• The Transactions of The Korean Institute of Electrical Engineers
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• v.57 no.4
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• pp.653-659
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• 2008

This paper describes the design of high power transistor packages using high power chip transistor dies, chip capacitors and a new wire bonding technique. Input impedance variation and output power performances according to wire inductance and resistance for internal matching are also discussed. A multi crossing type(MCT) wire bonding technique is proposed to replace the conventional stepping stone type(SST) wire bonding technique, and eventually to improve the output power performances of high power transistor packages. Using the proposed MCT wire bonding technique, it is possible to design high power transistor packages with highly improved output power compared to SST even the package size is kept to be the same.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.4 no.1
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• pp.23-32
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• 1997

The change in moisture content of moisture sensitive products in moisture-semipermeable packages was investigated for the purpose of predicting the shelf life of a product-package combination. A mathematical model, and a computer program based on the physiochemical properties of the product and the moisture permeability of the package was developed. The moisture content for products in moisture-semipermeable packages was determined under various environmental conditions and the results were compared with the predicted values by means of the simulation model. These experimental studies demonstrated that the prediction of the change in moisture content of packaged products over time by the simulation model is accurate, within a practical range of temperature and relative humidity values. The developed semi-empirical model is considered to have applications in industry, since it provides product shelf life information for a range of temperature and relative humidity conditions, with a limited number of experimentally obtained data points.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.882-884
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• 2005

A new rectangular shape microlens array having high sag for solid-state lighting is presented. Proposed microlens, which has high sag, over $375{\mu}m$ and large diameter, over 3 mm can enormously enhance output optical extraction efficiency. Rectangular shape of microlens can maximize the fill factor of light-emitting-diode (LED) package and minimize the optical loss at the same time. This wafer level microlens array is fabricated on LED package. It has many advantages in optical properties, low cost, high aligning accuracy, and mass production.

• Journal of the Korean Physical Society
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• v.73 no.11
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• pp.1750-1759
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• 2018

A complete code-package for gyrotron simulation to analyze its performance is under development in UNIST, Korea. We first time report the present status of the code-package named as UNIST Gyrotron Design Tool (UGDT). It can perform design simulations for gyrotron's interaction cavity, RF window, and the essential mode calculations including the study of mode competition. We will discuss about its salient features, theory, numerical implementation, and its calculation result for 95 GHz UNIST Gyrotron. Moreover, we will validate its capability to perform the mode competition calculation for fundamental and second harmonic modes.

• ETRI Journal
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• v.27 no.1
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• pp.114-117
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• 2005

In this paper, we propose a key management scheme which can provide delivery of the key used to encrypt a digital content from the package server to digital rights management (DRM) clients in a secure manner. The proposed scheme can protect digital content from attacks since an encrypted digital content is sent by a package server and only DRM clients can decrypt the encrypted digital content. It protects the key not only from purchasers but also among the other principals who manage the distribution and license servers.

• Transactions of the Korean Society of Mechanical Engineers
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• v.6 no.4
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• pp.384-389
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• 1982

It is necessary that machine tool structures should be designed so that they will cause a minimum chance of machining chatter. In order to do this, a computer program package is developed utilizing Finite Element Method, modal flexibility and energy balance method. Validity of the program package is verified through computer simulation analysis and impulse test of a simplified machine tool structure.

• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.1053-1056
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• 1998

Package strutures for RF circuit design are characterized and their equivalent circuitsare developed. The circuit parameters are extracted by using the commercial 3-dimensional field solver. The circuit models are verified by using the full-wave analysis in the RF region. It is demonstarted with the developed circuit models that the packages have substantial effects on the RF circuit performances.

• Proceedings of the IEEK Conference
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• 1999.06a
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• pp.385-388
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• 1999

A new frequency-variant equivalent circuit model of power/ground plane is presented. The equivalent circuit is modeled with grid cells. The circuit parameters of each cell were extracted by using Fasthenry. To verify the developed circuit model, its s-parameters are compared with the measured s-parameters 〔2〕 and the full-wave simulation-based s-parameters. Consequently, it is shown that our frequency-variant equivalent circuit model can accurately predict imperfect ground effects under the high frequency operation of electronic package.

• Journal of Surface Science and Engineering
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• v.36 no.2
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• pp.214-225
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• 2003

Trends in microelectronics packages such as low cost, miniaturization, high performance, and high reliability made area array interconnecting technologies including flip chip, CSP (Chip Scale Package) and BGA (Ball Grid Array) mainstream technologies. Underfill technology is used for the reliability of the area array technologies, thus electronics packaging industry regards it as very important technology In this paper, the underfill technology is reviewed and the recent advances in the underfill technology including new processes and materials are introduced. These includes reworkable underfills, no-flow underfills, molded underfills and wafer - level - applied underfills.

• Journal of Korean Institute of Industrial Engineers
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• v.15 no.1
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• pp.17-21
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• 1989

The problem to determine Economic Order Quantity(EOQ) occurs when price discounts or uncharged additions are offered for the purchase in the unit of package. It is found that the annual inventory cost needs to be evaluated for at most three alternative order sizes to find EOQ, which is easier than the case of all-unit or incremental quantity discount. Numerical examples are presented.