Aging Characteristic of Shear Strength in Micro Solder Bump
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김경섭
(여주대학 전자학과)
유정희 (한국전자통신연구원) 선용빈 (경기대학교 산업정보대학원) |
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Enhancement of Underfill Encapsulants for Flip-Chip Technology
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Interfacial Reaction of Sn-3.5wt%Ag Solder Alloy with a Variance of Ni layer Thickness
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Aging Characteristic of Intermetallic Compounds and Bonding Strength of Flip-Chip Solder Bump
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과학기술학회마을 |
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Aging Studies of Cu-Sn Intermetallic Compounds in Annealed Surface Mount Solder Joints
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DOI ScienceOn |
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The Effects of Underfill on the Reliability of Flip Chip Solder Joints
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DOI |
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