• Journal of Welding and Joining
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• v.13 no.3
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• pp.134-146
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• 1995

Aluminium nitride(AlN) is currently under investigation as potential candidate for replacing alumium oxide(Al$_{2}$ $O_{3}$) as a substrate material for for electronic circuit packaging. Brazing of aluminium nitride(AlN) to Cu with Ag base active alloy containing Ti has been investigated in vacuum. Binary Ag$_{98}$ $Ti_{2}$(AT) and ternary At-1wt.%Al(ATA), AT-1wt.%Ni(ATN), AT-1wt.% Mn(ATM) alloys showed good wettability to AlN and led to the development of strong bond between brate alloy and AlN ceramic. The reaction between AlN and the melted brazing alloys resulted in the formation of continuous TiN layers at the AlN side iterface. This reaction layer was found to increase by increase by increasing brazing time and temperature for all filler metals. The bond strength, measured by 4-point bend test, was increased with bonding temperature and showed maximum value and then decreased with temperature. It might be concluded that optimum thickness of the reaction layer was existed for maximum bond strength. The joint brazed at 900.deg.C for 1800sec using binary AT alloy fractured at the maximum load of 35kgf which is the highest value measured in this work. The failure of this joint was initiated at the interface between AlN and TiN layer and then proceeded alternately through the interior of the reaction layer and AlN ceramic itself.

• Journal of the Korean Ceramic Society
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• v.42 no.10 s.281
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• pp.665-671
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• 2005

LSGM is known to show very serious interfacial reaction with other unit cell components, such as electrode, electrode functional or buffering layers. Especially, the formation of very resistive LaSr$Ga_{3}$$O_{7}$ phase at the interface of an anode and an electrolyte is the most problematic one in LSGM-based SOFCs. In this study, we investigated the interfacial reactions in LSGM-based SOFCs under different unit cell configurations. According to the microstructural analysis on the interfacial layer between an electrolyte and its neighboring component, serious interfacial reaction zone was observed. From the electrical and electrochemical characterization of the cell, we found such an interfacial reaction zone not only increased the internal ohmic resistance but also decreased the OCV(Open Cell Voltage) of the unit cell, and thus consequently deteriorated the unit cell performance.

• Korean Journal of Materials Research
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• v.18 no.3
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• pp.153-158
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• 2008

Fe-aluminides have the potential to replace many types of stainless steels that are currently used in structural applications. Once commercialized, it is expected that they will be twice as strong as stainless steels with higher corrosion resistance at high temperatures, while their average production cost will be approximately 10% of that of stainless steels. Self-propagating, high-temperature Synthesis (SHS) has been used to produce intermetallic and ceramic compounds from reactions between elemental constituents. The driving force for the SHS is the high thermodynamic stability during the formation of the intermetallic compound. Therefore, the advantages of the SHS method include a higher purity of the products, low energy requirements and the relative simplicity of the process. In this work, a Fe-aluminide intermetallic compound was formed from high-purity elemental Fe and Al foils via a SHS reaction in a hot press. The formation of iron aluminides at the interface between the Fe and Al foil was observed to be controlled by the temperature, pressure and heating rate. Particularly, the heating rate plays the most important role in the formation of the intermetallic compound during the SHS reaction. According to a DSC analysis, a SHS reaction appeared at two different temperatures below and above the metaling point of Al. It was also observed that the SHS reaction temperatures increased as the heating rate increased. A fully dense, well-bonded intermetallic composite sheet with a thickness of $700\;{\mu}m$ was formed by a heat treatment at $665^{\circ}C$ for 15 hours after a SHS reaction of alternatively layered 10 Fe and 9 Al foils. The phases and microstructures of the intermetallic composite sheets were confirmed by EPMA and XRD analyses.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.1-7
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• 2010

