• 한국산학기술학회논문지
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• 제14권4호
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• pp.1915-1920
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• 2013

본 논문은 열 해석 시뮬레이션과 주조로의 구조 변경을 통한 실리콘 잉곳의 방향성 응고에 대한 연구이다. 열 해석 시뮬레이션에 의한 결과, 용융은 유지 시간이 80분일 때 실리콘이 전체적으로 고르게 용융 온도에 도달하였고 냉각은 상부 냉각 온도가 $1,400^{\circ}C$와 60분 냉각 시 가장 좋은 결과 값을 나타내었다. 제작된 웨이퍼가 기존의 상용 웨이퍼보다 결정립계에서의 에칭이 훨씬 적게 이루어졌다. FTIR 측정결과 산소와 탄소 모두 모두 임계값 이하의 불순물로 존재함을 확인하였다. NAA 분석 결과 총 18가지 금속 불순물이 검출 되었지만, 농도 분포는 같은 위치에서 위와 아래의 차이는 크게 나지 않고, 어떤 특정한 위치에서 한쪽으로 집중되거나 어떤 경향성 없이 전체의 샘플의 모든 부분에서 농도가 거의 일정하게 분포를 나타냈다.

• Journal of Advanced Marine Engineering and Technology
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• 제9권3호
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• pp.240-249
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• 1985

This paper presents the results of the galvanic anode's characteristicsin the Al-Zn-In-Mg and Al-Zn-In-Mg system anodes used aluminium ingot of low purity, 99.5% grade. The results of thses performance tests are as follows: 1) Zn, In and Mg are an available elements to improve the performance of Aluminium alloy anodes. 2) When the range of zinc content in the Al-Zn-In-Mg system anode is 2-5% the more zinc content, the more improve the anode performance. 3) Al-Zn-In-Mg system anode requires a long term over 50 days for the performance test. 4) The composition of Al-Zn-In-Mg system anode which shows the most excellent performance is Al-(2-3%) Zn-(0.02%) In-(1.0%) Mg. 5) When the Al-Zn-In-Mg system anode is annealed for an hour in 500 to 550 .deg. C, the anode performance is improved. 6) The lower average potential and the better corrosion pattern in the Al-Zn-Mg, Al-Zn-In and Al-Zn-In-Mg system anodes, the more current efficiency is improved.

• Current Photovoltaic Research
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• 제8권1호
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• pp.17-26
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• 2020

It is clear that monocrystalline Silicon (Si) ingots are the key raw material for semiconductors devices. In the present industries markets, most of monocrystalline Silicon (Si) ingots are made by Czochralski Process due to their advantages with low production cost and the big crystal diameters in comparison with other manufacturing process such as Float-Zone technique. However, the disadvantage of Czochralski Process is the presence of impurities such as oxygen or carbon from the quartz and graphite crucible which later will resulted in defects and then lowering the efficiency of Si wafer. The heat transfer plays an important role in the formation of Si ingots. However, the heat transfer generates convection in Si molten state which induces the defects in Si crystal. In this study, a crystal growth simulation software was used to optimize the Si crystal growth process. The furnace and system design were modified. The results showed the melt-crystal interface shape can affect the Si crystal growth rate and defect points. In this study, the defect points and desired interface shape were controlled by specific crystal growth rate condition.

• 한국재료학회지
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• 제16권2호
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• pp.75-79
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• 2006

The effect of ozone and/or ultrasound treatments on the efficiency of slurry removal in post sliced cleaning (PSC) of silicon ingot was studied. Efficiency of slurry removal was evaluated as functions of time, temperature and surfactant with DOE (Design of Experiment) method. Residual slurries were observed on the wafer surface in case of cleaning by ozone or ultrasound separately. However, a clean wafer surface was appeared when cleaned with ozone and ultrasound simultaneously. It has found that cleaning time was the main effect among temperature, time and surfactant. Elevated temperature, addition of surfactant and high ozone concentration helped to accelerate efficient removal of slurry. The improvement of removal efficiency seems to be related to the formation of more active OH radicals. The highly cleaned surface was achieved at 10 wt% ozone, 1 min and 10 vol% surfactant with ultrasound. Application of ozone and ultrasound might be a useful method for PSC process in wafer cleaning.

• Journal of Electrical Engineering and Technology
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• 제10권1호
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• pp.295-298
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• 2015

Ozone micro-bubble cleaning system was designed, and made to develop a unique technique to clean wafers by using ozone micro-bubbles. The ozone micro-bubble cleaning system consisted of loading, cleaning, rinsing, drying and un-loading zones, respectively. In case of the cleaning the silicon wafers of a solar cell, more than 99 % of cleaning efficiency was obtained by dipping the wafers at 10 ppm of ozone for 10 minutes. Both of long cleaning time and high ozone concentration in the wet-solution with ozone micro-bubbles reduced cleaning efficiency because of the re-sorption of debris. The cleaning technique by ozone micro-bubbles can be also applied to various wafers for an ingot and LED as an eco-friendly method.

