• 한국항해학회지
• /
• 제15권3호
• /
• pp.99-106
• /
• 1991

In order to grow InGaAsP epitaxial layer on GaAs by LPE, an accurate phase diagram for In-Ga-As-P quarternary compounds is required. But the short wavelength InGaAsP/GaAs phase diagram for full wavelength range was not yet reported. In this study, therefore, a theoretical calculation has been carried out by using thermodynamic's equation for InGaAsP/GaAs in order to get the relation between the mole fraction of the sloute and solid phase compounds. And the calculation being compared with the dta of Kawanishi et. al, the result has been shown that his phase diagram obtained by the calculation can apply to growing InGaAsP/GaAs by LPE.

• 전자공학회논문지A
• /
• 제29A권9호
• /
• pp.36-45
• /
• 1992

The Modified Multi-Quantum Well(MMQWAl) structures have been grown by Mental-Organic chemical Vapor Deposition(MOCVD) method and stripe type MMQW laser diodes have been investigated. In the case of GaAs/AlGaAs superlattice and quantum well growth by MOCVD, the periodicity, interface abruptess, Al compositional uniformity and layer thickness have been confirmed though the shallow angle lapping technique, double crystal x-ray diffractometry (DCXD) and photoluminescence (PL) measurement. stripe-type MMQW laser diodes have been fabricated using the process technology of photolithography, chemical etching, ohmic contact, back side removing and cleaving. As the result of the electrical and opticalmeasurement of these laser diodes, we have achieved the series resistance of $1[\Omega}~2{\Omega}$ by current-voltage measurements, the threshold current of 200-300mA by currnt-light measurements and the lasing wavelength of 8000-8400$\AA$ by lasing spectrum measurements.

• JSTS:Journal of Semiconductor Technology and Science
• /
• 제15권5호
• /
• pp.497-503
• /
• 2015

It is essential to acquire an accurate and simple technique for extracting the interface trap density ($D_{it}$) in order to characterize the normally-off gate-recessed AlGaN/GaN hetero field-effect transistors (HFETs) because they can undergo interface trap generation induced by the etch damage in each interfacial layer provoking the degradation of device performance as well as serious instability. Here, the frequency-dependent capacitance-voltage (C-V) method (FDCM) is proposed as a simple and fast technique for extracting $D_{it}$ and demonstrated in normally-off gate-recessed AlGaN/GaN HFETs. The FDCM is found to be not only simpler than the conductance method along with the same precision, but also much useful for a simple C-V model for AlGaN/GaN HFETs because it identifies frequency-independent and bias-dependent capacitance components.

• JSTS:Journal of Semiconductor Technology and Science
• /
• 제14권5호
• /
• pp.601-608
• /
• 2014

In this paper, we have characterized the electrical properties related to gate leakage current in AlGaN/GaN MISHFETs with varying the thickness (0 to 10 nm) of $Al_2O_3$ gate insulator which also serves as a surface protection layer during high-temperature RTP. The sheet resistance of the unprotected TLM pattern after RTP was rapidly increased to $1323{\Omega}/{\square}$ from the value of $400{\Omega}/{\square}$ of the as-grown sample due to thermal damage during high temperature RTP. On the other hand, the sheet resistances of the TLM pattern protected with thin $Al_2O_3$ layer (when its thickness is larger than 5 nm) were slightly decreased after high-temperature RTP since the deposited $Al_2O_3$ layer effectively neutralizes the acceptor-like states on the surface of AlGaN layer which in turn increases the 2DEG density. AlGaN/GaN MISHFET with 8 nm-thick $Al_2O_3$ gate insulator exhibited extremely low gate leakage current of $10^{-9}A/mm$, which led to superior device performances such as a very low subthreshold swing (SS) of 80 mV/dec and high $I_{on}/I_{off}$ ratio of ${\sim}10^{10}$. The PF emission and FN tunneling models were used to characterize the gate leakage currents of the devices. The device with 5 nm-thick $Al_2O_3$ layer exhibited both PF emission and FN tunneling at relatively lower gate voltages compared to that with 8 nm-thick $Al_2O_3$ layer due to thinner $Al_2O_3$ layer, as expected. The device with 10 nm-thick $Al_2O_3$ layer, however, showed very high gate leakage current of $5.5{\times}10^{-4}A/mm$ due to poly-crystallization of the $Al_2O_3$ layer during the high-temperature RTP, which led to very poor performances.

• 한국진공학회지
• /
• 제17권4호
• /
• pp.359-364
• /
• 2008

금속 유기화학 증착기 (metal-organic chemical vapor deposition)를 이용하여 사파이어 기판 위에 $Al_{0.3}Ga_{0.7}N$/GaN 및 $Al_{0.3}Ga_{0.7}N/GaN/Al_{0.15}Ga_{0.85}N/GaN$ 이종접합 구조들을 성장하고, 이들 시료의 전자와 정공들 간의 구속 효과를 조사하기 위하여 광학적, 구조적 특성을 비교하였다. 저온 (10 K) photoluminescence 실험으로부터 $Al_{0.3}Ga_{0.7}N$/GaN 단일 이종접합 구조의 경우 3.445 eV에서 단일의 이차원 전자가스 (two-dimensional electron gas; 2DEG) 관련된 발광을 관찰한 반면, $Al_{0.3}Ga_{0.7}N/GaN/Al_{0.15}Ga_{0.85}N/GaN$ 다중 이종접합 구조의 경우 3.445 eV에서 뿐만 아니라, 3.42 eV에서 추가적인 2DEG 관련된 발광을 관찰 할 수 있었다. 이 두 개의 2DEG 관련 신호들의 근원을 조사하기 위하여 $Al_{0.3}Ga_{0.7}N/GaN/Al_{0.15}Ga_{0.85}N/GaN$ 다중 이종접합구조에서의 에너지 밴드 구조를 이론적으로 계산하여 실험과 비교한 결과, 하나의 2DEG에 의한 서로 다른 버금띠로 부터가 아닌 다중 구조에 형성된 두 개의 2DEG로부터의 신호로 해석되었다.

