대한기계학회:학술대회논문집 (Proceedings of the KSME Conference)
- 대한기계학회 2008년도 추계학술대회A
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- Pages.1295-1300
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- 2008
Au wire와 Al pad사이의 IMC(Intermetallic Compound) 형성에 의한 수명예측
Lifetime Estimation due to IMC(Intermetallic Compound) formation between Au wire and Al pad
- 발행 : 2008.11.05
초록
During the manufacturing and the service life of Au-Al wire bonded electronic packages, the ball bonds experience elevated temperatures and hence accelerated thermal diffusion reactions that promote the transformation of the Au-Al phases and the IMC growth. In this paper, the IC under high temperature storage (HTS) tests at
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