• Journal of Korean Society of Industrial and Systems Engineering
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• v.39 no.1
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• pp.130-139
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• 2016

The purpose of this paper is to analyze the problems and the sources of defective products and draw improvement plans in a small plastic boat manufacturing process using TOC (Theory Of Constraints) and statistical analysis. TOC is a methodology to present a scheme for optimization of production process by finding the CCR (Capacity Constraints Resource) in the organization or the all production process through the concentration improvement activity. In this paper, we found and reformed constraints and bottlenecks in plastic boat manufacturing process in the target company for less defect ratio and production cost by applying DBR (Drum, Buffer, Rope) scheduling. And we set the threshold values for the critical process variables using statistical analysis. The result can be summarized as follows. First, CCRs in inventory control, material mix, and oven setting were found and solutions were suggested by applying DBR method. Second, the logical thinking process was utilized to find core conflict factors and draw solutions. Third, to specify the solution plan, experiment data were statistically analyzed. Data were collected from the daily journal addressing the details of 96 products such as temperature, humidity, duration and temperature of heating process, rotation speed, duration time of cooling, and the temperature of removal process. Basic statistics and logistic regression analysis were conducted with the defection as the dependent variable. Finally, critical values for major processes were proposed based on the analysis. This paper has a practical importance in contribution to the quality level of the target company through theoretical approach, TOC, and statistical analysis. However, limited number of data might depreciate the significance of the analysis and therefore it will be interesting further research direction to specify the significant manufacturing conditions across different products and processes.

• International Journal of Quality Innovation
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• v.10 no.1
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• pp.1-23
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• 2009

Face the process yield rate improvements of motherboard, although general enterprises finish deployment goal of each functions by overall quality managements, through quality improvement methods, industry engineering methods, plan-do-check-act (PDCA) methods and other improvement solutions, but it is only can be improved partially and unable to enhance the yield rate of product to the target. It only can takes one step ahead to enhance the process yield rate of motherboard with six sigma ($6{\sigma}$) overall DMAIC process and tactics. This research aimed to use six sigma quality improvement tactics by DMAIC systematic procedure and tactics, and find the key factors that effect to the process yield rate of surface mount technology. It also identified the keys input and process and output index to satisfy customer requirements and internal process index. The results showed that the major effective factors by fishbone and process failure modes and effects analysis (PFMEA). If the index of input and output that can be quantified, the optimum parameter can be found through design of experiment to ensure that the process is stable. If the factor of input and output that cannot be quantified, we found out the effective countermeasure by Mind_Mapping, make sure whole processes can be controlled stably, to reach the high product quality and enhance the customer satisfaction.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.2
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• pp.100-105
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• 2004

The influencing factors on the OPC (optical proximity correction) results are quantitatively analyzed using OPCed L/S patterns. ${\sigma}$ values of proximity variations are measured to be 9.3 nm and 15.2 nm for PR-A and PR-B, respectively. The effect of post exposure bake condition is assessed. 16.2 nm and 13.8 nm of variations are observed. Proximity variations of 11.6 nm and 15.2 nm are measured by changing the illumination condition. In order not to seriously deteriorate the OPC, these factors should be fixed after the OPC rules are extracted. Proximity variations of 11.4, 13.9, and 15.2 nm are observed for the mask mean-to-targets of 0, 2 and 4 nm, respectively. The decrease the OPC grid size from 1 nm to 0.5 nm enhances the correction resolution and the OCV is reduced from 14.6 nm to 11.4 nm. The enhancement amount of proximity variations are 9.2 nm corresponding to 39% improvement. The critical dimension (CD) uniformity improvement for adopting the small grid size is confirmed by measuring the CD uniformity on real SRAM pattern. CD uniformities are measured 9.9 nm and 8.7 nm for grid size of 1 nm and 0.5 nm, respectively. 22% improvement of the CD uniformity is achieved. The decrease of OPC grid size is shown to improve not only the proximity correction, but also the uniformity.

• The Journal of Information Systems
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• v.31 no.1
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• pp.239-269
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• 2022

Purpose This paper attempts to identify items for improving the usage of PLM(Product Lifecycle Management) systems and suggests ways to prioritize improvement items on the basis of importance. It also tries to find out differences in the importance of improvement items due to the company size, the industry, the job, or the PLM solution. Design/methodology/approach Through a survey from participants to a PLM System Conference, data were collected from a sample of 181 users who had the previous experience in using a PLM system. In order to figure out the differences in the importance among user groups, the F-test with the Scheffe test as a post-hoc analysis was used in case of equal variances and the Welch test with the Dunnett T3 test was used in case of unequal variances. Findings This study sorted out 25 improvement ideas according to their importance assessed by the PLM system users. The top five ideas are improving data consistency, error minimization, fast system response time, enhancing user recognition, and business process improvement. The support group puts higher importance than the general user group in data consistency, fast system response time, enhancing user recognition, business process improvement, dedicated team for data consistency, continuous support from management, hardware performance upgrade, output linkage to other systems, and shortening problem solving duration. The largest company group attaches significantly higher weights than the smallest company group to data consistency, error minimization, fast system response time, business process improvement, dedicated team for data consistency, security with proper access management, output linkage to other systems, and better user interface.

