• Macromolecular Research
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• v.13 no.5
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• pp.453-459
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• 2005

Natural fiber henequen/unsaturated polyester (UPE) composites were fabricated by means of a compression molding technique using chopped henequen fibers treated at various electron beam (EB) dosages. The interfacial shear strength (IFSS), dynamic mechanical properties, and thermal expansion behavior were investigated through a single fiber microbonding test, fractographic observation, dynamic mechanical analysis, and thermomechanical analysis, respectively. The results indicated that the interfacial and dynamic mechanical properties significantly depended on the level of the EB treatment irradiated onto the henequen fiber surfaces. The effect of EB treatment on the IFSS, storage modulus and fracture surface of the henequen/UPE composites agreed with each other. The results of this study also suggested that the modification of henequen fiber surfaces at 10 kGy EB is the most effective for improving the interfacial properties of the henequen/UPE composites.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.388-389
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• 2007

In this work, Organic Light Emitting Diodes using Aluminum-Oxynitride as a hole-injecting interfacial have been fabricated. This interfacial layer is inserted at the ITO/N,NV-diphenyl-N, NV-bis(3-methylphenyl)-1,1V-diphenyl-4,4V-diamine (TPD) interface. The brightness and efficiency of the device with the AION film is higher than that of the device without it. The enhancements are attributed to an improved balance of hole and electron injections due to the energy level realignment and the change in carrier tunneling probability by the interfacial layer.

• Korean Journal of Metals and Materials
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• v.49 no.8
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• pp.664-670
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• 2011

3-ply Mg/Al/STS clad-metal was fabricated by the roll bonding process. An interfacial reaction layer was formed at the Mg/Al interface at and above $300^{\circ}C$ whereas no interfacial reaction layer was observed up to $400^{\circ}C$. The effect of the interfacial reaction layer on the mechanical and fracture properties in clad metals after heat treatments were investigated The chemical compositions were analyzed at the Mg/Al interface by an Energy dispersive X-ray analysis (EDX). A tension test was performed to examine the interfacial cracking properties. The Mg layer fractured first, causing a sudden drop of the stress and Al/STS layer continued to deform until the final fracture. Periodic cracks and crack propagation was observed at the reaction layer between Mg and Al.

• Current Photovoltaic Research
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• v.9 no.4
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• pp.145-159
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• 2021

Light soaking (LS) stability in polymer solar cells (PSCs) has always been a challenge to achieve due to unstable photoactive layer-electrode interface. Especially, the electron transport layer (ETL) and photoactive layer interface limits the LS stability of PSCs. Herein, we have modified the most commonly used and robust zinc oxide (ZnO) ETL-interface using an organic dye molecule and a co-adsorbent. Power conversion efficiencies have been slightly improved but when these PSCs were subjected to long term LS stability chamber, equipped with heat and humidity (45℃ and 85% relative humidity), an outstanding stability in the case of ZnO/dye+co-adsorbent ETL containing devices have been achieved. The enhanced LS stability occurred due to the suppressed interfacial defects and robust contact between the ZnO and photoactive layer. Current density as well as fill factors have been retained after LS with the modified ETL as compared to un-modified ETL, owing to their higher charge collection efficiencies which originated from higher electron mobilities. Moreover, the existence of less traps (as observed from light intensity-open circuit voltage measurements and dark currents at -2V) are also found to be one of the reasons for enhanced LS stability in the current study. We conclude that the mitigation ETL-surface traps using an organic dye with a co-adsorbent is an effective and robust approach to enhance the LS stability in PSCs.

• Journal of Adhesion and Interface
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• v.19 no.1
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• pp.13-18
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• 2018

At ruthenium (Ru) catalyst was exposed from the atmosphere, the degree of catalyst activation decreased. The change of catalyst activity with the number of days of exposure to air for the Ru catalyst was confirmed using the surface tension method quantitatively. Mechanical properties and surfactant change after polymerization by DCPD using Ru catalyst for each air exposure day was evaluated. The Ru catalyst mixed with a dilution agent was exposed in the air and color was monitored for each day. Surface tension was measured using Wilhelmy and PTFE and associated with different catalyst activities. Heat was measured in real time during polymerizing DCPD with Ru catalyst. After polymerization, tensile strength was measured for p-DCPD and the change of material property was measured. Interfacial properties were also evaluated via microdroplet pull-out tests between glass fiber and p-DCPD. The surface tension was stable until the 4 days (33 dyne/cm) whereas the surface energy increased at the 10 days (34 dyne/cm), which could be correlated with oxidation of the catalyst. Tensile property and interfacial shear strength (IFSS) was also stable until the 4 days (tensile strength: 38 MPa and IFSS: 26 MPa) whereas the mechanical property decrease at 10 days (tensile strength: 15 MPa and IFSS: 3 MPa) dramatically.

