• Proceedings of the Korean Vacuum Society Conference
• /
• 2015.08a
• /
• pp.160-160
• /
• 2015

InGaZnO (IGZO) thin-film transistors (TFTs) are very promising due to their potential use in high performance display backplane [1]. However, the stability of IGZO TFTs under the various stresses has been issued for the practical IGZO applications [2]. Up to now, many researchers have studied to understand the sub-gap density of states (DOS) as the root cause of instability [3]. Nomura et al. reported that these deep defects are located in the surface layer of the IGZO channel [4]. Also, Kim et al. reported that the interfacial traps can be affected by different RF-power during RF magnetron sputtering process [5]. It is well known that these trap states can influence on the performances and stabilities of IGZO TFTs. Nevertheless, it has not been reported how these defect states are created during conventional RF magnetron sputtering. In general, during conventional RF magnetron sputtering process, negative oxygen ions (NOI) can be generated by electron attachment in oxygen atom near target surface and accelerated up to few hundreds eV by self-bias of RF magnetron sputter; the high energy bombardment of NOIs generates bulk defects in oxide thin films [6-10] and can change the defect states of IGZO thin film. In this study, we have confirmed that the NOIs accelerated by the self-bias were one of the dominant causes of instability in IGZO TFTs when the channel layer was deposited by conventional RF magnetron sputtering system. Finally, we will introduce our novel technology named as Magnetic Field Shielded Sputtering (MFSS) process [9-10] to eliminate the NOI bombardment effects and present how much to be improved the instability of IGZO TFTs by this new deposition method.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.23 no.12
• /
• pp.961-965
• /
• 2010

In this study, we investigated the optical, electrical, and structural properties of the IGZO($In_2O_3:Ga_2O_3:ZnO$=1:9:90 wt.%) thin films prepared by RF-magnetron sputtering system under various substrate temperatures. All of the IGZO thin films shows an average transmittance of over the 80% in visible range. Most of all, deposited IGZO thin film at $100^{\circ}C$ substrate temperature have ZnO (002) of main growth peak and 17.02 nm of increased grains. And also IGZO thin film have low resistivity($1.35{\times}10^{-3}\;\Omega{\cdot}cm$), high carrier concentration($6.62{\times}10^{20} cm^{-3}$) and mobility($80.1 cm^2$/Vsec). IGZO thin film have 2.08 mV at surface potential of electric force microscopy(EFM). We suggest that pre-annealing at $100^{\circ}C$ can be applied for improving optical, electrical and structural properties.

• Journal of the Semiconductor & Display Technology
• /
• v.16 no.4
• /
• pp.59-62
• /
• 2017

In this paper, atmospheric pressure plasma treatment was proposed for high performance indium gallium zinc oxide thin film transistor (IGZO TFT). RF Ar plasma treatment is performed at room temperature under atmospheric pressure as a simple and cost effective channel surface treatment method. The experimental results show that field effect mobility can be enhanced by $2.51cm^2/V{\cdot}s$ from $1.69cm^2/V{\cdot}s$ to $4.20cm^2/V{\cdot}s$ compared with a conventional device without plasma treatment. From X-ray photoelectron spectroscopy (XPS) analysis, the increase of oxygen vacancies and decrease of metal-oxide bonding are observed, which suggests that the suggested atmospheric Ar plasma treatment is a cost-effective useful process method to control the IGZO TFT performance.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.30 no.10
• /
• pp.625-630
• /
• 2017

ZnS was chemically deposited as a buffer layer alternative to CdS, for use as a Cd-free buffer layer in $Cu(In_{1-x}Ga_x)Se_2$ (CIGS) solar cells. The deposition of a thin film of ZnS was carried out by chemical bath deposition, following which the structural and optical properties of the ZnS layer were studied. For the experiments, zinc sulfate hepta-hydrate ($ZnSO_4{\cdot}7H_2O$), thiourea ($SC(NH_2)_2$), and ammonia ($NH_4OH$) were used as the reacting agents. The mole concentrations of $ZnSO_4$ and $SC(NH_2)_2$ were fixed at 0.03 M and 0.8 M, respectively, while that of ammonia, which acts as a complexing agent, was varied from 0.3 M to 3.5 M. By varying the mole concentration of ammonia, optimal values for parameters like optical transmission, deposition rate, and surface morphology were determined. For the fixed mole concentrations of $0.03M\;ZnSO_4{\cdot}7H_2O$ and $0.8M\;SC(NH_2)_2$, it was established that 3.0 M of ammonia could provide optimal values of the deposition rate (5.5 nm/min), average optical transmittance (81%), and energy band gap (3.81 eV), rendering the chemically deposited ZnS suitable for use as a Cd-free buffer layer in CIGS solar cells.