• International Journal of Quality Innovation
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• v.1 no.1
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• pp.89-96
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• 2000

Evolutionary operation (EVOP) is a continuous improvement system which explores a region of process operating conditions by deliberately creating some systematic changes to the process variable levels without jeopardizing the product. It is aimed at securing a satisfactory operating condition in full-scale manufacturing processes, which is generally different from that obtained in laboratory or pilot plant experiments. Information on how to improve the process is generated from a simple experimental design. Traditional EVOP procedures are established on the assumption that the variance of the response variable should be small and stable in the region of the process operation. However, it is often the case that process noises have an influence on the stability of the process. This process instability is due to many factors such as raw materials, ambient temperature, and equipment wear. Therefore, process variables should be optimized continuously not only to meet the target value but also to keep the variance of the response variables as low as possible. We propose a scheme to achieve robust process improvement. As a process performance measure, we adopted the mean square error (MSE) of the replicate response values on a specific operating condition, and used the Kruskal-Wallis test to identify significant differences between the process operating conditions.

• International Commerce and Information Review
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• v.14 no.3
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• pp.559-583
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• 2012

This study was conducted on the assumption that for Incheon international airport to become the logistics hub of northeast asia's region, it is necessary to investigate and analyze problems of forwarder's international air cargo transportation process, those factors and so on. The conditions of the process of international air cargo transportation was analysed individually according to the time required, satisfaction and problems of each step of process by dividing those into import and export. Consequently it turned out that the time required for the export process of the international air cargo transportation is longer by about 1 hour than the import process which means the improvement of import section rather than export is more urgent to improve the overall international air cargo transportation process. For the improvement of the process, it is also necessary to construct the international air cargo transportation' information system, secure competition of operating and to improve logistics standardization by considering all factors above.

• Proceedings of the Korean Institute Of Construction Engineering and Management
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• autumn
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• pp.527-530
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• 2002

The purpose of this study is to present an improvement of the form work process. The current slab form work has waste factor by unnecessary process and not complete integration with the finishing process. Therefore the study used value stream analysis methodology for effective improvement of slab form work process. The main contents of the study are as follows; 1) Understanding of non-value adding activities in existing slab form work process 2) Process integration by value stream mapping 3) Effect analysis of time-cost reduction. The study recommends that, as a future research, development of tool and technique for the non-value adding activities are eliminated in building construction.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.1040-1043
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• 2004

As time goes by, the market demand increases and each LCD panel manufacturing company makes every effort to produce more panels in a limited time. It is necessary to reduce the cost and time of production for the improvement of productivity in manufacturing companies. The increased speed of thin films growth used in the TFT process brings improvement of productivity but it is also accompanied by a drop in display quality due to a characteristic change of the thin film. So in our dissertation, we deal with the increased speed of a-Si layer growth and the proportioned a drop in characteristic quality. We discuss a drop in display quality by a characteristic change of a-Si layer and we propose a counter-plan through panel design improvement. We have already applied our plan to the 15" XGA panel and confirmed the improved result.

• Journal of Korean Society for Quality Management
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• v.33 no.3
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• pp.19-30
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• 2005

Recently many organization to become survival in changing marketplace, they must commit to implementing tools, systems, and quality management techniques. In this paper we develop process method of Team's problem-solving to reduce in failure costs. This paper suggest the step process how to measure quality cost reasonably that works in all types organizations. Or what is continuous improvement? Continuous improvement can be described as the continuous reduction of variation. Variation has many sources(machines, methods, materials, measurements, people, and environments) and cause(special & common in organization). As quality cost are not the answer to every organization financial, or quality-related problem, it's real results are designing & implementing quality cost system might be the answer.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.10
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• pp.883-890
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• 2005

In this paper, the established model of NBTI (Negative Bias Temperature Instability) mechanism was reviewed. Based on this mechanism, then, the influence of nitrogen was discussed among other processes. A constant concentration of nitrogen exists inside $SiO_2$ in order to prevent boron from diffusing and to increase dielectric constant. It was shown that NBTI improvement was achieved by controlling nitrogen profile. It was supposed that the existence of low activation energy of Si-N bonds at $Si-SiO_2$ interface attributes the improvement by making hydrogen prevent interface traps. It was also shown that improvement of NBTI can be achieved by more effective control of nitrogen profile. It was supposed that the maximum control of nitrogen profile can be achieved by DPN (Decoupled Plasma Nitridation) process.