• Electronics and Telecommunications Trends
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• v.35 no.4
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• pp.1-10
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• 2020

Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.

• Composites Research
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• v.30 no.6
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• pp.416-421
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• 2017

The structural adhesive have been manufactured for improvement of bonding process between CFRP and metal. The optimal condition for bonding process were investigated by evaluating the lap shear strength with amount of adhesive and curing time and the surface treatment of the CFRP. To confirm proper adhesion conditions, the fracture sections between CFRP and metal was observed using reflection microscope. Not only the improvement of the adhesion condition was important, but surface treatment on CFRP was also important. The optimal curing temperature was at $180^{\circ}C$ for 20 minutes. The improvement for adhesive property was confirmed After surface treatment on CFRP. The optimal amount of structural adhesive for bonding between CFRP and metal was $1.5{\times}10^{-3}g/mm^2$. Through the optimization of bonding process, the improvement of mechanical property over 10% is confirmed in comparison with existing adhesive.

• Journal of the Korean Wood Science and Technology
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• v.35 no.5
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• pp.58-66
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• 2007

The objective of this research was to develop environment-friendly adhesives for face fancy veneer bonding of engineered flooring. Urea-formaldehyde (UF)-tannin and melamine-formaldehyde (MF)/PVAc hybrid resin were used to replace UF resin in the formaldehyde-based resin system in order to reduce formaldehyde and volatile organic compound (VOC) emissions from the adhesives used between plywoods and fancy veneers. Wattle tannin powder (5 wt%) was added to UF resin and PVAc (30 wt%) to MF resin. These adhesive systems showed better bonding than commercial UF resin with a similar level of wood penetration. The initial adhesion strength was sufficient to be maintained within the optimum initial tack range. The standard formaldehyde emission test (desiccator method) and VOC analyzer were used to determine the formaldehyde and VOC emissions from engineered flooring bonded with commercial UF resin, UF-tannin and MF/PVAc hybrid resin. By desiccator method, the formaldehyde emission level of UF resin showed the highest but was reduced by replacing with UF-tannin and MF/PVAc hybrid resin. MF/PVAc hybrid satisfied the $E_1$ grade (below $1.5mg/{\ell}$). VOC emission results by VOC analyzer were similar with the formaldehyde emission results. TVOC emission was in the following order: UF > UF-tannin > MF/PVAc hybrid resin.

• ETRI Journal
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• v.36 no.3
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• pp.343-351
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• 2014

For the fine-pitch application of flip-chip bonding with semiconductor packaging, fluxing and hybrid underfills were developed. A micro-encapsulated catalyst was adopted to control the chemical reaction at room and processing temperatures. From the experiments with a differential scanning calorimetry and viscometer, the chemical reaction and viscosity changes were quantitatively characterized, and the optimum type and amount of micro-encapsulated catalyst were determined to obtain the best pot life from a commercial viewpoint. It is expected that fluxing and hybrid underfills will be applied to fine-pitch flip-chip bonding processes and be highly reliable.

• Structural Engineering and Mechanics
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• v.65 no.5
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• pp.535-546
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• 2018

The objective of this study is to understand the behaviour of hollow core slabs strengthened with FRP and hybrid techniques through numerical and analytical studies. Different strengthening techniques considered in this study are (i) External Bonding (EB) of Carbon Fiber Reinforced Polymer (CFRP) laminates, (ii) Near Surface Mounting (NSM) of CFRP laminates, (iii) Bonded Overlay (BO) using concrete layer, and (iv) hybrid strengthening which is a combination of bonded overlay and NSM or EB. In the numerical studies, three-dimensional Finite Element (FE) models of hollow core slabs were developed considering material and geometrical nonlinearities, and a phased nonlinear analysis was carried out. The analytical calculations were carried out using Response-2000 program which is based on Modified Compression Field Theory (MCFT). Both the numerical and analytical models predicted the behaviour in agreement with experimental results. Parametric studies indicated that increase in the bonded overlay thickness increases the peak load capacity without reducing the displacement ductility. The increase in FRP strengthening ratio increased the capacity but reduced the displacement ductility. The hybrid strengthening technique was found to increase the capacity of the hollow core slabs by more than 100% without compromise in ductility when compared to their individual strengthening schemes.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.261-262
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• 2009

• Proceedings of the KSME Conference
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• 2000.11a
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• pp.292-297
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• 2000

