• Journal of the Semiconductor & Display Technology
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• v.18 no.1
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• pp.1-4
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• 2019

Reactive sputtering is widely used because of its high deposition rate and high step coverage. The deposition layer is often affected by target poisoning because the target conditions are changed, as well, by reactive gases during the initial stage of sputtering process. The reactive gas affects the deposition rate and process stability (target poisoning), and it also leads unintended oxide interlayer formation. Although the target poisoning mechanism has been well known, little attention has been paid on understanding the interlayer formation during the reactive sputtering. In this research, we studied the interlayer formation during the reactive sputtering. A DC magnetron sputtering process is carried out to deposit an aluminum oxide film on a silicon wafer. From the real-time process monitoring and material analysis, the target poisoning phenomena changes the reactive gas balance at the initial stage, and affects the interlayer formation during the reactive sputtering process.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.798-802
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• 2002

Metallurgical studies on the bonded interlayer of directionally solidified Ni-base superalloy GTD111 joints were carried out during transient liquid phase bonding. The formation mechanism of solid during solidification process was also investigated. Microstructures at the bonded interlayer of joints were characterized with bonding temperature. In the bonding process held at 1403K, liquid insert metal was eliminated by well known mechanism of isothermal solidification process and formation of the solid from the liquid at the bonded interlayer were achieved by epitaxial growth. In addition, grain boundary formed at bonded interlayer is consistent with those of base metal. However, in the bonding process held at 1453K, extensive formation of the liquid phase was found to have taken place along dendrite boundaries and grain boundaries adjacent to bonded interlayer. Liquid phases were also observed at grain boundaries far from the bonding interface. This phenomenon results in liquation of grain boundaries. With prolonged holding, liquid phases decreased gradually and changed to isolated granules, but did not disappeared after holding for 7.2ks at 1473K. This isothermal solidification occurs by diffusion of Ti to be result in liquation. In addition, grain boundaries formed at bonded interlayer were corresponded with those of base metal. In the GTD-ll1 alloy, bonding mechanism differs with bonding temperature.

• Journal of the Korean institute of surface engineering
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• v.31 no.3
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• pp.142-150
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• 1998

Stainless steel is being used widely for various purposes due to its good corrosion resistance. There has been much research to produce colored stainless steel by several methods such as anodizing and ion plating. In this experiment, we coated TiN(C,O,H)films SUS304 substraate with the DC magnetron spttering system made by Leybold Heraeus and studied the interlater structure and abhesive strength of the films as a function of additional gases, acetylene, hydrogen and oxygen. When the acetylene gas was added into the chamber, the specimen with the interlayer phase had good adhesion due to the toughness of the $\gamma'-Fe_4N$ plase induced from a solid solution of carbon atoms, while low adhesion appeared on the specimen of the non interlayer phase. The formation of the interlayer phase($\gamma'-Fe_4N$) was due to hydrogen embrittlement and internal stress induced by $\gamma'-Fe_4N$ formation in the interlayer. We could fine the interlayer phase ($\gamma'-Fe_4N$) at the interface between the film and the substrate of the TEM image when $\gamma'-Fe_4N$ was detected by the X-ray duffraction metheod.

• Journal of the Semiconductor & Display Technology
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• v.12 no.2
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• pp.1-6
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• 2013

The effects of interlayer formation and thermal treatment on the field-emission properties of carbon nanotubes (CNTs) were investigated. The CNTs were prepared on tungsten (W) micro-tip substrates using the electrophoretic deposition (EPD) method. The interlayers, such as aluminum (Al) and hafnium (Hf) were coated on the W-tips prior to CNT deposition and after the deposition of CNTs all the species were thermally treated at $700^{\circ}C$ for 30 min. The field-emission properties of CNTs were significantly improved by thermal treatment. The threshold electric field for igniting the electron emission was decreased and the emission current was increased. The Raman spectroscopy results indicated that this was attributed mainly to the enhancement of CNTs by thermal treatment. Also, the CNTs deposited on the interlayers showed the remarkably improved results in the long-term emission stability, especially when they were thermally treated. The X-ray photoelectron spectroscopy (XPS) measurement confirmed that this was resulted from the formation of the additional cohesive forces between the CNTs and the underlying interlayers.

