• 한국세라믹학회지
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• 제54권1호
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• pp.38-42
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• 2017

Vanadium nitride (VN) coatings were deposited using inductively coupled plasma (ICP) assisted sputtering at different ICP powers. Microstructural, crystallographic and mechanical characterizations were performed by FE-SEM, AFM, XRD and nanoindentation. The results show that ICP has significant effects on coating's microstructure, structural and mechanical properties of VN coatings. With an increase in ICP power, coating microstructure evolved from a porous columnar structure to a highly dense one. Single- phase cubic (FCC) VN coatings with different preferential orientations and residual stresses were obtained as a function of ICP power. Average crystal grain sizes of single phase cubic (FCC) VN coatings were decreased from 10.1 nm to 4.0 nm with an increase in ICP power. The maximum hardness of 28.2 GPa was obtained for the coatings deposited at ICP power of 200 W. The smoothest surface morphology with Ra roughness of 1.7 nm was obtained in the VN coating sputtered at ICP power of 200 W.

• 한국표면공학회지
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• 제55권2호
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• pp.77-83
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• 2022

Nanocrystalline MoN coatings were prepared by inductively coupled plasma magnetron sputtering (ICPMS) changing the plasma power from 0 W to 200 W. The properties of the coatings were analyzed by x-ray diffraction, field emission scanning electron microscopy, atomic force microscopy, nanoindentation tester and semiconductor characterization system. As the ICP power increases, the crystal structure of the MoN coatings changed from a mixed phase of γ-Mo₂N and α-Mo to a single phase γ-Mo₂N. MoN coatings deposited by ICPMS at 200 W showed the most compact microstructure with the highest nanoindentation hardness of 27.1 GPa. The electrical resistivity of the coatings decreased from 691.6 μΩ cm to 325.9 μΩ cm as the ICP power increased.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.234.1-234.1
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• 2014

Many studies have been investigated on high density plasma source (Electron Cyclotron Resonance[ECR], Inductively Coupled Plasma[ICP], Helicon plasma) for large area source after It is announced that productivity of plasma process depends on plasma density. Among them, Some researchers have been studied on multiple sources In this study, we attempted to determine the possibility of multiple inductively coupled plasma (ICP), and helicon plasma sources for large-area processes. Experiments were performed with the one and two coils to measure plasma and electrical parameters, and a circuit simulation was performed to measure the current at each coil in the 2-coil experiment. Based on the result, we could determine the possibility of multiple ICP sources due to a direct change of impedance due to current and saturation of impedance due to the skin-depth effect. However, a helicon plasma source is difficult to adapt to the multiple sources due to the consistent change of real impedance due to mode transition and the low uniformity of the B-field confinement. As a result, it is expected that ICP can be adapted to multiple source for large-area processes.

• 한국전기전자재료학회논문지
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• 제19권6호
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• pp.538-546
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• 2006

We report on characteristics of specially designed inductively-coupled-plasma chemical vapor deposition (ICP-CVD) system for top-emitting organic light emitting diodes (TOLEDs). Using high-density plasma on the order of $10^{11}$ electrons/$cm^3$ generated by linear-type antennas connected in parallel and specially designed substrate cooling system, a 100 nm-thick transparent $SiN_{x}$ passivation layer was deposited on thin Mg-Ag cathode layer at substrate temperature below $50\;^{\circ}C$ without a noticeable plasma damage. In addition, substrate-mask chucking system equipped with a mechanical mask aligner enabled us to pattern the $SiN_x$ passivation layer without conventional lithography processes. Even at low substrate temperature, a $SiN_x$ passivation layer prepared by ICP-CVD shows a good moisture resistance and transparency of $5{\times}10^{-3}g/m^2/day$ and 92 %, respectively. This indicates that the ICP-CVD system is a promising methode to substitute conventional plasma enhanced CVD (PECVD) in thin film passivation process.

• 대한화학회지
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• 제29권4호
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• pp.382-389
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• 1985

Inductively coupled plasma(ICP)법을 이용하여 희토류원소들을 정량분석할 때 플라스마 작동 조건이 미치는 영향에 관하여 연구하였다. 플라스마 작동시 시료운반기체의 사용량을 증가시키면 희토류원소 스펙트럼선들의 검출한계는 낮아지나 이온화 방해 영향이 증가되었다. RF power의 변화는 이온화 방해에는 큰 영향을 미치지 않지만 바탕세기에 대한 스펙트럼선 세기의 비율은 RF power가 감소될수록 증가되었다. 플라스마내에서 이온화 방해 영향이 작은 위치는 스펙트럼선의 spacial profile이 최대가 되는 부분보다 약간 높은 위치이었다. 희토류원소의 분석시 많이 이용되는 스펙트럼선들의 검출한계를 측정하고 비교적 간섭영향이 작은 스펙트럼선을 선정하였다.

