• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2002년도 하계학술대회 논문집
• /
• pp.439-442
• /
• 2002

The interface between two different materials in the insulation systems is the weak-link in the underground power transmission systems, In this paper, Optimum conditions of the interface between Epoxy and EPDM is studied. The variation factor condition of interface is roughness of surface, spreading of oils, interfacial pressure and temperature. The breakdown times under the constant voltage below the breakdown voltage were also gained. The breakdown voltage at the after laying time equivalent to is calculated by the V-t characteristic and the inverse power law. When this is done, the characteristic life exponent n is used and the long time breakdown voltage can be evaluated.

• 대한전기학회논문지:전기물성ㆍ응용부문C
• /
• 제48권5호
• /
• pp.281-284
• /
• 1999

In this paper, the electrical conduction, breakdown strength and dielectric properties were investigated in the interfaces of PET films. The volume resistivity and breakdown strength were decreased; especially the specimens with semiconductive layer showed the lowest breakdown strength. This decrease of electrical properties was appeared by increasing charge density in inhomogeneous layer of PET. The dielectric properties of PET did not show significant difference with PET/PET but the films with semiconductive interface layer showed the increase in capacitance and $tan\delta$ was affected by the PET rather than semiconductive layer. It is assumed that the variation of $tan\delta$ was affected by the dielectric polarization and the leakage current(charge).

• 전자공학회논문지A
• /
• 제29A권1호
• /
• pp.41-47
• /
• 1992

In SFB Process, after 110$0^{\circ}C$ annealing in wet OS12T(95$^{\circ}C$ HS12TO bubbling) atmosphere, the existence of the interfacial oxide film in micro-gap at Si-Si bonding interface was identified. The angle lapping/staining and SEM morphologies of bonding interface showed that the growing behavior of interfacial oxide made a contribution to eliminate the micro-gaps having a width of 200-300$\AA$. In case of the diodes composed of p-n wafer pairs made by SFB processes, the annealed one in wet OS12T atmosphere exhibited a dielectric breakdown phenomena of interfacial oxide at 37-40 volts d.c.

• 한국전기전자재료학회논문지
• /
• 제26권10호
• /
• pp.726-730
• /
• 2013

In order to develop a high voltage insulation material, spherical silicas with two average particle sizes of 5 ${\mu}m$ and 20 ${\mu}m$ were mixed in different mixing ratios (1:0, 0.7:0.3, 0.5:0.5, 0.3:0.7, 0:1) and their total filling content was fixed at 65 wt%. In order to observe the dispersion of the spherical silicas and the interfacial morphology between silica and epoxy matrix, field emission scanning electron microscope (FE-SEM) was used. The electrical insulation breakdown strength was estimated in sphere-plate electrodes with different insulation thicknesses of 1, 2, and 3 mm. Electrical insulation breakdown strength decreased with increasing mixing ratio of 5/20 ${\mu}m$ and the thickness dependence of the breakdown strength was also observed. The tensile strength of the neat epoxy was 82.8 MPa as average value and its increased with decreasing particles size and that of epoxy/silica (2 ${\mu}m$) was 107 MPa, which was 130.8% higher value.

• Transactions on Electrical and Electronic Materials
• /
• 제14권1호
• /
• pp.39-42
• /
• 2013

The effects of particle size on the mechanical and electrical properties of epoxy/spherical silica composites were studied. The silica particle sizes were varied from 5 to 30 ${\mu}m$ and the filler content was fixed to 60 wt%. Tensile and flexural tests were carried out and the interfacial morphology was observed by scanning electron microscopy (SEM). The electrical insulation breakdown strength was estimated using sphere-sphere electrodes with different insulation thicknesses of 1, 2 and 3 mm. The tensile strength and flexural strength increased with decreasing particle size, while electrical insulation breakdown strength increased with increasing particle size.