• 전자공학회논문지A
• /
• 제30A권10호
• /
• pp.33-40
• /
• 1993

A reflection type 16x8 S-SEED array from LP(Low Pressure)-MODVD-grown GaAs/AlGaAs extremely shallow quantum well(ESQW) structures, with 4% Al fraction, has been fabricated. Its intrinsic region consists of 50 pairs of alternating 100.angs. GaAs and 100.angs. $Al_{0.04}$Ga$_{0.96}$As layers. A multilayer reflector stack of $Al_{0.04}$/Ga$_{0.96}$ As(599$\AA$)/AlAs(723$\AA$) was incorporated for the reflection plane below the p-i-n structures. The device processing after the MOCVD growth includes the mesa etching, isolation etching, insulator deposition, p & n metallization, and AR(Anti-Reflection) coating. For switching characteristics of the S-SEED in the form of p-i-n ESQW diode, the maximum optical negative resistance was observed at 856nm. Reflectance measurements showed a change from 15.6% to 43.3% for +0.9V to -6V bias. The maximum contrast ration of the S-SEED array was 2.0 and all the 128 devices showed optical bistability with contrast ratios over 2.4 at 5V reverse bias.

• 한국재료학회:학술대회논문집
• /
• 한국재료학회 1994년도 추계 학술발표 강연 및 논문 개요집
• /
• pp.99-99
• /
• 1994

• 한국진공학회지
• /
• 제18권3호
• /
• pp.208-212
• /
• 2009

MBE법으로 성장된 InAs/AlAs 양자점(quantum dots; QD) 구조의 광학적 특성을 photoreflectance(PR) 이용하여 조사하였다. Wetting layer(WL) 두께에 따른 전체 장벽의 폭이 달라짐에 따라 GaAs 완충층 및 WL 신호의 세기가 변화되었다. QD 층이 식각된 시료의 상온 PR측정 결과로부터 $1.1{\sim}1.4\;eV$ 영역의 완만한 신호는 InAs QDs과 WL에 관련된 신호임을 알았다. 온도 $450{\sim}750^{\circ}C$범위에서 열처리 시켰을 때 WL층의 PR 신호가 red shift하였는데, 이는 열처리 후 InAs WL와 AlAs층 사이에 Al과 In의 내부 확산에 의해 양자점의 크기가 균일하게 재분포 되고, WL의 임계 두께가 증가하였음을 나타낸다.

• Journal of the Optical Society of Korea
• /
• 제5권3호
• /
• pp.83-89
• /
• 2001

Room temperature quasi-continuous operation is achieved near 1556 nm with threshold current as low as 2.2 mA from a 5.6-${\mu}{\textrm}{m}$ oxide-aperture vertical-cavity surface-emitting laser. Wafer fusion techniques are employed to combine the GaAs/AlGaAs mirror and the InP-based InGaAs/InGaAsP active layer. In this structure, an $Al_x/O_y$/GaAs distributed bragg reflector and intra-cavity contacts are used to reduce free carrier absorption.

• 한국진공학회지
• /
• 제18권5호
• /
• pp.352-357
• /
• 2009

본 연구에서는 1.1 eV의 에너지대역을 흡수할 수 있는 InAs 양자점구조와 1.3 eV의 에너지 대역을 흡수 할 수 있는 InGaAs 양자우물구조를 이용한 텐덤형 태양전지의 구조를 1D poisson을 이용해 설계하고, 분자선 에피택시 장비를 이용하여 각각 5, 10, 15층씩 쌓은 양자점 및 양자우물구조를 삽입하여 p-n접합을 성장하였다. Photoluminescence (PL) 측정을 이용한 광학적특성 평가에서 양자점 5층 및 양자우물 10층을 삽입한 구조의 PL 피크가 가장 높은 상대발광강도를 나타냈으며, 각각 1.1 eV 및 1.3 eV에서 57.6 meV 및 12.37 meV의 Full Width at Half Maximum을 나타내었다. 양자점의 밀도 및 크기는 Reflection High-Energy Electron Diffraction system과 Atomic Force Microscope를 이용해 분석하였다. 그리고 GaAs/AlGaAs층을 이용한 터널접합에서는 I-V 측정을 통하여 GaAs층의 두께(20, 30, 50 nm)에 따른 터널링 효과를 평가하였다. GaAs 층의 두께가 30 nm 및 50 nm의 터널접합에서는 backward diode 특성을 나타낸 반면, 20 nm GaAs층의 GaAs/AlGaAs 터널접합에서는 다이오드 특성 곡선을 확인하였다.