• Title/Summary/Keyword: Interfacial Layer

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Effect of Heat Treatment on the Deformation and Fracture Behaviors of 3-ply Cu/Al/Cu Clad Metal (3층 Cu/Al/Cu 클래드재의 열처리온도에 따른 변형 및 파단거동)

  • Kim, In-Kyu;Ha, Jongsu;Hong, Sun Ig
    • Korean Journal of Metals and Materials
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    • v.50 no.12
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    • pp.939-948
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    • 2012
  • A 3-ply clad metal consisting of aluminum and copper was fabricated by roll bonding process and the microstructures and mechanical properties of the roll-bonded and post-roll-bonding heat treated Cu/Al/Cu clad metal were investigated. A brittle interfacial reaction layer formed at the Cu/Al interfaces at and above $400^{\circ}C$. The thickness of the reaction layer increased from $12{\mu}m$ at $400^{\circ}C$ to $28{\mu}m$ at $500^{\circ}C$. The stress-strain curves demonstrated that the strength decreased and the ductility increased with heat treatment up to $400^{\circ}C$. The clad metal heat treated at $300^{\circ}C$ with no indication of a reaction layer exhibited an excellent combination of the strength and ductility and no delamination of layers up to final fracture in the tensile testing. Above $400^{\circ}C$, the ductility decreased rasxpidly with little change of strength, reflecting the brittle nature of the intermetallic interlayers. In Cu/Al/Cu clad heat treated above $400^{\circ}C$, periodic parallel cracks perpendicular to the stress axis were observed at the interfacial reaction layer. In-situ optical microscopic observation revealed that cracks were formed in the Cu layer due to the strain concentration in the vicinity of horizontal cracks in the intermetallic layer, promoting the premature fracture of Cu layer. Vertical cracks parallel to the stress axis were also formed at 15% strain at $500^{\circ}C$, leading to the delamination of the Cu and Al layers.

Electro-Mechanical Analysis of Interfacial Cracks in a Piezoelectric Layer Bonded to Dissimilar Elastic Layers (탄성층 사이에 접합된 압전재료의 계면균열에 대한 전기-기계적 해석)

  • 정경문;김인옥;김지숙;범현규
    • Journal of the Korean Society for Precision Engineering
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    • v.19 no.11
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    • pp.120-128
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    • 2002
  • Interfacial cracks in a piezoelectric layer bonded to dissimilar elastic layers under the combined anti-plane mechanical shear and in-plane electrical leadings are considered. By using Fourier cosine transform, the mixed boundary value problem is reduced to a singular integral equation which is solved numerically to determine the stress intensity factors. Numerical results for the effects of the material properties and layer geometries on the stress intensity factors are obtained.

Numerical Study of the Thermohaline Double-Diffusive System in a Solar Pond (태양연못 안의 열-염분 이중확산계에 대한 수치적연구)

  • Lim K.B;Park H.Y;Lee K.S
    • The Magazine of the Society of Air-Conditioning and Refrigerating Engineers of Korea
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    • v.16 no.6
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    • pp.606-612
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    • 1987
  • In this study, numerical model was developed to predict behavior of several layers in a solar pond and was solved by finite difference method. The empirical correlation that described heat and salt fluxes across interfacial boundary layer between mixed layer and diffusive layer in a solar pond were obtained from experiments and utilized in developing numerical model. As the results of this study, heat and salt fluxes across the interfacial boundary layer was found to depend on density ratio ${\beta}{\Delta}M_s/{\alpha}{\Delta}T.$ It was also found that the predicted value obtained by using the modified Weinberger's stability criteria showed a good agreement with experiment data.

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Slippage on which interface in nanopore filtration?