• 한국전기전자재료학회논문지
• /
• 제20권2호
• /
• pp.118-123
• /
• 2007

The purpose of this work was to investigate the design and fabrication process effects on electrical properties in high capacitance multilayer ceramic capacitor (MLCC) with nickel electrode. Dielectric breakdown voltage and insulation resistance value were decreased with increasing stack layer number, but dielectric constant and capacitance were increased. With increasing green sheet thickness, dielectric breakdown voltage, C-V and I-V properties were also increased. The major reasons of the effects were thought to be the defects generated extrinsically during fabrication process and interfacial reactions formed between nickel electrode and dielectric layer. These investigations clearly showed the influence of both green sheet thick ness and stack layer number on the electrical properties in fabricating the MLCC.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1997년도 하계학술대회 논문집 C
• /
• pp.1503-1506
• /
• 1997

The main fault in this interface is that power cable insulating materials are mainly composed of a double layered structure, XLPE/EPDM laminates in cable joint. In this paper, we instituted the interface of normal and degassed XLPE/EPDM and then investigated the breakdown and conduction characteristics as a function of heat treatment time. The results showed that conduction and breakdown strength was influenced by volatile crosslinking by-products which remained inside the insulating material during the production of XLPE and EPDM, especially during heat treatment process. And micro voids and surface roughness also influenced the conduction current and breakdown strength.

• 한국정보통신학회:학술대회논문집
• /
• 한국해양정보통신학회 2001년도 추계종합학술대회
• /
• pp.724-728
• /
• 2001

본 연구에서는 에폭시 수지를 시료로 선정, 5 종의 배합비로 제작한 시편에 대해 절연 파괴 실험을 하여 얻어진 데이터를 수명 평가나 파괴 통계에서 주로 활용하는 와이블 분포식을 이용, 임의의 허용 파괴 확률에서의 허용인가 전계값을 추정, 안전성을 판단하기 위해 경년 열화데이터의 통계 처리 방법을 제안하였다. 그 결과, 경화제 비율이 증가하면 에폭시 경화물의 에스터화로 인해 가교 밀도가 증가함으로써 저온에서의 파괴 강도가 높아졌으며, 유리 전이 온도(Tg) 영역인 11$0^{\circ}C$ 부근에서는 분자 운동이 활발해짐으로써 급격히 파괴 강도가 저하하였다. 또한, 충진제를 첨가한 경우 접합 계면에 전자가 가속되어 전반적인 파괴 강도는 무충진에 비해 낮게 나타났으며, 실란 처리를 한 경우에는 계면 접합 상태가 개선되어 충진제만을 첨가한 시료보다 좋은 절연성을 나타냈다. 와이블 분포의 분석으로 부터 기기 절연의 허용 파괴 확률을 0.1 % 이하로 낮추기 위해서는 허용인가 전계값이 21.5 ㎹/cm 이하가 되어야함을 알 수 있었다.

• 한국정보통신학회:학술대회논문집
• /
• 한국해양정보통신학회 2002년도 추계종합학술대회
• /
• pp.779-783
• /
• 2002

변성기용 절연 재료로 사용되는 에폭시 수지를 시료로 선정, 5종의 배합비로 제작한 시편에 대해 절연 파괴 실험을 하며, 얻어진 데이터를 와이블 분포식을 이용, 경년 열화(經年劣和) 데이터의 통계 처리 방법을 제안하였다. 경화제 비율이 증가하면 에폭시 경화물의 에스터화로 인해 가교 밀도가 증가함으로써 저온에서의 파괴 강도가 높아졌으며, 유리 전이 온도(Tg) 영역인 11$0^{\circ}C$ 부근에서는 분자 운동이 활발해짐으로써 급격히 파괴 강도가 저하하였다. 또한, 충진제를 첨가한 경우 접합 계면에 전자가 가속되어 전반적인 파괴 강도는 무충진에 비해 낮게 나타났으며, 실란 처리를 한 경우에는 계면 접합 상태가 개선되어 충진제만을 첨가한 시료보다 좋은 절연성을 나타냈다. 와이블 분포의 분석으로부터 기기 절연의 허용 파괴 확률을 0.1% 이하로 낮추기 위해서는 허용인가 전계값이 21.5 MV/cm 이하가 되어야함을 알 수 있었다.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1998년도 추계학술대회 논문집 학회본부 C
• /
• pp.938-940
• /
• 1998

In order to improve insulating character and ability of insulating system of power apparatus, the interfacial and complex structure is widely used. However, the interface or complex structure of insulation materials is reported as a weak point which causes breakdown. As the interface of insulation system degrades its electrical property and eventually causes a failure, the datailed phenomenon analysis is reported. The object of this paper is to evaluate dielectric property of PET film with the interface. The $tan{\delta}$ increased with the existence of semiconducting layer and showed prominent decrease as a function of temperature. Also, the $tan{\delta}$ showed prominent increase as a function of frequency. The dielectric properties of interfacial were affected by the interface characteristics.