• Korean Journal of Optics and Photonics
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• v.29 no.1
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• pp.19-27
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• 2018

A change in object distance would generally change the magnification of an optical system. In this paper, we have proposed and designed a double-Gauss optical system with a fixed magnification and image surface regardless of any change in object distance, according to moving the lens groups a little bit to the front and rear of the stop, independently parallel to the direction of the optical axis. By maintaining a constant size of image formation in spite of various object-distance changes in a projection system such as a head-up display (HUD) or head-mounted display (HMD), we can prevent the field of view from changing while focusing in an HUD or HMD. Also, to check precisely the state of the wiring that connects semiconductor chips and IC circuit boards, we can keep the magnification of the optical system constant, even when the object distance changes due to vertical movement along the optical axis of a testing device. Additionally, if we use this double-Gauss optical system as a vision system in the testing process of lots of electronic boards in a manufacturing system, since we can systematically eliminate additional image processing for visual enhancement of image quality, we can dramatically reduce the testing time for a fast test process. Also, the Gaussian bracket method was used to find the moving distance of each group, to achieve the desired specifications and fix magnification and image surface simultaneously. After the initial design, the optimization of the optical system was performed using the Synopsys optical design software.

• Convergence Security Journal
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• v.12 no.1
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• pp.63-70
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• 2012

Recently, as the smart phone market grows explosively, there exists a large difference of utilization of the smart phone between an usual people and the visually impaired people. In this paper, We propose the character and numer ic input system based on the low cost of braille film and braille for the visually impaired people in order to reduce to information literacy gap for the visually impaired people. The proposed system is designed with the braille film and keyboard layout based on the braille character layout. Additionally, the telephone, the SMS, the abbreviated dial and location transfer function for the emergency situation are designed. The character which inputs using the braille keyboard can be automatically copied in the clip board and used in the other applications. Hence, the visually impaired people can easily use the smart phone for getting plentiful information on the device and network.

• JSTS:Journal of Semiconductor Technology and Science
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• v.1 no.4
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• pp.216-231
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• 2001

Several methods for improving device yields and characteristics have been studied by IC manufacturers, as the options for programming components become diversified through the introduction of novel processes. Especially, the sequential repair steps on wafer level and package level are essentially required in DRAMs to improve the yield. Several repair methods for DRAMs are reviewed in this paper. They include the optical methods (laser-fuse, laser-antifuse) and the electrical methods (electrical-fuse, ONO-antifuse). Theses methods can also be categorized into the wafer-level(on wafer) and the package-level(post-package) repair methods. Although the wafer-level laser-fuse repair method is the most widely used up to now, the package-level antifuse repair method is becoming an essential auxiliary technique for its advantage in terms of cost and design efficiency. The advantages of the package-level antifuse method are discussed in this paper with the measured data of manufactured devices. With devices based on several processes, it was verified that the antifuse repair method can improve the net yield by more than 2%~3%. Finally, as an illustration of the usefulness of the package-level antifuse repair method, the repair method was applied to the replica delay circuit of DLL to get the decrease of clock skew from 55ps to 9ps.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.9
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• pp.68-73
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• 2009

This paper presents an easily modifiable structure of a serial peripheral interface (SPI) that is suitable for efficient testing of CMOS RF integrated circuits. The proposed SPI Is designed so that the address size and the accompanying software can be easily adjusted and modified according to the requirements and complexity of RF IC's under development. The hardware architecture and software algorithm to achieve the flexibility are described. The proposed SPI is fabricated in $0.13{\mu}m$ CMOS and successfully verified experimentally with a 2.7GHz fractional-N delta-sigma frequency synthesizer as a device under test.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.1-9
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• 2010

Three-dimensional (3-D) integration is an emerging technology, which vertically stacks and interconnects multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip to form highly integrated micro-nano systems. Since CMOS device scaling has stalled, 3D integration technology allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. The potential benefits of 3D integration can vary depending on approach; increased multifunctionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, increased yield and reliability, flexible heterogeneous integration, and reduced overall costs. It is expected that the semiconductor industry's paradiam will be shift to a new industry-fusing technology era that will offer tremendous global opportunities for expanded use of 3D based technologies in highly integrated systems. Anticipated applications start with memory, handheld devices, and high-performance computers and extend to high-density multifunctional heterogeneous integration of IT-NT-BT systems. This paper attempts to introduce new 3D integration technologies of the chip self-assembling stacking and 3D heterogeneous opto-electronics integration for realizng the super-chip.

• 제어로봇시스템학회:학술대회논문집
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• 1993.10b
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• pp.218-223
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• 1993

In this paper, we present a full digital control scheme which controls currents and speed of the permanent magnet AC servo motor with large range of bandwidth and high performance. The current equations of the permanent magnet AC servo motor are linearized by feedback linearization technique. Both acceleration feedforward terms and IP controllers, whose gains are functions of motor speed, are used in order to control motor currents. In addition the phase delays in current control loops are compensated by placing phase lead-lag compensators after current commands, which make it possible to avoid high gains in the current controllers. Unity power factor can be achieved by the proposed current controller. Pulsewidth modulation is performed by way of the well-known comparison with a triangular carrier signals. The velocity controller is designed on the basis of the linearized model of the permanent magnet AC servo motor by the proposed current controller. The performance of the entire control system is analyzed in the presence of uncertainty in the motor parameters. The proposed control scheme is implemented using the digital signal processor-based controller composed of an Analog Device ADSP 2111 and a NEC78310. The pulsewidth modulation (PWM) signals are generated through a custom IC, SAMSUNG-PWM1, which has the outputs of current controllers as input. The experimental results show that the permanent magnet AC servo motor can be always driven with high dynamic performance by the proposed full digital control scheme of motor speed and motor current.

