• Proceedings of the Korean Magnestics Society Conference
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• 2003.12a
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• pp.223-223
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• 2003

• Proceedings of the Korean Institute of Navigation and Port Research Conference
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• 2015.10a
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• pp.233-236
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• 2015

전 세계 해기교육기관에서 해사영어(Maritime English, ME)를 가르치고 있는 교원들이 모여 매년 개최하는 IMEC (International Maritime English Conference)을 소개하고, 2015년에 개최된 제27차 컨퍼런스의 프로그램을 우리 회원들에게 안내하고자 하며, IMEC 27에서 소개된 ChatBot를 가지고 참석한 회원들과 함께 진행하는 워크숍을 개최하고자 한다.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.135-138
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• 2004

This paper describes the architecture, the basic operation principle and detailed experimental results of digitally programmable high-voltage generators that can be used in monolithic low-power high-voltage bistable LCD drivers. Two different design approaches, depending on whether the application allows the use of external passive components or not, are analyzed.

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.92.1-92
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• 1998

• JSTS:Journal of Semiconductor Technology and Science
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• v.2 no.1
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• pp.1-6
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• 2002

A new closed-form expressions to calculate frequency-dependent distributed inductance and the associated distributed series resistance of single interconnect on a lossy silicon substrate (CMOS technology) are presented. The proposed analytic model for series impedance is based on a self-consistent field method and the vector magnetic potential equation. It is shown that the calculated frequency-dependent distributed inductance and the associated resistance are in good agreement with the results obtained from rigorous full wave solutions and CAD-oriented equivalent-circuit modeling approach.

• Electronics and Telecommunications Trends
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• v.38 no.4
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• pp.25-35
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• 2023

As the global semiconductor supply chain falters, major countries are pushing to increase their self-sufficiency in semiconductors. In accordance with these global changes, R&D cooperation is evolving in the semiconductor industry. Previously, as for the case of Interuniversity Microelectronics Center (IMEC) in Europe, many cooperation initiatives were established regardless of nationality for improving productivity through measures such as reducing the time and cost required for joint research. Recently, however, cooperation aimed at strengthening one's own industry has been prominent, such as that led by Taiwan Semiconductor Research Institute (TSRI) and the United States National Semiconductor Technology Center (NSTC). Hence, the Korean semiconductor industry also needs to respond. Internally, technology localization should be promoted by strengthening the foundation for domestic R&D cooperation, while externally, it should expand close cooperation with companies from countries leading the semiconductor industry, such as the United States, Europe, and Japan.

• JSTS:Journal of Semiconductor Technology and Science
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• v.1 no.4
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• pp.209-215
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• 2001

In this paper a method for analysis and modelling of coplanar transmission interconnect lines that are placed on top of silicon-silicon oxide substrates is presented. The potential function is expressed by series expansions in terms of solutions of the Laplace equation for each homogeneous region of layered structure. The expansion coefficients of different series are related to each other and to potentials applied to the conductors via boundary conditions. In the plane of conductors, boundary conditions are satisfied at $N_d$ discrete points with $N_d$ being equal to the number of terms in the series expansions. The resulting system of inhomogeneous linear equations is solved by matrix inversion. No iterations are required. A discussion of the calculated line admittance parameters as functions of width of conductors, thickness of the layers, and frequency is given. The interconnect capacitance and conductance per unit length results are given and compared with those obtained using full wave solutions, and good agreement have been obtained in all the cases treated

• Journal of Communications and Networks
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• v.14 no.1
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• pp.75-90
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• 2012

Thin client computing trades local processing for network bandwidth consumption by offloading application logic to remote servers. User input and display updates are exchanged between client and server through a thin client protocol. On wireless devices, the thin client protocol traffic can lead to a significantly higher power consumption of the radio interface. In this article, a cross-layer framework is presented that transitions the wireless network interface card (WNIC) to the energy-conserving sleep mode when no traffic from the server is expected. The approach is validated for different wireless channel conditions, such as path loss and available bandwidth, as well as for different network roundtrip time values. Using this cross-layer algorithm for sample scenario with a remote text editor, and through experiments based on actual user traces, a reduction of the WNIC energy consumption of up to 36.82% is obtained, without degrading the application's reactivity.

• JSTS:Journal of Semiconductor Technology and Science
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• v.17 no.3
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• pp.333-340
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• 2017

In this paper, we describe HW/SW co-optimizations for reconfigurable application specific instruction-set processors (ASIPs). Based on our previous very long instruction word (VLIW) ASIP, the proposed framework realizes various forward error-correction (FEC) algorithms for wireless communication systems. In order to enhance the energy efficiency, we newly introduce several design methodologies including high-radix algorithms, task-level out-of-order executions, and intensive resource allocations with loop-level rescheduling. The case study on the radix-4 turbo decoding shows that the proposed techniques improve the energy efficiency by 3.7 times compared to the previous architecture.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.802-805
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• 2007

A hardware architecture is presented of a wavelet based multiple line addressing driving scheme for passive matrix displays using the FPGA (Field Programmable Gate Arrays), which will be integrated in the scalable video coding $architecture^{[1]}$. The incoming compressed video data stream will then directly be transformed to the required column voltages by the hardware architecture without the need of employing the video decompression.