• Journal of Adhesion and Interface
• /
• v.14 no.1
• /
• pp.28-35
• /
• 2013

In this study, we produced heat-shield coating materials using surface-treated Ga-doped ZnO (GZO) and investigated the dispersity of particle, visible light transmittance, ultraviolet light cut off, infrared light cut-off, heat-shielding property by surface-treating compounds and treatment conditions. In the case of using IPA or acryl binder for heat-shield coating, the dispersity of inorganic oxide particles was poor but in the case of using surface-treated inorganic oxide particles by hybrid compound having urethane (urea) group, acryl group and silica, dispersity of particle, visible light transmittance and haze were improved. We used the measurement kit and sunlamp for measuring heat-shielding property and confirmed that the internal temperature of the measurement kit using heat-shield film was lower more than $4.8^{\circ}C$ in comparison with using PET film for itself.

• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.66 no.4
• /
• pp.721-726
• /
• 2017

We fabricated stretchable thin-film transistors(TFTs) on a polydimethylsiloxane substrate with patterned polyimide island structures by using an amorphous InGaZnO semiconductor and parylene gate insulator. The TFTs exhibited a field- effect mobility of $5cm^2V^{-1}s^{-1}$ and a current on/off ratio of $10^5$ at a relatively low operating voltage. Furthermore, the fabricated transistors showed no noticeable changes in their electrical performance for large strains of up to 50 %.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.02a
• /
• pp.170-170
• /
• 2012

최근 주목받고 있는 amorphous InGaZnO (a-IGZO) thin film transistors (TFTs)는 수소가 첨가된 비정질 실리콘 TFT (a-Si;H)에 비해 비정질 상태에서도 높은 이동도와 뛰어난 전기적, 광학적 특성에 의해 큰 주목을 받고 있다. 또한 넓은 밴드갭에 의해 가시광 영역에서 투명한 특성을 보이고, 플라스틱 기판 위에서 구부러지는 성질에 의해 플랫 패널 디스플레이나 능동 유기 발광 소자 (AM-OLED), 투명 디스플레이에 응용되고 있다. 하지만, 실제 디스플레이가 동작하는 동안 스위칭 TFT는 백라이트 또는 외부에서 들어오는 빛에 지속적으로 노출되게 되고, 이 빛에 의해서 TFT 소자의 신뢰성에 악영향을 끼친다. 또한, 디스플레이가 장시간 동안 동작 하면 내부 온도가 상승하게 되고 이에 따른 온도에 의한 신뢰성 문제도 동시에 고려되어야 한다. 특히, 실제 AM-LCD에서 스위칭 TFT는 양의 게이트 전압보다 음의 게이트 전압에 의해서 약 500 배 가량 더 긴 시간의 스트레스를 받기 때문에 음의 게이트 전압에 대한 신뢰성 평가는 대단히 중요한 이슈이다. 스트레스에 의한 문턱 전압의 변화는 게이트 절연막과 반도체 채널 사이의 계면 또는 게이트 절연막의 벌크 트랩에 의한 것으로 게이트 절연막의 선택에 따라서 신뢰성을 효과적으로 개선시킬 수 있다. 본 연구에서는 적층된 $Si_3N_4/SiO_2$ (NO 구조) 이중층 구조를 게이트 절연막으로 사용하고, 완충층의 역할을 하는 $SiO_2$막의 두께에 따른 소자의 전기적 특성 및 신뢰성을 평가하였다. a-IGZO TFT 소자의 전기적 특성과 신뢰성 평가를 위하여 간단한 구조의 pseudo-MOS field effect transistor (${\Psi}$-MOSFET) 방법을 이용하였다. 제작된 소자의 최적화된 $SiO_2$ 완충층의 두께는 20 nm이고 $12.3cm^2/V{\cdot}s$의 유효 전계 이동도, 148 mV/dec의 subthreshold swing, $4.52{\times}10^{11}cm^{-2}$의 계면 트랩, negative bias illumination stress에서 1.23 V의 문턱 전압 변화율, negative bias temperature illumination stress에서 2.06 V의 문턱 전압 변화율을 보여 뛰어난 전기적, 신뢰성 특성을 확인하였다.

