• 제목/요약/키워드: Interfacial layer

검색결과 676건 처리시간 0.022초

3층 Cu/Al/Cu 클래드재의 열처리온도에 따른 변형 및 파단거동 (Effect of Heat Treatment on the Deformation and Fracture Behaviors of 3-ply Cu/Al/Cu Clad Metal)

  • 김인규;하종수;홍순익
    • 대한금속재료학회지
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    • 제50권12호
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    • pp.939-948
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    • 2012
  • A 3-ply clad metal consisting of aluminum and copper was fabricated by roll bonding process and the microstructures and mechanical properties of the roll-bonded and post-roll-bonding heat treated Cu/Al/Cu clad metal were investigated. A brittle interfacial reaction layer formed at the Cu/Al interfaces at and above $400^{\circ}C$. The thickness of the reaction layer increased from $12{\mu}m$ at $400^{\circ}C$ to $28{\mu}m$ at $500^{\circ}C$. The stress-strain curves demonstrated that the strength decreased and the ductility increased with heat treatment up to $400^{\circ}C$. The clad metal heat treated at $300^{\circ}C$ with no indication of a reaction layer exhibited an excellent combination of the strength and ductility and no delamination of layers up to final fracture in the tensile testing. Above $400^{\circ}C$, the ductility decreased rasxpidly with little change of strength, reflecting the brittle nature of the intermetallic interlayers. In Cu/Al/Cu clad heat treated above $400^{\circ}C$, periodic parallel cracks perpendicular to the stress axis were observed at the interfacial reaction layer. In-situ optical microscopic observation revealed that cracks were formed in the Cu layer due to the strain concentration in the vicinity of horizontal cracks in the intermetallic layer, promoting the premature fracture of Cu layer. Vertical cracks parallel to the stress axis were also formed at 15% strain at $500^{\circ}C$, leading to the delamination of the Cu and Al layers.

탄성층 사이에 접합된 압전재료의 계면균열에 대한 전기-기계적 해석 (Electro-Mechanical Analysis of Interfacial Cracks in a Piezoelectric Layer Bonded to Dissimilar Elastic Layers)

  • 정경문;김인옥;김지숙;범현규
    • 한국정밀공학회지
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    • 제19권11호
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    • pp.120-128
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    • 2002
  • Interfacial cracks in a piezoelectric layer bonded to dissimilar elastic layers under the combined anti-plane mechanical shear and in-plane electrical leadings are considered. By using Fourier cosine transform, the mixed boundary value problem is reduced to a singular integral equation which is solved numerically to determine the stress intensity factors. Numerical results for the effects of the material properties and layer geometries on the stress intensity factors are obtained.

태양연못 안의 열-염분 이중확산계에 대한 수치적연구 (Numerical Study of the Thermohaline Double-Diffusive System in a Solar Pond)

  • 임경빈;박희용;이관수
    • 대한설비공학회지:설비저널
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    • 제16권6호
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    • pp.606-612
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    • 1987
  • In this study, numerical model was developed to predict behavior of several layers in a solar pond and was solved by finite difference method. The empirical correlation that described heat and salt fluxes across interfacial boundary layer between mixed layer and diffusive layer in a solar pond were obtained from experiments and utilized in developing numerical model. As the results of this study, heat and salt fluxes across the interfacial boundary layer was found to depend on density ratio ${\beta}{\Delta}M_s/{\alpha}{\Delta}T.$ It was also found that the predicted value obtained by using the modified Weinberger's stability criteria showed a good agreement with experiment data.

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Slippage on which interface in nanopore filtration?

