• 제목/요약/키워드: Hole quality

검색결과 398건 처리시간 0.026초

Low-temperature Epitaxial Growth of a Uniform Polycrystalline Si Film with Large Grains on SiO2 Substrate by Al-assisted Crystal Growth

  • Ahn, Kyung Min;Kang, Seung Mo;Moon, Seon Hong;Kwon, HyukSang;Ahn, Byung Tae
    • Current Photovoltaic Research
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    • 제1권2호
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    • pp.103-108
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    • 2013
  • Epitaxial growth of a high-quality thin Si film is essential for the application to low-cost thin-film Si solar cells. A polycrystalline Si film was grown on a $SiO_2$ substrate at $450^{\circ}C$ by a Al-assisted crystal growth process. For the purpose, a thin Al layer was deposited on the $SiO_2$ substrate for Al-assisted crystal growth. However, the epitaxial growth of Si film resulted in a rough surface with humps. Then, we introduced a thin amorphous Si seed layer on the Al film to minimize the initial roughness of Si film. With the help of the Si seed layer, the surface of the epitaxial Si film was smooth and the crystallinity of the Si film was much improved. The grain size of the $1.5-{\mu}m$-thick Si film was as large as 1 mm. The Al content in the Si film was 3.7% and the hole concentration was estimated to be $3{\times}10^{17}/cm^3$, which was one order of magnitude higher than desirable value for Si base layer. The results suggest that Al-doped Si layer could be use as a seed layer for additional epitaxial growth of intrinsic or boron-doped Si layer because the Al-doped Si layer has large grains.

미세 방전 가공에서의 방전 펄스 카운팅을 이용한 간극 제어 (Gap Control Using Discharge Pulse Counting in Micro-EDM)

  • 정재원;고석훈;정영훈;민병권;이상조
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2006년도 춘계학술대회 논문집
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    • pp.499-500
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    • 2006
  • The electrode wear in micro-EDM significantly deteriorates the machining accuracy. In this regard, electrode wear needs to be compensated in-process to improve the product quality. Therefore, there are substantial amount of research about electrode wear. In this study a control method for micro-EDM using discharge pulse counting is proposed. The method is based on the assumption that the removed workpiece volume is proportional to the number of discharge pulses, which is verified from experimental results analyzing geometrically machined volume according to various number of discharges. Especially, the method has an advantage that electrode wear does not need to be concerned. The proposed method is implemented to an actual micro-EDM system using high speed data acquisition board, simple counting algorithm with 3 axis motion system. As a result, it is demonstrated that the volume of hole machined by EDM drilling can be accurately estimated using the number of discharge pulses. In EDM milling process a micro groove without depth variation caused by electrode wear could be machined using the developed control method. Consequently, it is shown that machining accuracy in drilling and milling processes can be improved by using process control based on the number of discharge pulses.

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하이브리드 방식 (CNC+Laser)을 이용한 폴리머용접공정 (Hybrid (CNC+Laser) process for polymer welding)

  • 유종기;이춘우;김순동;최해운;신현명
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2009년 추계학술발표대회
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    • pp.4-4
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    • 2009
  • Polycarbonate (PC) and Acrylonitrile Butadiene Styrene (ABS) was welded through a combination of a diode laser and CNC. Laser beam passed the transparent PC and was absorbed in an opaque ABS. Polymers were melted and welded by absorbed and conducted heat. Experiments were carried out by varying working distance from 44mm to 50mm for the focus spot diameter control, laser input power from 10W to 25W, and scanning speed from 100 to 400mm/min. The weld bead size and the specimen cross-section were analyzed, and tensile results were presented through the joint force measurement. With focus distance at 48mm, laser power with 20W, and welding speed at 300mm/min, experimental results showed the best welding quality which bead size was 3.75mm and the shear strength was $22.8N/mm^2$. Considering tensile strength of ABS is $43N/mm^2$, shear strength was sufficient to hold two materials. A single process was possible in CNC machining processes, surface processing, hole machining and welding. As a result, the process cycle time was reduced to 25%. Compared to a typical process, specimens were fabricated in a single process, with high precision. By combining two operations processes developed process gained 50% more efficiency.

