• Title/Summary/Keyword: Inspection method

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The GPU-based Parallel Processing Algorithm for Fast Inspection of Semiconductor Wafers (반도체 웨이퍼 고속 검사를 위한 GPU 기반 병렬처리 알고리즘)

  • Park, Youngdae;Kim, Joon Seek;Joo, Hyonam
    • Journal of Institute of Control, Robotics and Systems
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    • v.19 no.12
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    • pp.1072-1080
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    • 2013
  • In a the present day, many vision inspection techniques are used in productive industrial areas. In particular, in the semiconductor industry the vision inspection system for wafers is a very important system. Also, inspection techniques for semiconductor wafer production are required to ensure high precision and fast inspection. In order to achieve these objectives, parallel processing of the inspection algorithm is essentially needed. In this paper, we propose the GPU (Graphical Processing Unit)-based parallel processing algorithm for the fast inspection of semiconductor wafers. The proposed algorithm is implemented on GPU boards made by NVIDIA Company. The defect detection performance of the proposed algorithm implemented on the GPU is the same as if by a single CPU, but the execution time of the proposed method is about 210 times faster than the one with a single CPU.

A Study on Allocation of Inspection Efforts in Serial Multi-stage Production Systems (직렬 다단계 생산공정에서의 최적 검사노력 할당문제에 관한 연구)

  • 김창훈;윤덕균
    • Journal of Korean Society of Industrial and Systems Engineering
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    • v.18 no.36
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    • pp.167-174
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    • 1995
  • The Dynamic programming method are developed for determining where to assign the inspection efforts in serial multi-stage production systems. The objective function is formulated to minimize the inspection and repairing costs. One of the major assumptions in this systems is that every assigned inspection stations should inspect the only items produced in manufacturing stages after the previous inspction station. The inspection stations can be assigned at every possible inspection stage after the manufacturing stages. Two type error is considered and screening inspection policy is assumed in this system and the defective items detected in tile inspection stations will be repaired or scraped by the defective types.

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A Study on the Optimal Condition Determination of Laser Scattering Using the Design of Experiment (실험계획법을 이용한 레이저 산란의 최적 조건 결정에 대한 연구)

  • Han, Jae-Chul;Kim, Gyung-Bum
    • Journal of the Korean Society for Precision Engineering
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    • v.26 no.7
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    • pp.58-64
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    • 2009
  • In this paper, an inspection mechanism based on laser scattering has been developed for the surface evaluation of infrared cut-off filters, and optimum conditions of laser scattering are determined using the design of experiment. First of all, attributes and influence factors of laser scattering are investigated and then a laser scattering inspection mechanism is newly designed based on analyses of laser scattering parameters. Also, Taguchi method, one of experimental designs, is used for the optimum condition selection of laser scattering parameters and the optimum condition is determined in order to maximize the detection capability of surface defects. Experiments show that the proposed method is useful in a consistent and effective defect detection and can be applied to surface evaluation processes in manufacturing.

Rapid Defect Inspection of Display Device with Optical Spatial Filtering

  • Yoon, Dong-Seon;Kim, Seung-Woo
    • International Journal of Precision Engineering and Manufacturing
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    • v.1 no.1
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    • pp.56-61
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    • 2000
  • We present a fast inspection method of machine vision for in-line quality assurance of liquid crystal displays(LCD) and plasma display panels(PDP). The method incorporates an optical spatial filter in the Fourier plane of the imaging optics to block the normal periodic pattern, extracting only defects real time without relying on intensive software image process. Special emphasis is on designing a collimated white light source to provide high degree of spatial coherence for effective real time Fourier transform. At the same time, a low level of temporal coherence is attained to improve defect detection capabilities by avoiding undesirable coherent noises. Experimental results show that the proposed inspection method offers a detection accuracy of 15% tolerance, which is sufficient for industrial applications.

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Path Planning of Automated Optical Inspection Machines for PCB Assembly Systems

  • Park Tae-Hyoung;Kim Hwa-Jung;Kim Nam
    • International Journal of Control, Automation, and Systems
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    • v.4 no.1
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    • pp.96-104
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    • 2006
  • We propose a path planning method to improve the productivity of AOI (automated optical inspection) machines in PCB (printed circuit board) assembly lines. The path-planning problem is the optimization problem of finding inspection clusters and the visiting sequence of cameras to minimize the overall working time. A unified method is newly proposed to determine the inspection clusters and visiting sequence simultaneously. We apply a hybrid genetic algorithm to solve the highly complicated optimization problem. Comparative simulation results are presented to verify the usefulness of the proposed method.

