RF Package Characterization and Equivalent Circuit Model

RF 패키지 특성화 및 등가 회로 모델

Package strutures for RF circuit design are characterized and their equivalent circuitsare developed. The circuit parameters are extracted by using the commercial 3-dimensional field solver. The circuit models are verified by using the full-wave analysis in the RF region. It is demonstarted with the developed circuit models that the packages have substantial effects on the RF circuit performances.