  • Xiaoxu Huang;Wei Li;Yongbin Zhang
    • Membrane and Water Treatment
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    • 제15권1호
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    • pp.31-39
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    • 2024
  • The flow in a nanopore of filtration membrane is often multiscale and consists of both the adsorbed layer flow and the intermediate continuum fluid flow. There is a controversy on which interface the slippage should occur in the nanopore filtration: On the adsorbed layer-pore wall interface or on the adsorbed layer-continuum fluid interface? What is the difference between these two slippage effects? We address these subjects in the present study by using the multiscale flow equations incorporating the slippage on different interfaces. Based on the limiting shear strength model for the slippage, it was found from the calculation results that for the hydrophobic pore wall the slippage surely occurs on the adsorbed layer-pore wall interface, however for the hydrophilic pore wall, the slippage can occur on either of the two interfaces, dependent on the competition between the interfacial shear strength on the adsorbed layer-pore wall interface and that on the adsorbed layer-continuum fluid interface. Since the slippage on the adsorbed layer-pore wall interface can be designed while that on the adsorbed layer-continuum fluid interface can not, the former slippage can result in the flux through the nanopore much higher than the latter slippage by designing a highly hydrophobic pore wall surface. The obtained results are of significant interest to the design and application of the interfacial slippage in nanoporous filtration membranes for both improving the flux and conserving the energy cost.

LSGM계 고체산화물 연료전지의 전해질-음극 사이의 계면안정성 (Interfacial Stability Between Anode and Electrolyte of LSGM-Based SOFCs)

  • 김광년;문주호;손지원;김주선;이해원;이종호;김병국
    • 한국세라믹학회지
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    • 제42권7호
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    • pp.509-515
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    • 2005
  • Interfacial reactions at LSGM electrolyte and NiO-GDC anode interfaces were thoroughly investigated with Environmental Scanning Electron Microscopy (ESEM-PHlLIPS XL-30) and Energy Dispersive X-ray (EDX-Link XL30). According to the analysis, serious reaction zone was observed at LSGM/NiO-GDC interface. It was found that the reaction layer was originated from the chemical reaction between NiO and LSGM. The reaction products were identified as La deficient form of LSGM based perovskite and Ni-La-O compounds such as LaSrGa$_{3}$O$_{7}$ and LaNiO$_{3}$ from the X-Ray Diffraction (XRD, Philips) analysis. According to the electrical characterization, interfacial layer was very electrically resistive which would be the cause of high internal resistance and low power generating characteristic of the unit cell.

Fast transport with wall slippage

  • Tang, Zhipeng;Zhang, Yongbin
    • Membrane and Water Treatment
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    • 제12권1호
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    • pp.37-41
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    • 2021
  • This paper presents the multiscale calculation results of the very fast volume transport in micro/nano cylindrical tubes with the wall slippage. There simultaneously occurs the adsorbed layer flow and the intermediate continuum fluid flow which are respectively on different scales. The modeled fluid is water and the tube wall is somewhat hydrophobic. The calculation shows that the power loss on the tube no more than 1.0 Watt/m can generate the wall slippage even if the fluid-tube wall interfacial shear strength is 1 MPa; The power loss on the scale 104 Watt/m produces the volume flow rate through the tube more than one hundred times higher than the classical hydrodynamic theory calculation even if the fluid-tube wall interfacial shear strength is 1 MPa. When the wall slippage occurs, the volume flow rate through the tube is in direct proportion to the power loss on the tube but in inverse proportion to the fluid-tube wall interfacial shear strength. For low interfacial shear strengths such as no more than 1 kPa, the transport in the tube appears very fast with the magnitude more than 4 orders higher than the classical calculation if the power loss on the tube is on the scale 104 Watt/m.

Quantitative Analysis of Ultrathin SiO2 Interfacial Layer by AES Depth Profilitng