• 한국결정성장학회지
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• 제23권3호
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• pp.119-123
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• 2013

Most of the world's solar cells in photovoltaic industry are currently fabricated using crystalline silicon. Czochralski-grown silicon crystals are more expensive than multicrystalline silicon crystals. The future of solar-grade Czochralski-grown silicon crystals crucially depends on whether it is usable for the mass-production of high-efficiency solar cells or not. It is generally believed that the main obstacle for making solar-grade Czochralski-grown silicon crystals a perfect high-efficiency solar cell material is presently light-induced degradation problem. In this work, the substitution of boron with gallium in p-type silicon single crystal is studied as an alternative to reduce the extent of lifetime degradation. The diamond-wire sawing technology is employed to slice the silicon ingot. In this paper, the quality of the diamond wire-sawn gallium-doped silicon wafers is studied from the chemical, electrical and structural points of view. It is found that the characteristic of gallium-doped silicon wafers including texturing behavior and surface metallic impurities are same as that of conventional boron-doped Czochralski crystals.

• 한국결정성장학회지
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• 제24권2호
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• pp.47-53
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• 2014

태양전지용 규소에는 단결정, 다결정, mono-like의 세 가지 재료가 사용 중에 있다. 첫 번째로, 단결정은 수율향상의 과제에 집중되고 있으며, 이것은 고액 계면의 형상이 주요 요인으로 알려지고 있다. 이에 대한 연구가 전산모사 등으로 집중되고 있다. 또한 결정과 도가니의 회전 속도가 고액 계면의 형상에 영향을 미치는 것이 확인 되었다. 다결정의 경우에는 결정립계의 역할이 매우 중요하므로 이에 대한 연구가 진행되는데, 이들을 특히 전기적으로 비활성적인 쌍정 입계로 전환하는 연구가 진행되고 있다. 성장 조건을 변경시켜 쌍정 입계로 바꾸어서 재료의 전기적 성질을 향상시키는 결과를 확인하였다. 또한 성장 공정에서 발생될 수 있는 오염을 줄이기 위한 노력은 상부의 Ar 가스의 흐름을 상향 조절하여 불순물의 용입을 줄임이 확인되었다. 다음으로 mono-like인 경우에는 측면으로부터 성장 되어 들어오는 다결정이 단결정의 분율을 저하 시키는 주요 요인이 되고 있다. 이에 대한 해결책으로 하부의 냉각 속도를 높이고 상부와 측면에 단열재를 보강하는 방안이 제시되고 있고, 하부에 놓는 seed의 orientation을 조절하여 측면으로부터 성장 되어 들어오는 다결정을 억제하는 방안이 효과가 있음이 확인 되고 있다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2008년도 추계학술대회 논문집
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• pp.329-332
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• 2008

Nowadays, It is required human body-friendly, good mechanical properties, and economical efficiency material, simultaneously. The material to meet above requirement condition rear up high nitrogen stainless steel(HNS). However, HNS have a lot of problem such as poor workability, hot crack sensitivity. So, It is needed the condition of plastic working to overcome above many problem. In this study, VIM ingot with 100kg was made by pressurized vacuum induction melting. And then, The slab perform for hot rolling was prepared by open-die forging. Hot rolling process was performed by computer simulation according to change of height reduction, rolling temperature, heating numbers, rolling pass and so forth. The results of analysis were investigated between analysis and lab-scale rolling product.

• 전기학회논문지
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• 제61권1호
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• pp.94-98
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• 2012

The behavior of ozone micro bubble cleaning system was investigated to evaluate the solution as a new method of solar cell wafer cleaning in comparison with former conventional RCA cleaning. We have developed the ozone dissolution system in the ozonated water for more efficient cleaning conditions. The optimized cleaning conditions for solar cell wafer process were 10 ppm of ozone concentration and 12 minutes in cleaning periods, respectively. We have confirmed the cleaning reliability and cell efficiencies after ozone micro bubble cleaning. Using this new cleaning technology, it was possible to obtain higher efficiency, higher productivity, and fast tact time for applying cleaning in the fields on bare ingot wafer, LED wafers as well as the solar cell wafer.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.299.2-299.2
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• 2013

We investigated the potassium remaining on a crystalline silicon solar cell after potassium hydroxide (KOH) etching and its effect on the lifetime of the solar cell. KOH etching is generally used to remove the saw damage caused by cutting a Si ingot; it can also be used to etch the rear side of a textured crystalline silicon solar cell before atomic layer-deposited Al2O3 growth. However, the potassium remaining after KOH etching is known to be detrimental to the efficiency of Si solar cells. In this study, we etched a crystalline silicon solar cell in three ways in order to determine the effect of the potassium remnant on the efficiency of Si solar cells. After KOH etching, KOH and tetramethylammonium hydroxide (TMAH) were used to etch the rear side of a crystalline silicon solar cell. To passivate the rear side, an Al2O3 layer was deposited by atomic layer deposition (ALD). After ALD Al2O3 growth on the KOH-etched Si surface, we measured the lifetime of the solar cell by quasi steady-state photoconductance (QSSPC, Sinton WCT-120) to analyze how effectively the Al2O3 layer passivated the interface of the Al2O3 layer and the Si surface. Secondary ion mass spectroscopy (SIMS) was also used to measure how much potassium remained on the surface of the Si wafer and at the interface of the Al2O3 layer and the Si surface after KOH etching and wet cleaning.