한국재료학회지 (Korean Journal of Materials Research)

  • 제11권12호
  • /
  • Pages.1086-1090
  • /
  • 2001
  • /
  • 1225-0562(pISSN)
  • /
  • 2287-7258(eISSN)
한국재료학회 (Materials Research Society of Korea)
권호 표지

전자부품용 메탈라이즈드 알루미나 세라믹스의 미세구조 제어

Microsturcture Control of Metallized Alumina Ceramics for Electronic Devices

  • 발행 : 2001.12.01
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

Composition effects on microstructure and metallizing properties of the alumina sintered body were evaluated to develop the metallized alumina tubes having superior properties for electronic devices. SEM observation revealed that resultant micrographs and fractographs were varied with composition chance of additives and $SiO_2$-rich specimens showed better microstructural characteristics with uniform distribution of fine and round particles than other CaO-rich or MgO-rich ones. The resultant interfacial microstructure of the $SiO_2$-rich metallized alumina tubes also showed good metallizing properties with no defects between layers and uniform thickness of metallizing layer.

키워드

참고문헌

  1. J.T. Klomp, Am. Ceram. Soc. Bull., 51(9), 683 (1972)
  2. M.E. Twentyman and P. Popper, J. Matl. Sci., 10, 765 (1975)
  3. H. Palmour, J. Electrochemical Soc., 102(7), 160 (1955) https://doi.org/10.1149/1.2430098
  4. R.G. Frey and J.W. Halloran, J. Am. Ceram. Soc., 67(3), 199 (1984) https://doi.org/10.1111/j.1151-2916.1984.tb19742.x
  5. J.T. Klomp;T.P.J. Botden, Am. Ceram. Soc. Bull., 49(2), 204 (1970)
  6. J.S. Reed and R.B. Runk, 'Ceramic Fabrication Processes', Academic Press, New York, 71 (1976)
  7. R.A. Dimilia and J.S. Reed, Am. Ceram. Soc. Bull., 62(4), 484 (1983)
  8. J. Zheng and J.S. Reed, J. Am. Ceram. Soc., 71(11), 456 (1988) https://doi.org/10.1111/j.1151-2916.1988.tb07546.x
  9. J. Zheng and J.S. Reed, Am. Ceram. Soc. Bull., 71(9), 1410 (1992)
  10. Y.D. Shin and I.C. Cho, 'Encyclopedia of Ceramics Microstructure by SEM', cheong Media, 3, 70 (2001)
  11. E.P. Denton and H. Rawson, Trans. Brit. Ceram. Soc., 59(2), 25 (1960)
  12. J. Zheng and J.S. Reed, J. Am. Ceram. Soc., 72(5), 810 (1989) https://doi.org/10.1111/j.1151-2916.1989.tb06222.x