  • Soh, Ju-Won;Kim, Jong-Seok;Lee, Won-Jong
    • The Korean Journal of Ceramics
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    • 제1권1호
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    • pp.7-12
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    • 1995
  • When a $Ta_O_5$ dielectric film is deposited on a bare silicon, the growth of $SiO_2$ at the $Ta_O_5$/Si interface cannot be avoided. Even though the $SiO_2$ layer is ultrathin (a few nm), it has great effects on the electrical properties of the capacitor. The concentration depth profiles of the ultrathin interfacial $SiO_2$ and $SiO_2/Si_3N_4$ layers were obtained using an Auger electron spectroscopy (AES) equipped with a cylindrical mirror analyzer (CMA). These AES depth profiles were quantitatively analyzed by comparing with the theoretical depth profiles which were obtained by considering the inelastic mean free path of Auger electrons and the angular acceptance function of CMA. The direct measurement of the interfacial layer thicknesses by using a high resolution cross-sectional TEM confirmed the accuracy of the AES depth analysis. The $SiO_2/Si_3N_4$ double layers, which were not distinguishable from each other under the TEM observation, could be effectively analyzed by the AES depth profiling technique.

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Photoreflectance 측정에 의한 $In_{0.1}Ga_{0.9}As/GaAs$ 계면의 특성 조사 (A study of interfacial characteristics for $In_{0.1}Ga_{0.9}As/GaAs$ by photoreflectance measurement)

  • 이철욱;김인수;손정식;김동렬;임재영;배인호
    • 한국진공학회지
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    • 제6권3호
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    • pp.263-266
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    • 1997
  • $In_{0.1}Ga_{0.9}As$/GaAs의 계면 특성을 상온에서 photoreflectance(PR) 측정을 통하여 연구 하였다. 에피층의 두께가 증가함에 따라 PR 신호에서 Franz-Keldysh oscillation(FKO)의 주 기가 감소하였고, 계면 전기장은 감소되었다. 이것은 InGaAs와 GaAs의 이종접합계면 부근 에서 격자부정합에 의한 결함이 증가되었기 때문으로 생각된다. 에피층의 두께가 300$\AA$보다 적은 경우 두께가 얇아짐에 따라 InGaAs층이 임계 두께에 가까워져 strain의 영향으로 밴 드갭 에너지가 크게 이동하였다.

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고강도 내마모 금속간화합물/Al기지 복합재료의 개발을 위한 기초연구 (A Study on Development of High Strength and Wear Resistance Intermetallic Compounds/Al Matrix Composites)

  • 최답천;이경구;이호종;기회봉
    • 한국주조공학회지
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    • 제13권3호
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    • pp.276-284
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    • 1993
  • The interfacial phenomena between intermetallic compounds and Al matrix have been studied at $680^{\circ}C$ for various holding time under argon atmosphere. Model experiments were performed using Fe, Ni and Ti wire to observe the interfacial phenomena. The interfacial phenomena between intermetallic compounds and Al matrix were analysed by optical microscope, SEM and EDX. The results of EDX and XRD showed that the interfacial zones of intermetallic compounds/Al matrix were composed of several intermetallic layers. The reaction layer was varied with holding time and heating temperature. The investigation of interfacial zones in the specimen as a function of heat treatment time at $680^{\circ}C$ indicated that the best heat treatment condition for squeeze casting was $680^{\circ}C$ for 5min.

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Analyze of the interfacial stress in reinforced concrete beams strengthened with externally bonded CFRP plate

  • Hadji, Lazreg;Daouadji, T. Hassaine;Meziane, M. Ait Amar;Bedia, E.A. Adda
    • Steel and Composite Structures
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    • 제20권2호
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    • pp.413-429
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    • 2016
  • A theoretical method to predict the interfacial stresses in the adhesive layer of reinforced concrete beams strengthened with externally bonded carbon fiber-reinforced polymer (CFRP) plate is presented. The analysis provides efficient calculations for both shear and normal interfacial stresses in reinforced concrete beams strengthened with composite plates, and accounts for various effects of Poisson's ratio and Young's modulus of adhesive. Such interfacial stresses play a fundamental role in the mechanics of plated beams, because they can produce a sudden and premature failure. The analysis is based on equilibrium and deformations compatibility approach developed by Tounsi. In the present theoretical analysis, the adherend shear deformations are taken into account by assuming a parabolic shear stress through the thickness of both the reinforced concrete beam and bonded plate. The paper is concluded with a summary and recommendations for the design of the strengthened beam.