Interfacial reaction characteristics of a Bi-10Cu-20Sb-0.3Ni Pb-free alloy on Cu pad was investigated by reflow soldering at $430^{\circ}C$. The thickness of interfacial reaction layers with respect to the soldering time was also measured. After the reflow soldering, it was observed that a $(Cu,Ni)_2Sb$, a $Cu_4Sb$ intermetallic layer, and a haze layer, which is consisted of Bi and $Cu_4Sb$ phases, were successively formed at the Bi-10Cu-20Sb-0.3Ni/Cu interface. The total thickness of the reaction layers was found to be linearly increased with increasing of the reflow soldering time up to 120 s. As the added Ni element did not participate in the formation of the thickest $Cu_4Sb$ interfacial layer, suppression of the interfacial growth was not observed.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.95-95
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• 2009

Zinc coatings provide the most effective and economical way of protecting steel against corrosion. There are three types of galvanizing lines typically used in production line in galvanizing industries,Galvanize (GI) coating (Zn-0.1-0.3%Al), Galfan coating (Zn-5%Al), Galvalume(GL) coating (45%Zn-Al). In continuous Galvanizing lines, the immersed bath hardware (e.g. bearings, sink, stabilizer, and corrector rolls, and also support roll arms and snout tip) are subjected to corrosion and wear failure. Understanding the reaction of these materials with the molten Zn alloy is becomes scientific and commercial interest. To investigate the reaction with molten Zn alloys, static immersion test performed for 4, 8, 16, and 24 Hr. Two different baths used for the static immersion, which are molten Zn and molten Zn-55%Al. Microstructures characterization of each of the materials and intermetallic layer formed in the reaction zone was performed using optical microscope, SEM and EDS. The thickness of the reaction layer is examined using image analysis to determine the kinetics of the reaction. The phase dominated by two distinct phase which are eutectic carbide and matrix. The morphology of the intermetallic phase formed by molten Zn is discrete phase showing high dissolution of the material, and the intermetallic phase formed by Zn-55wt%Al is continuous. Aluminum reacts readily with the materials compare to Zinc, forming iron aluminide intermetallic layer ($Fe_2Al_5$) at the interface and leaving zinc behind.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.73-79
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• 2022

In this study, a reaction study between Ga, which has recently been spotlighted as a low-temperature bonding material, and Cu, a representative electrode material, was conducted to investigate information necessary for low-temperature soldering applications. Interfacial reaction and intermetallic compound (IMC) growth were observed and analyzed by reacting Ga and Cu/Au substrates in the temperature range of 80-200℃. The main IMC growing at the reaction interface was CuGa₂ phase, and AuGa₂ IMC with small particle sizes was formed on the upper part and Cu₉Ga₄ IMC with a thin band shape on the lower part of the CuGa₂ layer. CuGa₂ particles showed a scallop shape, and the particle size increased without significant shape change as the reaction time increased, similar to the case of Cu₆Sn₅ growth. As a result of analyzing the CuGa₂ growth mechanism, the time exponent was calculated to be ~3.0 in the temperature range of 120-200℃, and the activation energy was measured to be 17.7 kJ/mol.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.2
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• pp.13-19
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• 2000

Shear strengths of BGA solder joints on Cu pads were studied for Cu-containing Sn (0, 1.5, and 2.5 wt.% Cu) and Sn-40Pb (0 and 0.5wt.% Cu) solders, with emphasis on the roles of the Cu-Sn intermetallic layer thickness and the roughness of the interface between the intermetalic layer and solder. The shear strength test was performed for as-soldered solder joints with various soldering reaction times up to 4 min. The addition of Cu to the pure Sn solder results in an enhanced growth of the intermetallic layer whereas the effect of Cu addition to the Sn-40Pb solder is primarily on the reduction of the roughness of the intermetallic/solder interface. The critical thickness of the intermetallic layer for a maximum shear strength depends on the solder materials, which was measured to be ~ 2.3 $\mu\textrm{m}$ for Sn-Cu solders and ~ 1.2 $\mu\textrm{m}$ for Sn-Pb-Cu solders. The shear strength at the critical intermetallic layer thickness seems to increase as the intermetallic/solder interface becomes rougher. This is in accordance with the observation that the sheared fracture occurred initially within the solder tends to shift towards the intermetallic/solder interface as the intermetallic layer grows above the critical thickness.