In this research, the dynamic photoelastic experimental hybrid method for bimaterial is introduced. Dynamic biaxial loading device is developed, its strain rate is 31.637 s-1 and its maximum impact load is 20 ton. Manufactured methods for model of the dynamic photoelastic experiment for bimaterial are suggested. They are bonding method(bonding material: AW106, PC-1) and molding method. In the bonding method, residual stress is not occurred in the manufactured bimaterial. Crack is propagated along the interface or sometimes deviated from the interface. While in the molding method, residual stress is occurred in the manufactured bimaterial. Crack is always deviated from the interface and propagated in the epoxy region(softer materila). In order to propagate with constant velocity along the interface of bimaterial with arbitrary stiffer material, edge crack should be located along the interface of the acute angle side of the softer material in the bimaterial.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.4
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• pp.1-8
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• 2022

High-density packaging technologies, including Through-Si-Via (TSV) technologies, are considered important in many fields such as IoT (internet of things), 6G/5G (generation) communication, and high-performance computing (HPC). Achieving high integration in two dimensional packaging has confronted with physical limitations, and hence various studies have been performed for the three-dimensional (3D) packaging technologies. In this review, we described about the causes and effects of scallop formation in TSV, the scallop-free etching technique for creating smooth sidewalls, Cu pillar and Cu-SiO₂ hybrid bonding in TSV. These technologies are expected to have effects on the formation of high-quality TSVs and the development of 3D packaging technologies.

• Journal of Welding and Joining
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• v.24 no.3
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• pp.55-59
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• 2006

This paper is concerned with a study on cyclic bending load of bus folding door pillar including adhesive bonding and spot welding. Three specimen types were used such as spot welding, I-type adhesive bonding and M-type adhesive bonding in this study. The tensile-shear tests were carried out to evaluate the tensile-shear strength of these three specimen types. Also four-point bending tests were carried out to evaluate the static and dynamic bending load. From the results, using adhesive bonding has a better effect on the static and dynamic bending load than using spot welding. Therefore, manufacturing better structural products can be expected by applying hybrid welding using adhesive and spot welding to those.

• Restorative Dentistry and Endodontics
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• v.25 no.2
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• pp.243-253
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• 2000

The purpose of this in vitro study was to evaluate dentin bonding by two different dentin bonding systems(DBS) using acetone based primer or adhesive [All Bond 2(AB2), One Step(OS)] when they were applied by wet or dry bonding technique. Morphology of resin-dentin interface and hybrid layer thickness(HLT) were investigated using Confocal Laser Scanning Microscope(CLSM) and compared to shear bond strength(SBS). 72 extracted sound human molars were randomly divided into 4 groups of 18 teeth each - Group 1.(AW); AB2 by wet bonding. Group 2(AD); AB2 by dry bonding. Group 3.(OW); OS by wet bonding, Group 4.(OD); OS by dry bonding. In 6 teeth of each group, notch-shaped class V cavities(depth 2mm) were prepared on buccal and lingual surface at the cementoenamel juction(12 cavities per group). To obtain color contrast in CLSM observation, bonding resins of each DBS were mixed with rhodamine B and primer of AB2 was mixed with sodium fluorescein. Prepared teeth of each group were treated with AB2, OS, respectively according to the manufacturer's instructions except for dentin surface moisture treatment after acid etching. In group 1 and 3, after acid etching, excess water was removed with wet tissue(Kimwipes), leaving consistently shiny, visibly hydrated dentin surface. In group 2 and 4, dentin surface was dried for 10 seconds at 1 inch distance. The treated teeth were then packed with composite resin(${\AE}$litefil) and light-cured. 12 microscopic samples($60{\sim}80{\mu}m$ thickness) of each group were obtained after longitudinal section and grinding(Exakt cutting and grinding system). Morphological investigation of resin-dentin interface and HLT measurement using CLSM were done. For measurement of SBS, remaining 12 teeth of each group were flattened occlusally to remove all enamel and grinded to 500 grit SiC(Pedemet Specimen Preparation Equipment). After applying DBS on the exposed dentin surface, composite resin was applied in the shape of cylinder, which has 5mm diameter, 1.5mm thickness, and light cured. SBS was measured using Instron with a crosshead speed of 0.5mm/min. It was concluded as follows, 1. HLT of AW(mean: $2.59{\mu}m$) was thicker than any other group, and followed by AD, OW, OD in descending order(mean; 2.37, 2.28, $1.92{\mu}m$). Only OD had statistically significant differences(p<0.05) to AW and AD. 2. There were intimate contact of resin and dentin at the interface in wet bonding groups, but gaps or irregular interfaces were observed in dry bonding groups. 3. The length, diameter, density of resin tags were various even in the same group without significant differences between groups and lots of adhesive lateral branches were observed. 4. There were no statistically significant difference of SBS between AB2 and OS, but SBS of wet bonding groups were significantly higher(p<0.05) than dry bonding groups. 5. There were no consistent relationships between HLT and SBS.