• 한국결정성장학회지
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• 제26권4호
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• pp.145-149
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• 2016

플라즈마 조성, ICP source power, rf chuck power 등의 공정변수가 GaN epitaxy층의 식각특성에 미치는 영향을 조사하였다. $GaF_x$ 화합물 보다 더 높은 휘발성을 가지는 $GaCl_x$ 식각 생성물 형성이 가능한 $Cl_2/Ar$ 플라즈마가 $SF_6/Ar$ 플라즈마보다 더 높은 식각속도를 나타내었다. 또한, $Cl_2/Ar$ 플라즈마에서 Ar 비중이 증가함에 따라 물리적 식각 기구 활성화로 인해 식각 이방성이 향상됨을 확인하였다. 두 가지 플라즈마 조성 모두에서 ICP source power와 rf chuck power가 증가함에 따라 식각속도가 지속적으로 증가함을 확인하였고, $13Cl_2/2Ar$, 750W ICP power, 400 W rf chuck power, 10 mTorr 조건에서 최고 251.9 nm/min의 식각속도를 확보하였다.

• Transactions on Electrical and Electronic Materials
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• 제10권2호
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• pp.35-39
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• 2009

A novel Helmholtz coil inductively coupled plasma(H-ICP) etcher is proposed and characterized for deep nano-scale CMOS technology. Various hardware tests are performed while varying key parameters such as distance between the top and bottom coils, the distance between the chamber ceiling and the wafer, and the chamber height in order to determine the optimal design of the chamber and optimal process conditions. The uniformity was significantly improved by applying the optimum conditions. The plasma density obtained with the H-ICP source was about $5{\times}10^{11}/cm^3$, and the electron temperature was about 2-3 eV. The etching selectivity for the poly-silicon gate versus the ultra-thin gate oxide was 482:1 at 10 sccm of $HeO_2$. The proposed H-ICP was successfully applied to form multiple 60-nm poly-silicon gate layers.

• 조명전기설비학회논문지
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• 제13권4호
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• pp.82-86
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• 1999

본 연구에서는 푸로브법과 교류중첩법을 이용하여 고주파 유도결합 플라즈마에서 전자에너지 분포함수를 측정하였다. 실험조건은 압력 10∼40[mTorr], 입력파워는 100∼600[W]이고, 가스유량은 3∼12[sccm]이며, 전자에너지 분포함수의 공간분포 측정에 있어서 아스펙트비(R/L)는 2로 하였다. 전자에너지 분포함수는 압력 및 입력파워에 대하여 강한 의존성을 나타내었고, 가스유량이 증가할수록 증가 하였다. 전자에너지 분포함수의 반경방향 분포는 플라즈마 중심에서 최대가 되었다. 전자에너지 분포함수의 축방향 분포는 석영창과 기판 사이의 중심에서 최대가 되었다. 이러한 결과는 고주파 유도결합 플라즈마의 생성 메커니즘 이해와 간단한 ICP(Inductively Coupled Plasma) 모델링 응용에 기여할 수 있을 것이다.

• 한국결정성장학회지
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• 제21권4호
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• pp.153-157
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• 2011

Inductively Coupled Plasma(ICP)를 이용하여 다양한 조건으로 표면 처리한 Si(100) 기관 위에 Low Pressure Chemical Vapor Deposition(LPCVD)를 이용하여 Ge 층을 이종접합 성장하고, Ge 층 성장 초기의 표면 상태를 Scanning Electron Microscopy(SEM)을 통해 분석하였다. ICP를 이용하여 표면 처리된 Si(100) 기판 위에 성장된 Ge 층의 경우 ICP 처리하지 않은 시편보다 Ge 성장율이 약 5배 이상 증가되었다. ICP 처리된 시편의 Ge 성장률 증가는 ICP 표면 처리 공정으로 Si 기관 표면에서 떨어져 나간 missing dimer가 Ge adatom들에 핵을 형성할 자리를 제공하여 Ge island의 형성과 융합을 촉진시키는 것으로 사료된다.

• 전기학회논문지
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• 제58권6호
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• pp.1110-1115
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• 2009

We studied on the design of electrical parameters for ICP(Inductively Coupled Plasma) light sources which can be effective to improve the electrical power efficiency of it. These parameters were derivated from Barkhausen theory about the oscillating condition of a ballaster. The relationships of $f-I_p$ and f-n were calculated theoretically and then these relationships were compared with the measured results about $I_p$ and power depending to a discharge length(l) of ICP light source. Finally, we can see that a specific range of induced current depending to a discharge length would be necessary to minimize the change of magnetization inductance and driving frequency at driving.