  • Xiaoxu Huang;Wei Li;Yongbin Zhang
    • Membrane and Water Treatment
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    • v.15 no.1
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    • pp.31-39
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    • 2024
  • The flow in a nanopore of filtration membrane is often multiscale and consists of both the adsorbed layer flow and the intermediate continuum fluid flow. There is a controversy on which interface the slippage should occur in the nanopore filtration: On the adsorbed layer-pore wall interface or on the adsorbed layer-continuum fluid interface? What is the difference between these two slippage effects? We address these subjects in the present study by using the multiscale flow equations incorporating the slippage on different interfaces. Based on the limiting shear strength model for the slippage, it was found from the calculation results that for the hydrophobic pore wall the slippage surely occurs on the adsorbed layer-pore wall interface, however for the hydrophilic pore wall, the slippage can occur on either of the two interfaces, dependent on the competition between the interfacial shear strength on the adsorbed layer-pore wall interface and that on the adsorbed layer-continuum fluid interface. Since the slippage on the adsorbed layer-pore wall interface can be designed while that on the adsorbed layer-continuum fluid interface can not, the former slippage can result in the flux through the nanopore much higher than the latter slippage by designing a highly hydrophobic pore wall surface. The obtained results are of significant interest to the design and application of the interfacial slippage in nanoporous filtration membranes for both improving the flux and conserving the energy cost.

Interfacial Stability Between Anode and Electrolyte of LSGM-Based SOFCs (LSGM계 고체산화물 연료전지의 전해질-음극 사이의 계면안정성)

  • Kim, Kwang-Nyeon;Moon, Jooho;Son, Ji-Won;Kim, Joosun;Lee, Hae-Weon;Lee, Jong-Ho;Kim, Byung-Kook
    • Journal of the Korean Ceramic Society
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    • v.42 no.7 s.278
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    • pp.509-515
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    • 2005
  • Interfacial reactions at LSGM electrolyte and NiO-GDC anode interfaces were thoroughly investigated with Environmental Scanning Electron Microscopy (ESEM-PHlLIPS XL-30) and Energy Dispersive X-ray (EDX-Link XL30). According to the analysis, serious reaction zone was observed at LSGM/NiO-GDC interface. It was found that the reaction layer was originated from the chemical reaction between NiO and LSGM. The reaction products were identified as La deficient form of LSGM based perovskite and Ni-La-O compounds such as LaSrGa$_{3}$O$_{7}$ and LaNiO$_{3}$ from the X-Ray Diffraction (XRD, Philips) analysis. According to the electrical characterization, interfacial layer was very electrically resistive which would be the cause of high internal resistance and low power generating characteristic of the unit cell.

Fast transport with wall slippage

  • Tang, Zhipeng;Zhang, Yongbin
    • Membrane and Water Treatment
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    • v.12 no.1
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    • pp.37-41
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    • 2021
  • This paper presents the multiscale calculation results of the very fast volume transport in micro/nano cylindrical tubes with the wall slippage. There simultaneously occurs the adsorbed layer flow and the intermediate continuum fluid flow which are respectively on different scales. The modeled fluid is water and the tube wall is somewhat hydrophobic. The calculation shows that the power loss on the tube no more than 1.0 Watt/m can generate the wall slippage even if the fluid-tube wall interfacial shear strength is 1 MPa; The power loss on the scale 104 Watt/m produces the volume flow rate through the tube more than one hundred times higher than the classical hydrodynamic theory calculation even if the fluid-tube wall interfacial shear strength is 1 MPa. When the wall slippage occurs, the volume flow rate through the tube is in direct proportion to the power loss on the tube but in inverse proportion to the fluid-tube wall interfacial shear strength. For low interfacial shear strengths such as no more than 1 kPa, the transport in the tube appears very fast with the magnitude more than 4 orders higher than the classical calculation if the power loss on the tube is on the scale 104 Watt/m.

