Effects of Dielectric Curing Temperature and T/H Treatment on the Interfacial Adhesion Energies of Ti/PBO for Cu RDL Applications of FOWLP (FOWLP Cu 재배선 적용을 위한 절연층 경화 온도 및 고온/고습 처리가 Ti/PBO 계면접착에너지에 미치는 영향)
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- Journal of the Microelectronics and Packaging Society
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- v.30 no.2
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- pp.52-59
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- 2023