• Journal of the Semiconductor & Display Technology
• /
• v.19 no.2
• /
• pp.72-76
• /
• 2020

The author demonstrated organic ferroelectric thin-film transistors with ferroelectric materials of P(VDF-TrFE) and an amorphous oxide semiconducting In-Ga-Zn-O channel on the silicon substrates. The organic ferroelectric layers were deposited on an oxide semiconductor layer by Langmuir-Blodgett method and then annealed at 128℃ for 30min. The carrier mobility and current on/off ratio of the memory transistors showed 9 ㎠V^-1s^-1 and 6 orders of magnitude, respectively. We can conclude from the obtained results that proposed memory transistors were quite suitable to realize flexible and werable electronic applications.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.16 no.2
• /
• pp.102-107
• /
• 2003

This study puts focus on the optimization of growth temperature of CIGS absorber layer which affects severely the performance of solar cells. The CIGS absorber layers were prepared by three-stage co-evaporation of metal elements in the order of In-Ga-Se. The effect of the growth temperature of 1st stage was found not to be so important, and 350$^{\circ}C$ to be the lowest optimum temperature. In the case of growth temperature at 2nd/3rd stage, the optimum temperature was revealed to be 550$^{\circ}C$. The XRD results of CIGS films showed a strong (112) preferred orientation and the Raman spectra of CIGS films showed only the Al mode peak at 173cm$\^$-1/. Scanning electron microscopy results revealed very small grains at 2nd/3rd stage growth temperature of 480$^{\circ}C$. At higher temperatures, the grain size increased together with a reduction in the number of the voids. The optimization of experimental parameters above mentioned, through the repeated fabrication and characterization of unit layers and devices, led to the highest conversion efficiency of 15.4% from CIGS-based thin film solar cell with a structure of Al/ZnO/CdS/CIGS/Mo/glass.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.08a
• /
• pp.339-339
• /
• 2012

지난 몇 년 동안, 투명 비정질 산화물 반도체는 유기 발광 다이오드, 플렉서블 전자 소자, 솔라 셀, 바이오 센서 등 많은 응용분야에 연구되고 있다. 투명 비정질 산화물 반도체 그룹들 중, 특히 비정질 IGZO 박막 트랜지스터는 비정질 상태임에도 불구하고 높은 이동도와 낮은 동작 전압으로 훌륭한 소자 특성을 보인다. 이러한 고성능의 IGZO 박막 트랜지스터는 RF 마그네트론 스퍼터링이나 pulsed laser deposition과 같은 고진공 장비를 이용하여 이미 여러 그룹에서 제작되고 발표되었다. 하지만 진공 증착 시스템은 제조 비용의 절감이나 디스플레이 패널의 대면적화에 큰 걸림돌이 되고 있고, 이러한 문제점을 극복하기 위해서 용액 공정은 하나의 해결책이 될 수 있다. 용액 공정의 가장 큰 장점으로는 저온 공정이 가능하기 때문에 글라스나 플라스틱 기판에서 대면적으로 제작할 수 있고 진공 장비가 필요없기 때문에 제조 비용을 획기적으로 절감시킬 수 있다. 본 연구에서는 high-k 게이트 절연막과 IGZO 채널 층을 용액 공정을 이용하여 박막 트랜지스터를 제작하고 그에 따른 전기적 특성을 분석하였다. IGZO의 몰 비율은 In, Ga, Zn 순으로 각각 0.2 mol, 0.1 mol, 0.1 mol로 제작하였고, high-k 게이트 절연막으로는 Al2O3, HfO2, ZrO2을 제작하였다. 또한, 용액 공정 IGZO TFT를 제작하기 전, 용액 공정 high-k 게이트 절연막 캐패시터를 제작하여 그 특성을 분석하였다. 다양한 용액 공정 high-k 게이트 절연막 중, 용액공정 HfO2를 이용한 IGZO TFT는 228.3 [mV/dec]의 subthreshold swing, 18.5 [$cm^2/V{\cdot}s$]의 유효 전계 이동도, $4.73{\times}106$의 온/오프 비율을 보여 매우 뛰어난 전기적 특성을 확인하였다.