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상수도관로 누수신호의 특성 분석을 위한 누수 실험시설 개발 (Development of leakage test facility for leak signal characteristic analysis in water pipeline)

  • 박상혁;곽필재;이현동;최창호
    • 상하수도학회지
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    • 제31권5호
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    • pp.459-469
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    • 2017
  • A real scale leakage test facility was developed to study the leak signal characteristics of water supply pipelines, and then leak tests were carried out. The facility was designed to overcome the limited experimental circumstances of domestic water supply pipeline experimental facilities. The length of the pipeline, which was installed as a straight line, is 280m. Six pipes were installed on a 70m interval with different pipe material and diameters that are DCIP(D200, D150, D100, D80), PE(D75) and PVC(D75).The intensity of the leakage is adjusted by changing the size of the leak hole and the opening rate of ball valve. Various pressure conditions were simulated using a pressure reducing valve.To minimize external noise sources which, deteriorate the quality of measured leak signal, the facility was built at a quiet area, where traffic and water consumption by customers is relatively rare. In addition, the usage of electric equipment was minimized to block out noise and the facility was operated using manual mode. From the experimental results of measured leakage signal at the facility, it was found that the signal intensity weakened and the signal of high frequency band attenuated as the distance from the water leakage point increased.

RF-MEMS 소자의 웨이퍼 레벨 밀봉 패키징을 위한 열압축 본딩 (Thermocompression bonding for wafer level hermetic packaging of RF-MEMS devices)

  • 박길수;서상원;최우범;김진상;남산;이종흔;주병권
    • 센서학회지
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    • 제15권1호
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    • pp.58-64
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    • 2006
  • In this study, we describe a low-temperature wafer-level thermocompression bonding using electroplated gold seal line and bonding pads by electroplating method for RF-MEMS devices. Silicon wafers, electroplated with gold (Au), were completely bonded at $320^{\circ}C$ for 30 min at a pressure of 2.5 MPa. The through-hole interconnection between the packaged devices and external terminal did not need metal filling process and was made by gold films deposited on the sidewall of the throughhole. This process was low-cost and short in duration. Helium leak rate, which is measured to evaluate the reliability of bonded wafers, was $2.7{\pm}0.614{\times}10^{-10}Pam^{3}/s$. The insertion loss of the CPW packaged was $-0.069{\sim}-0.085\;dB$. The difference of the insertion loss between the unpackaged and packaged CPW was less than -0.03. These values show very good RF characteristics of the packaging. Therefore, gold thermocompression bonding can be applied to high quality hermetic wafer level packaging of RF-MEMS devices.

터널발파 작업시 여굴 저감을 위한 천공방법 연구 (A Study on the Drilling Methods to reduce Overbreak in Tunnel Blasting)

  • 김양균;김형철;유정훈
    • 화약ㆍ발파
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    • 제21권2호
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    • pp.1-13
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    • 2003
  • 여굴 또는 미굴은 터널발파 결과를 평가하는데 있어서 가장 중요한 지표중 하나이다. 폭약량과 종류, 암질상태, 천공상태에 따라 좌우되는 여굴은 터널시공의 경제성과 직결되므로 현장의 많은 발파기술자들은 이를 최소화하기 위한 노력을 끊임없이 시도하여 왔다. 일반적으로 천공은 여굴을 야기하는 가장 중요한 요소로 알려져 있다. 따라서 본 연구에서는 천공과 관련된 다양한 작업방법들이 여굴과 천공의 정확도에 미치는 영향을 분석하여 여굴을 저감하기 위한 실제 작업모델을 제시하고자 하였다. 이를 위해 1차적으로 굴착선공 적정 공간격, 점보드릴의 천공각 변화, 굴착선공 천공착점 위치, 굴착선공 표시 등 4개 항목 45회의 실험을 실시하였다. 여굴을 줄이기 위해서는 작업자 및 감독자들의 의지와 노력이 무엇보다도 중요하였고 천공방법 및 패턴을 일부 개선하므로써 천공으로 인한 여굴량을 적지 않게 줄일수 있다고 판단되었다.

고출력 SP3T MMIC 스위치 (A High Power SP3T MMIC Switch)

  • 정명득;전계익;박동철
    • 한국전자파학회논문지
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    • 제11권5호
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    • pp.782-787
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    • 2000
  • 광대역 고출력 SP3T MMIC GaAs PIN 다이오드 스위치를 설계, 제작하고 특성을 측정하였다. 전력단속능력을 개선시키기 위하여 다이오드의 버퍼층을 저온 버퍼와 초격자 버퍼로 이루어진 2층 구조로 설계하였다. 개발된 다이오드의 항복전압은 65V이고 순방향 정압강하는 1.3V 이었다. MMIC 스위치는 마이크로스트립 라인형으로 구현되었고 인덕턴스가 낮은 via hole 공정을 이용하여 신호를 접지하였다. 평면형 구조보다 더 낮은 기생성분과 진성영역에서 고품질을 갖는 수직형 에피텍셜 PIN 구조를 사용하여 우수한 마이크로파 성능을 얻었다. 제작된 SP3T 스위치의 고출력 특성은 14.5GHz CW에서 입력전력을 8dBm부터 32dBM 까지 증가시킬 때 삽입손실은 0.6dB보다 작은, 분리도는 50dB보다 크게 측정되었다.

