respectively in comparison with the melt heated to $740^{\circ}C$. Moreover, modification of needle-shape ${\beta}$ intermetallic compounds in the alloy containing O.85wt.% Fe by $950^{\circ}C$ melt super-heating led to 48% improvement of the value of impact absorbed energy as compared with the melt heated to $740^{\circ}C$.

• 대한용접접합학회:학술대회논문집
• /
• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
• /
• pp.475-480
• /
• 2002

The reliability of the solder joint is affected by type and extent of the interfacial reaction between solder and substrates. Therefore, understanding of intermetallic compounds produced by soldering in electronic packaging is essential. In-based alloys have been favored bonding devices that demand low soldering temperatures. For photonic and fiber optics packaging, m-based solders have become increasingly attractive as a soldering material candidate due to its ductility. In the present work, the interfacial reactions between indium solder and bare Cu Substrate are investigated. For the identification of intermetallic compounds, both Scanning Electron Microscopy(SEM) and X-Ray Diffraction(XRD) were employed. Experimental results showed that the intermetallic compounds, such as Cu$_{11}$In$_{9}$ was observed for bare Cu substrate. Additionally, the growth rate of these intermetallic compounds was increased with the reaction temperature and time. We found that the growth of the intermetallic compound follows the parabolic law, which indicates that the growth is diffusion-controlled.d.

• 열처리공학회지
• /
• 제13권6호
• /
• pp.391-397
• /
• 2000

Addition of Ca element and nonequilibrium heat treatment which promotes shape modification of eutectic Si and ${\beta}$ intermetallic compound were conducted to improve the mechanical properties of Al-Si-Cu alloy. Modification of eutectic Si and dissolution of needle-shape ${\beta}$ intermetallic compounds were possible by nonequilibrium heat treatment in which specimens were held at $505^{\circ}C$ for 2 hours in Al-Si-Cu alloy with Fe. Owing to the decrease in aspect ratio of eutectic Si by the heat treatment of the alloy with 0.33wt.% Fe, the increase in elongation was prominent to be more than double that in the as-cast specimen. Dissolution of needle-shape ${\beta}$ intermetallic compounds in the alloy with 0.85wt.% Fe led to the improvement of tensile strength as the length of ${\beta}$ compounds decreased to 50%.