• Coupled systems mechanics
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• v.7 no.5
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• pp.627-634
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• 2018

Laser beam welding is more advantageous compared to conventional methods. Titanium/Aluminium dissimilar alloy thin sheet metals are difficult to weld due to large difference in melting point. The performance of the weldment depends upon interlayer formation and distribution of intermetallics. During welding, aluminium gets lost at the temperature below the melting point of titanium. Therefore, it is needed to improve a new metal joining techniques between these two alloys. The present work is carried for welding TI6AL4V and AA2024 alloy by using Nd:YAG Pulsed laser welding unit. The performance of the butt welded interlayer structures are discussed in detail using hardness test and SEM. Test results reveal that interlayer fracture is caused near aluminium side due to low strength at the weld joint.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.200.1-200.1
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• 2016

Tungsten coatings on the graphite (CX-2320) were successfully deposited using the vacuum plasma spraying (VPS) method. An optimum coating procedure was developed and coating thicknesses of $409{\mu}m$ (without an interlayer) and $378{\mu}m$ (with an interlayer) were obtained with no cracks and no signs of delamination. The mechanical characteristics and microstructure of the tungsten coating layers were investigated using a Vickers hardness tester, FE-SEM, EDS, and XRD. The effect of a titanium interlayer on the properties of the tungsten coating was investigated. It was shown that the titanium interlayer prevented the diffusion of carbon to the tungsten layer, thereby suppressing the formation of tungsten carbide. Vickers hardness data yielded values that were 62.5 ~ 80.46% of those for bulk tungsten, indicating that tungsten coatings on graphite can be utilized as a plasma-facing material. High heat flux tests were performed by using thermal plasma with a maximum flux of $10MW/^2$. Vickers hardness after the heat flux test is performed to see a change in the mechanical properties. The formationof a tungsten carbide and the effect of the titanium interlayer for the diffusion barrier are investigated by using energy dispersion spectroscopy (EDS).

• Journal of the Korean institute of surface engineering
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• v.44 no.6
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• pp.269-276
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• 2011

Phase evolution and tribological behavior of Cr-Mo-N multi compositional films with different interlayer were investigated. The films were deposited by hybrid PVD (Physical Vapor Deposition) system consisted of dc unbalanced magnetron (UBM) sputtering and arc ion plating (AIP) sources. A pure molybdenum (Mo) was used as sputtering target and also a pure Cr was used as AIP target to form the Cr-Mo-N films. Various growth planes were found, no textured surface, in all of the multi composition films. Maximum value of microhardness was measured in Cr-Mo-N film with Mo interlayer as 29 GPa. Composition film was mainly showed the aspect of the adhesive wear than CrN film. The friction coefficient was decreased from 0.6 for pure CrN coating to 0.35 for Cr-Mo-N film with Mo interlayer. This result may come from the formation of metal oxide tribo-layer which is known as solid lubricant during the wear test.

• Journal of the Semiconductor & Display Technology
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• v.4 no.2 s.11
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• pp.7-10
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• 2005

[ $SiO_{2}$ ] or SiON is usually deposited and annealed after formation of silicide in real transistor fabrication processes. Nickel silicide and nickel silicide with Co interlayer were annealed at 650$^{\circ}C$ for 30 min with silica top layer in this study to investigate its thermal stability. SEM, XPS, and FPP(four point probe) were employed for the investigation. Nickel silicide with Co interlayer showed improved thermal stability. Co interlayer seems to play a key role to the stability of nickel silicide.

• Journal of Powder Materials
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• v.26 no.4
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• pp.305-310
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• 2019

In the present work, spheroidization of angular vanadium powders using a radio frequency (RF) thermal plasma process is investigated. Initially, angular vanadium powders are spheroidized successfully at an average particle size of $100{\mu}m$ using the RF-plasma process. It is difficult to avoid oxide layer formation on the surface of vanadium powder during the RF-plasma process. Titanium/vanadium/stainless steel functionally graded materials are manufactured with vanadium as the interlayer. Vanadium intermediate layers are deposited using both angular and spheroidized vanadium powders. Then, 17-4PH stainless steel is successfully deposited on the vanadium interlayer made from the angular powder. However, on the surface of the vanadium interlayer made from the spheroidized powder, delamination of 17-4PH occurs during deposition. The main cause of this phenomenon is presumed to be the high thickness of the vanadium interlayer and the relatively high level of surface oxidation of the interlayer.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.10a
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• pp.129-130
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• 2009

다이아몬드상 탄소 (Diamond-like Carbon; DLC) 박막은 광학재료의 보호 및 무반사 코팅, 저마찰 오버코팅 및 평판 표시소자의 전계방출 Tip 코팅 등 다양한 분야에 응용이 기대되고 있는 재료이다. 이온빔 방식의 DLC 박막 제조 장치를 이용하여 다양한 조건에서 DLC 박막을 제조하고 그 특성을 평가하였다.