• Korean Journal of Food Science and Technology
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• v.20 no.6
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• pp.845-849
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• 1988

A laboratory scale storage facility consisting of a cold room, sample jars and a ventilation device was designed and built. Storaging sample jars (1.7 l) for fruit were fabricated with transparent acryl and provided with a constant air flow. For the supplying of air to sample jars, the air distributing system was built with solenoid valves, an air precooling coil and a pressure equalizing tank. To provide the programmable storaging environment of the facility a microprocessor-based controller was designed and installed. The controller was built with the 8 bit microprocessor (Z-80), EPROM, RAM, programmable peripheral interface(8255 PPI), and A/D converter. Softwares for the auto-temperature measurement and control of the storage system were developed and systemized in ROM. The automated storage system was applied to citrus storage, and the temperature of the storage facilities was successfully acquisited to the computer and controlled.

• Transactions on Electrical and Electronic Materials
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• v.17 no.5
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• pp.280-288
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• 2016

Microelectronic product consumers may already be expecting another paradigm shift with smarter phones over smart phones, but the current status of microelectronic manufacturing engineering education (MMEE) in universities hardly makes up the pace for such a fast moving technology paradigm shift. The purpose of MMEE is to educate four-year university graduates to work in the microelectronics industry with up-to-date knowledge and self-motivation. In this paper, we present a comprehensive curriculum for a four-year university degree program in the area of microelectronics manufacturing. Three hands-on experienced-based courses are proposed, along with a methodology for undergraduate students to acquire hands-on experience, towards integrated circuits (ICs) design, fabrication and packaging, are presented in consideration of manufacturing engineering education. Semiconductor device and circuit design course for junior level is designed to cover how designed circuits progress to micro-fabrication by practicing full customization of the layout of digital circuits. Hands-on experienced-based semiconductor fabrication courses are composed to enhance students’ motivation to participate in self-motivated semiconductor fab activities by performing a series of collaborations. Finally, the Microelectronics Packaging course provides greater possibilities of mastered skillsets in the area of microelectronics manufacturing with the fabrication of printed circuit boards (PCBs) and board level assembly for microprocessor applications. The evaluation of the presented comprehensive curriculum was performed with a students’ survey. All the students responded with “Strongly Agree” or “Agree” for the manufacturing related courses. Through the development and application of the presented curriculum for the past six years, we are convinced that students’ confidence in obtaining their desired jobs or choosing higher degrees in the area of microelectronics manufacturing was increased. We confirmed that the hypothesis on the inclusion of handson experience-based courses for MMEE is beneficial to enhancing the motivation for learning.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.768-771
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• 2003

The impulse between launch vehicle and atmosphere can generate a lot of noise and vibration during the process of launching a satellite. Structurally, electronic equipment (KOMPSAT 2, RDU : Remote Drive Unit) of a satellite consists of aluminum case containing PCB (Printed circuit boards). Each PCB has resistors and IC (Integrated circuits). Noise and vibration of wide frequency band are transferred to the inside of fairing, subsequently creating vibration of the electronic equipment of the satellite. In this situation. random vibration can cause malfunctioning of the electronic equipment of the device. Furthermore, when tile frequency of random vibration meets with natural frequency of PCB. fatigue fracture nay occur in the part of solder joint. The launching environment, thus. needs to be carefully considered when designing the electronic equipment of a satellite. In general. the safety of the electronic equipment is supposed to be related to the natural frequency, shapes of mode and dynamic deflection of PCB in the electronic equipment. Structural vibration analysis of PCB and its electronic components can be performed using either FEM(Finite Element Method) or vibration test. In this study. the natural frequency and dynamic deflection of PCB are measured by FEM, aud the safety of the electronic components of PCB is being evaluated according to the results. This study presents a unique method for finite element modeling and analysis of PCB and its electronic components. The results of FEA are verified by vibration test. The method proposed herein may be applicable to various designs from the electronic equipments of a satellite to home electronics.

• Journal of IKEEE
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• v.19 no.3
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• pp.440-446
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• 2015

This study has examined susceptibility of LNA(Low Noise Amplifier) due to Front-Door Coupling under Narrow-Band high power electromagnetic wave. M/DFR(Malfunction/Destruction Failure Rate) was measured to investigate the diagnostic of IC test. In addition, decapsulation analysis was used to understand the inside of the chip state in LNA devices. The experiments is employed as an open-ended waveguide to study the destruction effects of LNA using a 2.45 GHz Magnetron as a high power electromagnetic wave. The susceptibility level of LNA was assessed by electric field strength, and its failure modes were observed. The malfunction of LNA device has showed as the type of self-reset and power-reset. The electric field strength of malfunction threshold is 524 V/m and 1150 V/m respectively. Also, he electric field of destruction threshold is 1530 V/m. Three types of damaged LNA were observed by decapsulation analysis: component, onchipwire, and bondwire destruction. Based on these results, the susceptibility of the LNA can be applied to a database to help elucidate the effects of microwaves on electronic equipment.