• Journal of the Korean Electrochemical Society
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• v.6 no.2
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• pp.119-129
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• 2003

The Langmuir adsorption isotherms of the over-potentially deposited hydrogen (OPD H) fur the cathodic $H_2$ evolution reaction (HER) at the poly-Au and $Rh|0.5M\;H_2SO_4$ aqueous electrolyte interfaces have been studied using cyclic voltammetric and ac impedance techniques. The behavior of the phase shift $(0^{\circ}{\leq}{-\phi}{\leq}90^{\circ})$ for the optimum intermediate frequency corresponds well to that of the fractional surface coverage $(1{\geq}{\theta}{\geq}0)$ at the interfaces. The phase-shift profile $({-\phi}\;vs.\;E)$ for the optimum intermediate frequency, i.e., the phase-shift method, can be used as a new electrochemical method to determine the Langmuir adsorption isotherm $({\theta}\;vs.\;E)$ of the OPD H for the cathodic HER at the interfaces. At the poly-Au|0.5M $H_2SO_4$ aqueous electrolyte interface, the equilibrium constant (K) and the standard free energy $({\Delta}G_{ads})$ of the OPD H are $2.3\times10^{-6}$ and 32.2kJ/mol, respectively. At the poly-Rh|0.5M $H_2SO_4$ aqueous electrolyte interface, K and ${\Delta}G_{ads}$ of the OPD H are $4.1\times10^4\;or\;1.2\times10^{-2}$ and 19.3 or 11.0kJ/mol depending on E, respectively. In contrast to the poly-Au electrode interface, the two different Langmuir adsorption isotherms of the OPD H are observed at the poly-Rh electrode interface. The two different Langmuir adsorption isotherms of the OPD H correspond to the two different adsorption sites of the OPD H on the poly-Rh electrode surface.

• Applied Microscopy
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• v.34 no.4
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• pp.277-283
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• 2004

This paper reports that the ultrastructural nature of the interface process between the implants and surrounding bone has been studied after in vivo 1, 4, 8, 12 weeks of implantation of smooth machined implants into rabbit tibias. There was no indication of the fibrous connective tissue formation around the implant that imply intolerance of the bone tissue towards the implant after 1 week of implantation. The regions showing direct bone tissue bonding to the smooth machined implant contained osteoblast activating across the interface in the direction after 4 weeks of implantation. The reaction of a smooth machined implant caused in the first instance formation of an amorphous woven bone, which transformed into a mineralized bone containing collagen fibers. After 8 weeks of implantation, the activities of osteoblast initiated osseointegration forming bone matrix at the interface. During this period, the osteoblast surrounded with a matrix consisting of collagen bundles running in various directions. In the interface area between newly formed bone tissue and implants which has been inserted in rabbit tibias for 12 weeks, the implant and mineralized bone was separated by an amorphous electron dense material layer about $1{\sim}1.5{\mu}m$ in thickness.

• Resources Recycling
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• v.15 no.2 s.70
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• pp.3-9
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• 2006

As a basic study on the conversion of molten converter slag to the ordinary portland cement, the effects of $Al_{2}O_{3}$ addition on the interface reaction between solid CaO and molten converter slag has been studied. Alumina added converter slag whose basicity was controlled to 1 and 2 was melted and hold for 30 minutes in MgO crucible at $1500^{\circ}C$. Then sintered CaO pellet heated at the same temperature was dipped into the molten slag and held for 30minutes. After the reaction, the crucible was cooled in air and the specimen was cut off to the horizontal direction of the crucible. The dissolution rate of CaO pellet with the addition of $Al_{2}O_{3}$ was measured by the change of the radius or sintered CaO pellet and the interface layer was observed by SEM/EDX. As a result. At the basicity 2 slag, thickness of created $C_{3}S$ layer increased 3.5 times and quantity of $C_{6}AF_{2}\;or\;C_{4}AF$ phase increase 2 times than baisicy 1 slag.