• Journal of the Korean Society for Heat Treatment
• /
• v.33 no.6
• /
• pp.284-289
• /
• 2020

Since the dissimilar bonded interface usually consists of intermetallic compounds (IMCs) layer and cracks, their mechanical and electrical properties can be influenced by microstructure at interface between two different metals. In this study, the friction welded Cu-Al busbar, which is widely used to connect a secondary battery and their component, is selected to analyze the influence of interfacial characteristic on their tensile strength and electric conductivity. Then, the electrical characteristics of Cu busbar and Cu-Al busbar were investigated by thermal flow analysis and temperature rise test. In addition, the relationship between the maximum saturation temperature and the electrical conductivity were discussed in terms of interfacial characteristics of the friction welded Cu-Al busbar.

• Korean Journal of Materials Research
• /
• v.11 no.12
• /
• pp.1086-1090
• /
• 2001

Composition effects on microstructure and metallizing properties of the alumina sintered body were evaluated to develop the metallized alumina tubes having superior properties for electronic devices. SEM observation revealed that resultant micrographs and fractographs were varied with composition chance of additives and $SiO_2$-rich specimens showed better microstructural characteristics with uniform distribution of fine and round particles than other CaO-rich or MgO-rich ones. The resultant interfacial microstructure of the $SiO_2$-rich metallized alumina tubes also showed good metallizing properties with no defects between layers and uniform thickness of metallizing layer.

• Proceedings of the Korea Concrete Institute Conference
• /
• 1999.10a
• /
• pp.131-134
• /
• 1999

Microstructure modification and electrochemical properties are investigate to estimate the effects of internal chlorides on the steel corrosion in the blended cement systems. According to the test results, slag cement system showed high chloride binding capacity and low corrosion rate. The impedance data showed three distince arcs from lowest(mHz) frequency to highest (MHz) frequency due to product layer, interfacial reaction and bulk matrix. Through the microstructural investigation, fine steel-matrix interface of slag cement system was observed but rough steel-matrix interface of OPC system was observed. Friedel's salt was thought that the substantial material contributed to the chloride binding of slag cement system.

• Journal of the Korean Vacuum Society
• /
• v.8 no.2
• /
• pp.157-164
• /
• 1999

The post ion implantation has been applied to modify early-grown BN layer and improve the adhesion of the BN films. The effect of ion implantation doses on microstructure and interlayer was investigated by FTIR and HRTEM. And the hardness and delamination life time of N+-implanted BN films were measured. With increasing the ion dose up to $5.0\times10^{15}\textrm{atoms/cm}^2$,the change of IR spectrum is observed. At $5.0\times10^{16}\textrm{atoms/cm}^2$, a drastic transition of cubic phase into hexagonal phase is detected. The change of microstructure of early-grown layers by ion implantation is confirmed using HRTEM. Both microhardness and delamination life time of BN films increase with ion dose. The modification model of early-grown BN layers is briefly discussed based on the displacement per atom and excess boron in the BN film induced by ion irradiation.

• Journal of the Korean institute of surface engineering
• /
• v.32 no.4
• /
• pp.503-512
• /
• 1999

The crystal structure and the microstructure of the intermetallic compounds formed in the interface between In solder and Au/Ni/Ti thin films have been investigated by XRD, SEM, and TEM. Indium solder was deposited on the Au/Ni/Ti thin films/Si substrate by evaporation. The heat treatments simulated the flip chip solder joining were performed in RTA system or in furnace. $Auln_2$ phase is formed in all specimens.$ In_{27}$ $Ni_{10}$ and/or $In_{X}$ $Ni_{Y}$ phase are formed in the interface between $Auln_2$ and Ni depending the heat treatment conditions.

• Journal of the Korean Recycled Construction Resources Institute
• /
• v.9 no.3
• /
• pp.268-275
• /
• 2021

The three factors that determine the strength of concrete are the strength of cement paste, aggregate and ITZ(Interfacial Transition Zone) between aggregate and cement paste. Out of these, the strength of ITZ is the most vulnerable. ITZ is formed in 10~50㎛, the ratio of calcium hydroxide is high, and CSH appears low ratio. A high calcium hydroxide ratio causes a decrease in the bond strength of ITZ. ITZ is due to further weak area. The problem of ITZ appears as a more disadvantageous factor when it used lightweight aggregate. The previous study of ITZ properties have measured interfacial toughness, identified influencing factors ITZ, and it progressed SEM and XRD analysis on cement matrix without using coarse aggregates. also it was identified microstructure using EMPA-BSE equipment. However, in previous studies, it is difficult to understand the microstructure and mechanical properties. Therefore, in this study, a method of measuring electrical resistance using EIS(Electrochemical Impedance Spectroscopy) measuring equipment was adopted to identify the ITZ between natural aggregate and lightweight aggregate, and it was tested the change of ITZ by surface coating of lightweight aggregate with ground granulated blast furnace slag. As a result, the compressive strength of natural aggregate and lightweight aggregate appear high strength of natural aggregate with high density, surface coating lightweight aggregate appear strength higher than natural aggregate. The electrical resistivity of ITZ according to the aggregate appeared difference.

