• 대한금속재료학회지
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• 제46권10호
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• pp.672-682
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• 2008

The resistance spot welding of TRIP590 steels was investigated to enhance understanding of weld fracture during tensile-shear strength (TSS) test. The main failure modes for spot welds of TRIP590 steels were nugget pullout and interfacial fracture. The peak load to cause a weld interfacial failure was found to be related to fracture toughness of the weld and the weld diameter. Although interfacial fracture occurred in the samples, the load carrying capacity of the weld was high and not significantly affected by the fracture mode. Substantial part of the weld exhibits the characteristic dimple (or elongated dimple) fractures on interfacial fractured surface, in spite of the high hardness values associated with the martensite microstructures. The high load-bearing ability of the weld is directly associated with the area of ductile fracture occurred in weld. Therefore, the judgment of the quality of resistance spot welds in TRIP590 steels, the load carrying capacity of the weld should be considered as an important factor than fracture mode.

• 센서학회지
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• 제31권4호
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• pp.218-227
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• 2022

Triboelectric nanogenerators (TENGs), a new green energy, that have various potential applications, such as energy harvesters and self-powered sensors. The output performance of TENGs has been improving rapidly, and their output power significantly increased since they were first reported owing to improved triboelectrification materials and interfacial material engineering. Because the operation of a TENG is based on contact electrification in which electric charges are exchanged at the interface between two materials, its output can be increased by increasing the contact area and charge density. Material surface modification with microstructures or nanostructures has increased the output performance of TENGs significantly because not only does the sharp micro/nano morphology increases the contact area during friction, but it also increases the charge density. Chemical treatment in which ions or functional groups are added has also been used to improve the performance of TENGS by modifying the work functions, charge densities, and dielectric constants of the triboelectric materials. In addition, ultrahigh output power from TENGs without using new materials or treatments has been obtained in many studies in which special structures were designed to control the current release or to collect the charge current directly. In this review, we discuss physical and chemical treatments, bulk modifications, and interfacial engineering for enhancing TENG performance by improving contact electrification and electrostatic induction.

• Nuclear Engineering and Technology
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• 제54권4호
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• pp.1495-1507
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• 2022

The improvement of thermal-hydraulic analysis techniques is essential to ensure the safety and reliability of nuclear power plants. The one-dimensional two-fluid model has been adopted in state-of-the-art thermal-hydraulic system codes. Current constitutive equations used in the system codes reach a mature level. Some exceptions are the partition method of wall friction in the momentum equation of the two-fluid model and the interfacial drag force model for a horizontal two-phase flow. This study is focused on deriving the partition method of wall friction in the momentum equation of the two-fluid model and modeling the interfacial drag force model for a horizontal bubbly flow. The one-dimensional momentum equation in the two-fluid model is derived from the local momentum equation. The derived one-dimensional momentum equation demonstrates that total wall friction should be apportioned to gas and liquid phases based on the phasic volume fraction, which is the same as that used in the SPACE code. The constitutive equations for the interfacial drag force are also identified. Based on the assessments, the Rassame-Hibiki correlation, Hibiki-Ishii correlation, Ishii-Zuber correlation, and Rassame-Hibiki correlation are recommended for computing the distribution parameter, interfacial area concentration, drag coefficient, and relative velocity covariance of a horizontal bubbly flow, respectively.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 1993년도 추계학술강연 및 발표대회강연 및 발표논문 초록집
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• pp.3-3
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• 1993

In mechanical testing of W-Ni-Pe heavy alloys, the cracks nucleate at W/W interface and propagate through W/ Imatrix interface or through matrix phase together with the cleavage of W grains. The mechanical properties can therefore be improved by control of the interfacial strength and area. In this presentation, some experimental result and techniques on this subject will be reviewed and discussed. The hydrogen embrittlement caused by the hydrogen segregation at interfaces during sintering in an hydrogen atmosphere can be removed by an heat-treattnent in vacuum or in an inert atmosphere. The heat-treatment condition can be estimated by using a diffusion equation for a cylindrical shape. The mechanical properties, in particular the impact property, are degraded by the segregation of non-metallic impurities, such as Sand P. The degradation can be prevented by adding a fourth element, such as La or Ca, active with the non-metallic impurities. The cyclic heat-treatment at usual heat-treattnent tempemture causes the penetration of matrix between W/W grain boundaries and results in remarkable increase in impact energy. This is due to an increase in the area of ductile failure during the impact test. The instability of W/matrix interface casued by addition of Mo or Re can be controlled by using W powders of different size. The increase in the interfacial area in found to be related to the presence of non-equilibrium pure W gmins among W(Mo or Re) solid solution gmins.

• 한국주조공학회지
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• 제17권3호
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• pp.245-251
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• 1997

Solderability, interfacial reaction and mechanical properties of joint between Sn-Bi-Ag base solder and Cu-substrate were studied. Solders were subjected to aging treatments to see the change of mechanical properties for up to 30 days at $100^{\circ}C$, and then also examined the changes of microstructure and morphology of interfacial compound. Sn-Bi-Ag base solder showed about double tensile strength comparing to Pb-Sn eutectic solder. Addition of 0.7wt%Al in the Sn-Bi-Ag alloy increase spread area on Cu substrate under R-flux and helps to reduce the growth of intermetallic compound during heat-treatment. According to the aging experiments of Cu/solder joint, interfacial intermetallic compound layer was exhibited a parabolic growth to aging time. The result of EDS, it is supposed that the soldered interfacial zone was composed of $Cu_6Sn_5$.

