• Journal of the Korean Society of Safety
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• v.6 no.2
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• pp.5-13
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• 1991

In this paper, the interfacial stress intensity factors( $K_{i}$＝ $K_1$＋i $K_2$) for the edge interface crack in the dissimilar materials(isotropic-isotropic materials, isotropic-composite materials) were analysed by BEM(Boundary Element Method). The fatigue crack growth behaviour was investigated by load constant fatigue test. From the experimental results, the relationship between da/dN and interfacial stress intensity facto, ( $K_{i}$ or $K_1$) can be expressed by Paris'law for homogeneous materials.s.s.

• International Journal of Automotive Technology
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• v.5 no.4
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• pp.303-309
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• 2004

In this paper, an interfacial crack length has been detected by using the ultrasonic attenuation coefficient on the adhesively bonded double-cantilever beam (DCB) joints. The correlations between energy release rates which were investigated by experimental measurement, the boundary element method (BEM) and Ripling's equation are compared with each other. The experimental results show that the interfacial crack length for the ultrasonic attenuation coefficient and energy release rate increases proportionally. From the experimental results, we propose a method to detect the interfacial crack length by using the ultrasonic attenuation coefficient and discuss it.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.03a
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• pp.220-226
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• 1998

In this pater, a method of strength evaluation applying fracture mechanics in adhesively bonded joints of A1/A1 materials was investigated. Various adhesively bonded joints of double-cantilever beam with a interfacial crack in its adhesive layer were prepared for the fracture toughness test of comprehensive mixed mode conditions from nearly pure mode I to mode II. The experiment of fracture toughness was carried out under various mixed mode conditions with an interfacial crack and critical energy release rate, Gc by the experimental measurements of compliances was determined. From the results, fracture toughness on mixed mode with an interfacial crack is well characterized by strain energy release rate and a method of strength evaluation by the fracture toughness in adhesively bonded joints of A1/A1 materials was discussed.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.6
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• pp.949-958
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• 2001

A semi-infinite interfacial crack propagated with constant velocity in two bonded anisotropic strips under out-of-plane clamped displacements is analyzed. Using Fourier integral transform the problem is formulated and the Wiener-Hopf equation is derived. By solving this equation the asymptotic stress and displacement fields near the crack tip are obtained, where the results get more general expressions applicable not only to isotropic/orthotropic materials but also to the extent of the anisotropic material having one plane of elastic symmetry for the interfacial crack. The dynamic stress intensity factor is obtained as a closed form, which is decreased as the velocity of crack propagation increases. The critical velocity where the stress intensity factor comes to zero is obtained, which agrees with the lower value between the critical values of parallel crack merged in the material 1 and 2 adjacent to the interface. Using the near tip fields of stresses and displacements, the dynamic energy release rate is also obtained as a form of the stress intensiy factor.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.12
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• pp.1897-1905
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• 2004

In many part of machines or structures that made of bimaterial bonded with two dissimilar materials, most failures occur at their interface. Therefore, the accurate analysis of fracture characteristics and the evaluation of mechanical strength for interfacial crack are essential when we design those structures. In this research, stress and displacement components in the vicinity of stationary interfacial crack tip in the two dissimilar isotropic bimaterials are established. Hereafter, the stress components established in this research can be applied to the photoelastic hybrid method which can be used to analyze the fracture behavior of the two dissimilar isotropic bimaterials.

• Computational Structural Engineering
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• v.10 no.1
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• pp.129-134
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• 1997

Interfacial stress singularity in a unidirectional two-dimensional laminate model consisting of an elastic fiber and a viscoelastic matrix has been investigated using the time-domain boundary element method. First, the interfacial singular stresses between the fiber and the matrix of a unidirectional laminate subjected to a uniform transverse tensile strain have been investigated near the free surface, but without any defect or any edge crack. Such a stress singularity might lead to fiber-matrix debonding or interfacial edge cracks. Then, the overall stress intensity factor for the case of a small interfacial edge crack of length a has been computed.

• Transactions of the Korean Society of Automotive Engineers
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• v.12 no.1
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• pp.130-137
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• 2004

The ultrasonic attenuation coefficients were measured by interfacial crack length in the adhesive components of double-cantilever beam(DCB). The energy release rate, G, was obtained by the experimental measurement of compliance. The numerical analysis by the boundary element method(BEM) and Ripling's equation was investigated. The experimental results represent that the relation between interfacial crack length for the ultrasonic attenuation coefficient and energy release rate is increased proportionally. A measurement method of the interfacial crack length by the ultrasonic attenuation coefficient was proposed and discussed.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.9 s.180
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• pp.2174-2183
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• 2000

In this paper, the evaluation method of interfacial fracture toughness to apply the fracture toughness was investigated in adhesively bonded joints of AI/Ced./A1. Four types of adhesively bonded double-cantilever beam(DCB) joints with the interface crack were prepared for the test of interfacial fracture toughness. The experiments to measure the interfacial fracture toughness were performed under the various mixed-mode conditions. The critical energy release rate, Gc, was obtained by the experimental measurement of compliances. From the experimental results, the interfacial fracture toughness for the mixed-mode specimens is well characterized by the energy release rate, and the method of strength evaluation by the interfacial fracture toughness was discussed in adhesively bonded joints.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.7
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• pp.1055-1063
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• 2001

When the interfacial crack of isotropic/orthotropic bi-materials is propagated with constant velocity along the interface, stress and displacement components are derived in this research. The dynamic photoelastic experimental hybrid method for the bimaterial is introduced. It is assured that stress components and dynamic photoelastic hybrid developed in this research are valid. Separating method of stress components is introduced from only dynamic photoelastic fringe patterns. Crack propagating velocity of interfacial crack is 69∼71% of Rayleigh wave velocity of epoxy resin. The near-field stress components of bonded interface of bimaterial are similar with those of pure isotopic material and two dissimilar isotropic bimaterials under static or dynamic loading, but very near-field stress components of bonded interface of bimaterial are different from those.

• Structural Engineering and Mechanics
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• v.52 no.1
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• pp.1-17
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• 2014

An interfacial penny-shaped crack between piezoelectric layer and elastic half-space subjected to mechanical and electric loads is investigated. Using Hankel transform technique, the mixed boundary value problem is reduced to a system of singular integral equations. The integral equations are further reduced to a system of algebraic equations with the aid of Jacobi polynomials. The stress intensity factor and energy release rate are determined. Numerical results reveal the effects of electric loadings and material parameters of composite on crack propagation and growth. The results seem useful for design of the piezoelectric composite structures and devices of high performance.