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부복호화기 효율을 고려한 다시점 영상 합성 기법 (Multi-view Synthesis Algorithm for the Better Efficiency of Codec)

  • 최인규;정원식;이광순;유지상
    • 한국정보통신학회논문지
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    • 제20권2호
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    • pp.375-384
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    • 2016
  • 본 논문에서는 스테레오 영상과 스테레오 영상 바깥 시점의 위성 영상 그리고 상응하는 깊이 영상이 입력으로 주어질 때 이 입력 영상들을 압축에 적합한 포맷으로 변환하고 활용하여 중간시점 영상을 합성하는 새로운 기법을 제안한다. 송출 단에서 깊이 영상들은 하나의 global 영상으로, 위성영상은 시점 이동 시에 발생하는 프레임 밖의 영역 및 가려짐 영역과 같은 홀 영역에만 해당하는 residual 영상으로 변환 후에 데이터 량을 줄이기 위하여 다운샘플링하고 주시점의 스테레오 영상과 더불어 HEVC 코덱으로 부호화 한 후 전송한다. 수신 단에서 복호화된 각 입력 영상들을 이용하여 스테레오 영상 간 그리고 스테레오 영상과 위성 영상간의 중간시점 영상을 합성한다. 실험을 통하여 제안한 포맷을 이용하여 합성한 중간 시점 영상을 MVD(Multiview Video plus Depth) 포맷을 이용하여 합성한 중간 시점 영상과 비교했을 때 전송하는 데이터의 비트율(bit-rate) 대비 객관적 그리고 주관적 화질이 뛰어남을 확인하였다.

공동주택에서 각 실 문의 개폐에 따른 환기 특성 연구 (A Study on the Effect of Open and Closed Room Doors on Apartment Ventilation Characteristics)

  • 최임규;김영일;정광섭
    • 대한설비공학회:학술대회논문집
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    • 대한설비공학회 2008년도 동계학술발표대회 논문집
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    • pp.469-474
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    • 2008
  • The objective of this study is to propose basic design guidelines for more effective air ventilation system in apartments. It is well known that ventilation depends on whether the room doors are open or closed as well as people's living patterns. This study considers 84 ㎡-sized apartment which has extended living room without balcony. Ventilation of bathroom and kitchen is not considered. The height of the building, external air pressure and air infiltration through the windows are also neglected. The regulation on indoor air quality made it mandatory that the air change per hour be more than 0.7. Four models are suggested to study the effect of open and closed doors. Models 1 and 3 are open door types and models 2 and 4 are closed door types. The open types have 50 mm hole near the top of the door to substitute exhaust outlet. The ventilation effectiveness was evaluated by 3-dimensional numerical simulation using finite volume method by a commercial software. This work compares air flow, temperature of air, age of air and the efficiency of ventilation of apartments with wooden doors of bedroom 1 and 2, which are open or closed.

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PCB기판에 임베디드 된 페라이트 필름 인덕터 (Embedded Ferrite Film Inductor in PCB Substrate)

  • 배석;마노 야스히코
    • 한국자기학회지
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    • 제15권1호
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    • pp.30-36
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    • 2005
  • 최근 20년 동안 스핀 스프레이 방법으로 제조된 페라이트 필름이 갖는 여러 가지 우수한 점들이 보고되어 왔다. 기존의 벌크 페라이트 재료와 달리 고주파 특성이 우수하며, $100^{\circ}C$ 이하에서 저온 공정이 가능한 점이 그것이다. 따라서 상기의 방법을 이용하여 micro DC-DC 컨버터용 Ni-Zn 페라이트 인턱터를 제조하였으며, 기판재료는 폴리이미드를 사용하였고, 라미네이션과 비아홀 가공, 도금 공정을 이용하여 임베디드 형태를 완성하였다. 또한 Ni-Zn ferrite는 절연체이므로 다른 절연층을 형성하지 않았다. 제조된 Ni-Zn ferrite 는 약 0.61 T의 포화자화, 약 110의 실수 투자율을 보였고, 인덕터의 특성은 스파이럴 16턴 디자인의 경우 5 MHz에서 1.52 H에 Q-factor 24.3, 정격전류 863 mA였다.