• Smart Media Journal
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• v.3 no.4
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• pp.28-34
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• 2014

Recently the depth-image-based rendering (DIBR) method is usually used in 3D image application filed. Virtual view image is created by using a known view with associated depth map to make a virtual view point which did not taken by the camera. But, disocclusion area occur because the virtual view point is created using a depth image based image 3D warping. To remove those kind of disocclusion region, many hole filling methods are proposed until now. Constant color region searching, horizontal interpolation, horizontal extrapolation, and variational inpainting techniques are proposed as a hole filling methods. But when using those hole filling method some problem occurred. The different types of annoying artifacts are appear in texture region hole filling procedure. In this paper to solve those problem, the multi-directional extrapolation method is newly proposed for efficiency of expanded hole filling performance. The proposed method is efficient when performing hole filling which complex texture background region. Consideration of directionality for hole filling method use the hole neighbor texture pixel value when estimate the hole pixel value. We can check the proposed hole filling method can more efficiently fill the hole region which generated by virtual view synthesis result.

• Proceedings of the Korean Society of Computer Information Conference
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• 2012.07a
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• pp.79-82
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• 2012

3차원 멀티미디어 서비스에 대한 관심이 높아짐에 따라 관련 연구들이 현재 다양하게 논의되고 있다. Stereoscopy영상을 생성하기 위한 기존의 방법으로는 두 대의 촬영용 카메라를 일정한 간격으로 띄워놓고 피사체를 촬영한 후 해당 좌시점과 우시점을 생성하는 방법을 이용하였다. 하지만 이는 영상 대역폭의 부담을 가져오게 된다. 이를 해결하기 위하여 Depth정보와 한 장의 영상을 이용한 DIBR(Depth Image Based Rendering) Algorithm에 대한 연구가 많이 이루어지고 있다. 그중 Gaussian Depth Map을 이용한 Hole-Filling 방법은 DIBR에서 가장 자연스러운 결과를 보여주지만 다른 DIBR Algorithm들에 비해 속도가 현저히 느리다는 단점이 있다. 본 논문에서는 영상 생성의 고속화를 위해 GPU를 이용한 Gaussian Hole-Filling Algorithm의 병렬처리 구조를 제안하고 이를 이용한 DIBR Algorithm 생성과정을 제시한다.

• Structural Engineering and Mechanics
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• v.81 no.2
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• pp.243-258
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• 2022

In this paper, tensile behavior of joint filling has been investigated under experimental test and numerical simulation (particle flow code). Two concrete slabs containing semi cylinder hole were prepared. These slabs were attached to each other by glue and one cubic specimen with dimension of 19 cm×15 cm×6 cm was prepared. This sample placed in the universal testing machine where the direct tensile stress can be applied to this specimen by implementing a special type of load transferring device which converts the applied compressive load to that of the tensile during the test. In the present work, two different joint filling thickness i.e., 3 mm and 6 mm were prepared and tested in the laboratory to measure their direct tensile strengths. Concurrent with experimental test, numerical simulation was performed to investigate the effect of hole diameter, length of edge notch, filling thickness and filling length on the tensile behavior of joint filling. Model dimension was 19 cm×15 cm. hole diameter was change in four different values of 2.5 cm, 5 cm, 7.5 cm and 10 cm. glue lengths were different based on the hole diameter, i.e., 12.5 cm for hole diameter of 2.5 cm, 10 cm for hole diameter of 5 cm, 7.5 cm for hole diameter of 7.5 cm and 5 cm for hole diameter of 10 cm. length of edge notch were changed in three different value i.e., 10%, 30% and 50% of glue length. Filling thickness were changed in three different value of 3 mm, 6 mm and 9 mm. Tensile strengths of glue and concrete were 2.37 MPa and 6.4 MPa, respectively. The load was applied at a constant rate of 1 kg/s. Results shows that hole diameter, length of edge notch, filling thickness and filling length have important effect on the tensile behavior of joint filling. In fixed glue thinks and fixed joint length, the tensile strength was decreased by increasing the hole diameter. Comparing the results showed that the strength, failure mechanism and fracture patterns obtained numerically and experimentally were similar for both cases.