• Journal of the Korean Ceramic Society
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• v.56 no.4
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• pp.394-398
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• 2019

In this paper, the joining characteristics of GDC-LSM ceramics with Crofer 22 APU metal alloys was investigated at different brazing temperatures and holding times by reactive air brazing. Brazing was performed using Ag-10 wt% CuO filler, at three different temperatures (1000, 1050, and 1100℃ for 30 minutes) as well as for three different holding times (10, 30, and 60 minutes at 1050℃). The interfacial microstructures were examined by scanning electron microscopy and the joining strengths were assessed by measuring shear strengths at room temperature. The results show that with increasing brazing temperature and holding time, joint microstructure changed obviously and shear strength was decreased. Shear strength varied from a maximum of 100±6 MPa to a minimum of 18±5 MPa, depending on the brazing conditions. These changes were attributed to an increase in the thickness of the oxide layer at the filler/metal alloy interface.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.49-55
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• 2016

The effects of post-annealing and temperature/humidity conditions on the interfacial adhesion energies of atomic layer deposited RuAlO diffusion barrier layer for Cu interconnects were systematically investigated. The initial interfacial adhesion energy measured by four-point bending test was $7.60J/m^2$. The interfacial adhesion energy decreased to $5.65J/m^2$ after 500 hrs at $85^{\circ}C$/85% T/H condition, while it increased to $24.05J/m^2$ after annealing at $200^{\circ}C$ for 500 hrs. The X-ray photoemission spectroscopy (XPS) analysis showed that delaminated interface was RuAlO/$SiO_2$ for as-bonded and T/H conditions, while it was Cu/RuAlO for post-annealing condition. XPS O1s peak separation results revealed that the effective generation of strong Al-O-Si bonds between $AlO_x$ and $SiO_2$ interface at optimum post-annealing conditions is responsible for enhanced interfacial adhesion energies between RuAlO/$SiO_2$ interface, which would lead to good electrical and mechanical reliabilities of atomic layer deposited RuAlO diffusion barrier for advanced Cu interconnects.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.41-47
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• 2020

The effect of Co interlayer on the interfacial reliability of SiN_x/Co/Cu thin film structure for advanced Cu interconnects was systematically evaluated by using a double cantilever beam test. The interfacial adhesion energy of the SiN_x/Cu thin film structure was 0.90 J/㎡. This value of the SiN_x/Co/Cu thin film structure increased to 9.59 J/㎡.Measured interfacial adhesion energy of SiN_x/Co/Cu structure was around 10 times higher than SiN_x/Cu structure due to CoSi₂ reaction layer formation at SiN_x/Co interface, which was confirmed by X-ray photoelectron spectroscopy analysis. The interfacial adhesion energy of SiN_x/Co/Cu structure decreased sharply after post-annealing at 200℃ for 24 h due to Co oxidation at SiN_x/Co interface. Therefore, it is required to control the CoO and Co₃O₄ formation during the environmental storage of the SiN_x/Co/Cu thin film to achieve interfacial reliability for advanced Cu interconnections.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.17 no.11
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• pp.1035-1042
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• 2005

In the present study, the principle of minimum energy is employed to configure the shape of rivulet flowing down an inclined surface. The profile of laminar rivulet is determined by numerical integration. The maximum center thickness, which corresponds to the minimum thickness of falling film, is found to exist regardless of liquid flow rate and is compared with the analytical and experimental data. At small liquid flow rate the center thickness of rivulet and its width increase almost linearly with flow rate. Once the center thickness of rivulet becomes very close to its maximum value, its growth rate retards abruptly. However the width of rivulet increases proportionally to the liquid flow rate and most part of its free surface is as flat as that of stable film. The growth rate of rivulet thickness with respect to liquid flow rate becomes larger at bigger contact angle. The width of rivulet increases rapidly with its flow rate especially at small contact angle, As the liquid-vapor interfacial shear stress increases, the center thickness of rivulet decreases with its flow rate, which is remarkable at small contact angle. However the effect of interfacial shear stress on the width of rivulet is almost negligible.

• Proceedings of the KSME Conference
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• 2001.06a
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• pp.102-107
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• 2001

Interfacial cracks between an isotropic and orthotropic material, subjected to static far field tensile loading are analyzed using the technique of photoelasticity. The fracture parameters are extracted from the full-field isochromatic data and the same are compared with that obtained using boundary collocation method. Dynamic Photoelasticity combined with high-speed digital photography is employed for capturing the isochromatics in the case of propagating interfacial cracks. The normalized stress intensity factors for static crack is greater when $\alpha=90^{\circ}C$ (fibers perpendicular to the interface) than when $\alpha=0^{\circ}C$ (fiber parallel to the interface) and those when $\alpha=90^{\circ}C$ are similar to ones of isotropic material. The dynamic stress intensity factors for interfacial propagating crack are greater when $\alpha=0^{\circ}C$ than $\alpha=90^{\circ}C$. The relationship between complex dynamic stress intensity factor $|K_D|$ and crack speed C is similar to that for isotropic homogeneous materials, the rate of increase of energy release rate G or $|K_D|$ with crack speed is not as drastic as that reported for homogeneous materials.