• Nuclear Engineering and Technology
• /
• v.52 no.6
• /
• pp.1243-1251
• /
• 2020

Irradiation-induced damage of binderless nanoporous-isotropic graphite (NPIG) prepared by isostatic pressing of mesophase carbon microspheres for molten salt reactor was investigated by 3.0 MeV He⁺ irradiation at room temperature and high temperature of 600 ℃, and IG-110 was used as the comparation. SEM, TEM, X-ray diffraction and Raman spectrum are used to characterize the irradiation effect and the influence of temperature on graphite radiation damage. After irradiation at room temperature, the surface morphology is rougher, the increase of defect clusters makes atom flour bend, the layer spacing increases, and the catalytic graphitization phenomenon of NPIG is observed. However, the density of defects in high temperature environment decreases and other changes are not obvious. Mechanical properties also change due to changes in defects. In addition, SEM and Raman spectra of the cross section show that cracks appear in the depth range of the maximum irradiation dose, and the defect density increases with the increase of irradiation dose.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.39 no.5
• /
• pp.449-453
• /
• 2015

Recently, surfaces with micro and nano structures are the focus of various research and engineering fields to enhance wetting characteristics of the surfaces. Hydrophilic surfaces with hierarchical structures are generally characterized by the interfacial behavior of water droplets. In this study, the interfacial behavior of water droplets is experimentally investigated considering the scale of structures. Using the dry etching and conventional lithography method, quantitative hierarchical structured surfaces are developed. The behavior of the liquid-vapor interface on the test sections is visualized using an automatic goniometer and a high-speed camera. On the basis of the visualized data, the interfacial behavior of water droplets is intensively investigated according to surface geometrical characteristics.

• Korean Journal of Materials Research
• /
• v.18 no.4
• /
• pp.204-210
• /
• 2008

$1.5\;{\mu}m$-thick copper films deposited on silicon wafers were successfully bonded at $415^{\circ}C$/25 kN for 40 minutes in a thermo-compression bonding method that did not involve a pre-cleaning or pre-annealing process. The original copper bonding interface disappeared and showed a homogeneous microstructure with few voids at the original bonding interface. Quantitative interfacial adhesion energies were greater than $10.4\;J/m^2$ as measured via a four-point bending test. Post-bonding annealing at a temperature that was less than $300^{\circ}C$ had only a slight effect on the bonding energy, whereas an oxygen environment significantly deteriorated the bonding energy over $400^{\circ}C$. This was most likely due to the fast growth of brittle interfacial oxides. Therefore, the annealing environment and temperature conditions greatly affect the interfacial bonding energy and reliability in Cu-Cu bonded wafer stacks.

• Transactions of Materials Processing
• /
• v.7 no.5
• /
• pp.465-473
• /
• 1998

The effect of alloying elements of Ag-Cu-Zr-X brazing alloy on the microstructure and the bond strength of $Al_2O_3/Ni-Cr$ brazed steel joint was investigated. The reaction layer, $ZrO_2$ (a=5.146 ${\AA}$ , b=5.213 ${\AA}$ , c=5.311 ${\AA}$ )was formed at the interface of $Al_2O_3/Ni-Cr$ steel joint by the redox reaction between alumina and Zr. The addition of An and Al to the Ag-Cu-Zr brazing alloy gave rise to changes in the thickness of the reaction product layer and the morphology of the brazement. Sn caused the segregation of Zr was decreased b Al the $ZrO_2$ layer formed at the Ag-Cu-Zr-Al alloy was thinner than that of $ZrO_2$ formed at the Ag-Cu-Zr-An alloy. The fracture shear strength was strongly dependent on the microstructure of the brazement. Brazing with Ag-Cu-Zr-Sn alloy resulted in a better bond strength than with Ag-Cu-Zr or Ag-Cu-Zr-Al alloy.