Development of Inspection System for the IC package (반도체 패키지 외관 검사 시스템 개발)

  • Lee, Jung-Seob;Kwon, Oh-Min;Joo, Hyo-Nam;Kim, Joon-Sik;Rew, Keun-Ho
    • Journal of Institute of Control, Robotics and Systems
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    • v.14 no.5
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    • pp.453-461
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    • 2008
  • In this paper, new inspection method is proposed for the surfaces of lead frame and IC's. Optimal optical system and the accurate algorithm for the surface inspection are needed in machine vision area. The proposed optical system is composed of rectangular oblique light illumination and coaxial light illumination for the higher contrast and the results shows the better performances through experiments. The markings of IC surface are inspected using the accurate proposed method using the partitioned correlation coefficient, and the result shows reduction of under kill ratio compared to the previous method.

An Algorithm for the Characterization of Surface Crack by Use of Dipole Model and Magneto-Optical Non-Destructive Inspection System

  • Lee, Jin-Yi;Lyu, Sung-Ki;Nam, Young-Hyun
    • Journal of Mechanical Science and Technology
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    • v.14 no.10
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    • pp.1072-1080
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    • 2000
  • Leakage magnetic flux (LMF) is widely used for non-contact detection of cracks. The combination of optics and LMF offers advantages such as real time inspection, elimination of electrical noise, high spatial resolution, etc. This paper describes a new nondestructive evaluation method based on an original magneto-optical inspection system, which uses a magneto-optical sensor, LMF, and an improved magnetization method. The improved magnetization method has the following characteristics: high observation sensitivity, independence of the crack orientation, and precise transcription of the geometry of a complex crack. The use of vertical magnetization enables the visualization of the length and width of a crack. The inspection system provides the images of the crack, and shows a possibility for the computation of its depth.

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Inspection Method Standardization on Conditions Following Attached Tiles on Drywalls Using Infrared Thermal Camera (적외선열화상카메라를 이용한 건식벽체에 부착된 타일에 대한 시공상태 점검기준)

  • Han, Yoon-Jung;Ma, Seung-Jae;Choi, Sung-Min;Oh, Sang-Keun
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2015.05a
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    • pp.144-145
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    • 2015
  • In this study, it is contemporaneously understood that tile attachment on CRC board do not have a regulated standard on quality control and construction. Furthermore, there is also a definite lack of standardization on nondestructive inspection of tiles. This thesis investigates a diagnosis method of spot bonding tile attachment using infrared thermal camera as a way to propose a systematic nondestructive inspection method after tile construction.

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Automatic Optical Inspection of PCB PADs for AFVI (AFVI를 위한 PCB PAD의 자동 광학 검사)

  • Mun, Sun-Hwan
    • Proceedings of the Optical Society of Korea Conference
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    • 2006.07a
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    • pp.469-471
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    • 2006
  • This paper describes a efficient insepction method of PCB PADs for AFVI. The methods for PCB inspection have been tried to detect the defects in PCB PADs, but their low detection rate results from pattern variations that are originating from etching, printing and handling processes. The adaptive inspection method has been newly proposed to extract minute defects based on dynamic segments and filters. The vertexes are extracted from CAM master images of PCB and then a lot of segments are constructed in master data. The proposed method moves these segments to optimal directions of a PAD contour and so adaptively matches segments to PAD contours of inspected images, irrespectively of various pattern variations. It makes a fast, accurate and reliable inspection of PCB patterns. Experimental results show that proposed methods are found to be effective for flexible defects detection.

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A Study on Inspection Technology of Thermal Battery Electrolyte using Image Processing Method (영상처리 방법을 통한 열전지 전해질 검사기법 연구)

  • Ha, Sang-Hyeon
    • Journal of the Korea Institute of Military Science and Technology
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    • v.15 no.6
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    • pp.820-826
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    • 2012
  • For the development of reliable thermal batteries, electrolyte is quite important because it is closely related to the performance and stability of thermal batteries. This paper describes general image processing method used for the inspection of molten-salt based electrolyte disk and also describes how we can apply this image processing method to the inspection of thermal battery electrolyte. Moreover we have found optimized image processing conditions to improve the discriminating ability of compaction defects such as non-uniform parts in an electrolyte.