• Tribology and Lubricants
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• 제34권3호
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• pp.115-122
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• 2018

Chemical mechanical polishing (CMP) is a hybrid processing method in which the surface of a wafer is planarized by chemical and mechanical material removal. Since mechanical material removal in CMP is caused by the rolling or sliding of abrasive particles, interfacial friction during processing greatly influences the CMP results. In this paper, the trend of tribology research on CMP process is discussed. First, various friction force monitoring methods are introduced, and three elements in the CMP tribo-system are defined based on the material removal mechanism of the CMP process. Tribological studies on the CMP process include studies of interfacial friction due to changes in consumables such as slurry and polishing pad, modeling of material removal rate using contact mechanics, and stick-slip friction and scratches. The real area of contact (RCA) between the polishing pad and wafer also has a significant influence on the polishing result in the CMP process, and many researchers have studied RCA control and prediction. Despite the fact that the CMP process is a hybrid process using chemical reactions and mechanical material removal, tribological studies to date have yet to clarify the effects of chemical reactions on interfacial friction. In addition, it is necessary to clarify the relationship between the interface friction phenomenon and physical surface defects in CMP, and the cause of their occurrence.

• 한국전기전자재료학회논문지
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• 제11권1호
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• pp.18-25
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• 1998

G $d_{0.2}$C $e_{0.8}$ $O_{1.9}$(CGO) for electrolyte and L $a_{0.5}$S $r_{0.5}$Mn $O_3$(LSM50) for cathode in Solid Oxide Fuel Cells(SOFC) were synthesized by citrate process. Specimens were prepared with sintering temperatures at 110$0^{\circ}C$, 120$0^{\circ}C$ and 130$0^{\circ}C$, which were fabricated by slurry coating with citric acid contents. Interfacial resistance was measured between cathode and electrolyte using AC-impedance analyzer. With various citric acid content, the degree of agglomeration for the initial particles changed. Also sintering temperature changed the particle size and the degree of densification of cathode. Factors affecting the interfacial resistance were adherent degree of the electrolyte and cathode, distribution of TPB(three phase boundaries, TPB i.e., electrolyte/electrode/gas phase area) and porosity of cathode. By increasing the sintering temperature, particle size and densification of the cathode were increased. And then, TPB area which occurs catalytic reaction was reduced and so interfacial resistance was increased.sed.sed.d.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.1622-1624
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• 2006

We introduce a modified UV-imprint lithography, a resin transfer from the template to the substrate. We analyzed this method by considering the surface and interfacial free energies of the template-resinsubstrate system. This technique is purely fast and applicable to large area patterning.

• 폴리머
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• 제25권4호
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• pp.587-593
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• 2001

본 연구에서는 red mud(RM)를 0.1, 1, 그리고 5M 의 H$_3PO_4$ 용액으로 화학적 표면처리하여 에폭시/RM 나노복합재료를 제조하였으며, RM 표면의 pH, 표면 산-염기도, 표면적, 그리고 기공도를 이용하여 표면처리에 의한 영향을 분석하였다. 또한, 임계응력 세기인자(K$_{IC}$)를 통하여 제조된 복합재료의 기계적 계면물성을 조사하였다. 실험결과로부터, 표면처리에 의한 RM의 표면은 hydroxyl 등의 산성관능기 그룹의 생성과 금속산화물의 반응으로 인하여 표면 산도가 증가하고, 미세기공 및 중기공 구조가 발달하여 비표면적이 증가되었다. K(IC)를 이용한 RM의 기계적 계면성질은 비표면적이 증가함과 동시에 표면산도가 증가함으로 염기성 매트릭스와의 계면결합력이 증대되어 순수 에폭시와 처리되지 않은 에폭시/RM 복합재료보다 더 우수한 기계적 계면물성을 나타내었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2015년도 제49회 하계 정기학술대회 초록집
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• pp.61.2-61.2
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• 2015

In the past decades, green energy, such as solar energy, wind power, hydropower, biomass energy, geothermal energy, and so on, has been widely investigated and developed to solve energy shortage. Recently, organic solar cells have attracted much attention, because they have many advantages, including low-cost, flexibility, light weight, and easy fabrication [1-3]. Organic solar cells are as a potential candidate of the next generation solar cells. In this abstract, to improve the power conversion efficiency and the stability, the inverted polymer solar cells with various structures were developed [4-6]. The novel cell structures included the P3HT:PCBM inverted polymer solar cells with AZO nanorods array, with pentacene-doped active layer, and with extra P3HT interfacial layer and PCBM interfacial layer. These three difference structures could respectively improve the performance of the P3HT:PCBM inverted polymer solar cells. For the inverted polymer solar cells with AZO nanorods array as the electronic transportation layer, by using the nanorod structure, the improvement of carrier collection and carrier extraction capabilities could be expected due to an increase in contact area between the nanorod array and the active layer. For the inverted polymer solar cells with pentacene-doped active layer, the hole-electron mobility in the active layer could be balanced by doping pentacene contents. The active layer with the balanced hole-electron mobility could reduce the carrier recombination in the active layers to enhance the photocurrent of the resulting inverted polymer solar cells. For the inverted polymer solar cells with extra P3HT and PCBM interfacial layers, the extra PCBM and P3HT interfacial layers could respectively improve the electron transport and hole transport. The extra PCBM interfacial layer served another function was that led more P3HT moving to the top side of the absorption layer, which reduced the non-continuous pathways of P3HT. It indicated that the recombination centers could be further reduced in the absorption layer. The extra P3HT interfacial layer could let the hole be more easily transported to the MoO3 hole transport layer. The high performance of the novel P3HT:PCBM inverted polymer solar cells with various structures were obtained.