• ETRI Journal
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• v.38 no.5
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• pp.996-1007
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• 2016

This paper presents new hole-filling methods for generating multiview images by using depth image based rendering (DIBR). Holes appear in a depth image captured from 3D sensors and in the multiview images rendered by DIBR. The holes are often found around the background regions of the images because the background is prone to occlusions by the foreground objects. Background-oriented priority and gradient-oriented priority are also introduced to find the order of hole-filling after the DIBR process. In addition, to obtain a sample to fill the hole region, we propose the fusing of depth and color information to obtain a weighted sum of two patches for the depth (or rendered depth) images and a new distance measure to find the best-matched patch for the rendered color images. The conventional method produces jagged edges and a blurry phenomenon in the final results, whereas the proposed method can minimize them, which is quite important for high fidelity in stereo imaging. The experimental results show that, by reducing these errors, the proposed methods can significantly improve the hole-filling quality in the multiview images generated.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.4
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• pp.39-43
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• 2012

Via-filling plating and through-hole plating are absolutely imperative for manufacturing of printed-wiring board. This Paper is introducing the latest developments of our company worked on the high-performance of acid copper plating additives for them.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2019.05a
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• pp.160-161
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• 2019

As a method for modeling a three-dimensional object, there are a method using a 3D scanner, a method using a motion capture system, and a method using a Kinect system. Through this method, a portion that is not captured due to occlusion occurs in the process of creating a three-dimensional object. In order to implement a perfect three-dimensional object, it is necessary to arbitrarily fill the obscured part. There is a technique to fill the unexposed part by various image processing methods. In this study, we propose a method using GANs, which is the latest trend of unsupervised machine learning, as a method for more natural hole-filling.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.6 no.10
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• pp.2663-2678
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• 2012

Due to sharp depth transition, big holes may be found in the novel view that is synthesized by depth-image-based rendering (DIBR). A hole-filling method based on disparity map is proposed. One important aspect of the method is that the disparity map of destination image is used for hole-filling, instead of the depth image of reference image. Firstly, the big hole detection based on disparity map is conducted, and the start point and the end point of the hole are recorded. Then foreground pixels and background pixels are distinguished for hole-dilating according to disparity map, so that areas with matching errors can be determined and eliminated. In addition, parallaxes of pixels in the area with holes and matching errors are changed to new values. Finally, holes are filled with background pixels from reference image according to these new parallaxes. Experimental results show that the quality of the new view after hole-filling is quite well; and geometric distortions are avoided in destination image, in contrast to the virtual view generated by depth-smoothing methods and image inpainting methods. Moreover, this method is easy for hardware implementation.

• Journal of the Korea Society of Computer and Information
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• v.17 no.7
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• pp.53-65
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• 2012

Existing method of creating Stereoscopy image, creates viewpoint image from the left and right by shooting one object with 2 lens in certain distance. However, in case of 3-D TV using Stereoscopy camera, the necessity to transmit 2 viewpoint images from the left and right simultaneously, increases the amount of bandwidth. Various and more effective alternatives are under discussion. Among the alternatives, DIBR(Depth Image Based Rendering) creates viewpoint images from the left and right using one image and its Depth information, thus decreasing the amount of transmitted bandwidth. For this reason, there have been various studies on Algorithm to create DIBR Image in existing Static Scene. In this paper, I would like to suggest Gaussian Hole-filling solution, which utilizes reverse-depth image to fill the hole naturally, while minimizing distortion of background. In addition, we have analyzed the effectiveness of each Algorithm by comparing and calculating its functions.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.45-50
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• 2006

Copper via filling is the important factor in 3-D stacking interconnection of SiP (system in package). As the packaging density is getting higher, the size of via is getting smaller. When DC electroplating is applied, a defect-free hole cannot be obtained in a small size via hole. To prevent the defects in holes, pulse and pulse reverse current was applied in copper via filling. The holes, $20\and\;50{\mu}m$ in diameter and $100{\sim}190\;{\mu}m$ in height. The holes were prepared by DRIE method. Ta was sputtered for copper diffusion barrier followed by copper seed layer IMP sputtering. Via specimen were filled by DC, pulse and pulse-reverse current electroplating methods. The effects of additives and current types on copper deposits were investigated. Vertical and horizontal cross section of via were observed by SEM to find the defects in via. When pulse-reverse electroplating method was used, defect free via were successfully obtained.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.117-123
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• 2014

Cu through-vias, which can be used as thermal vias or vertical interconnects, were formed using bottom-up electrodeposition filling as well as top-down electrodeposition filling into open via-holes and their microstructures were observed. Solid Cu through-vias without voids could be successfully formed by bottom-up filling as well as top-down filling with direct-current electrodeposition. While chemical-mechanical polishing (CMP) to remove the overplated Cu layer was needed on both top and bottom surfaces of the specimen processed by top-down filling method, the bottomup process has an advantage that such CMP was necessary only on the top surface of the sample.