Quantitative Analysis of Ultrathin SiO2 Interfacial Layer by AES Depth Profilitng

  • Soh, Ju-Won;Kim, Jong-Seok;Lee, Won-Jong
    • The Korean Journal of Ceramics
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    • v.1 no.1
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    • pp.7-12
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    • 1995
  • When a $Ta_O_5$ dielectric film is deposited on a bare silicon, the growth of $SiO_2$ at the $Ta_O_5$/Si interface cannot be avoided. Even though the $SiO_2$ layer is ultrathin (a few nm), it has great effects on the electrical properties of the capacitor. The concentration depth profiles of the ultrathin interfacial $SiO_2$ and $SiO_2/Si_3N_4$ layers were obtained using an Auger electron spectroscopy (AES) equipped with a cylindrical mirror analyzer (CMA). These AES depth profiles were quantitatively analyzed by comparing with the theoretical depth profiles which were obtained by considering the inelastic mean free path of Auger electrons and the angular acceptance function of CMA. The direct measurement of the interfacial layer thicknesses by using a high resolution cross-sectional TEM confirmed the accuracy of the AES depth analysis. The $SiO_2/Si_3N_4$ double layers, which were not distinguishable from each other under the TEM observation, could be effectively analyzed by the AES depth profiling technique.

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A study of interfacial characteristics for $In_{0.1}Ga_{0.9}As/GaAs$ by photoreflectance measurement (Photoreflectance 측정에 의한 $In_{0.1}Ga_{0.9}As/GaAs$ 계면의 특성 조사)

  • 이철욱;김인수;손정식;김동렬;임재영;배인호
    • Journal of the Korean Vacuum Society
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    • v.6 no.3
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    • pp.263-266
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    • 1997
  • We studied an interfacial characteristics of $In_{0.1}Ga_{0.9}As$/ GaAs by photoreflectance (PR) measurement at room temperature. With increasing thickness of epitaxial layer, Franz-Keldysh oscillation (FKO) periods of PR signals were decreased, and interfacial electric field was decreased. This can be explained by the increases of defects due to lattice mismatch near the heterointerface between InGaAs and GaAs. For the thickness of epitaxial layer thinner than the 300$\AA$, InGaAs epitazial layer closed to critical thickness and increased strain, and then the bandgap energy shifted high greatly.

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A Study on Development of High Strength and Wear Resistance Intermetallic Compounds/Al Matrix Composites (고강도 내마모 금속간화합물/Al기지 복합재료의 개발을 위한 기초연구)

  • Choi, Dap-Chun;Lee, Kyung-Ku;Lee, Ho-Jong;Ghi, Whe-Bong
    • Journal of Korea Foundry Society
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    • v.13 no.3
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    • pp.276-284
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    • 1993
  • The interfacial phenomena between intermetallic compounds and Al matrix have been studied at $680^{\circ}C$ for various holding time under argon atmosphere. Model experiments were performed using Fe, Ni and Ti wire to observe the interfacial phenomena. The interfacial phenomena between intermetallic compounds and Al matrix were analysed by optical microscope, SEM and EDX. The results of EDX and XRD showed that the interfacial zones of intermetallic compounds/Al matrix were composed of several intermetallic layers. The reaction layer was varied with holding time and heating temperature. The investigation of interfacial zones in the specimen as a function of heat treatment time at $680^{\circ}C$ indicated that the best heat treatment condition for squeeze casting was $680^{\circ}C$ for 5min.

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Analyze of the interfacial stress in reinforced concrete beams strengthened with externally bonded CFRP plate

  • Hadji, Lazreg;Daouadji, T. Hassaine;Meziane, M. Ait Amar;Bedia, E.A. Adda
    • Steel and Composite Structures
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    • v.20 no.2
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    • pp.413-429
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    • 2016
  • A theoretical method to predict the interfacial stresses in the adhesive layer of reinforced concrete beams strengthened with externally bonded carbon fiber-reinforced polymer (CFRP) plate is presented. The analysis provides efficient calculations for both shear and normal interfacial stresses in reinforced concrete beams strengthened with composite plates, and accounts for various effects of Poisson's ratio and Young's modulus of adhesive. Such interfacial stresses play a fundamental role in the mechanics of plated beams, because they can produce a sudden and premature failure. The analysis is based on equilibrium and deformations compatibility approach developed by Tounsi. In the present theoretical analysis, the adherend shear deformations are taken into account by assuming a parabolic shear stress through the thickness of both the reinforced concrete beam and bonded plate. The paper is concluded with a summary and recommendations for the design of the strengthened beam.