• 제목/요약/키워드: High strength copper alloy

검색결과 51건 처리시간 0.025초

자동차용 브레이크 마찰재에서 고망간강의 마찰 및 마모특성 (Friction and Wear Properties of High Manganese Steel in Brake Friction Material for Passenger Cars)

  • 정광기;이상우;권성욱;송명석
    • Tribology and Lubricants
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    • 제36권2호
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    • pp.88-95
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    • 2020
  • In this study, we investigate the mechanical properties of high manganese steel, and the friction and wear characteristics of brake friction material containing this steel, for passenger car application, with the aim of replacing copper and copper alloys whose usage is expected to be restricted in the future. These steels are prepared using a vacuum induction melting furnace to produce binary and ternary alloys. The hardness and tensile strength of the high manganese steel decrease and the elongation increases with increase in manganese content. This material exhibits high values of hardness, tensile strength, and elongation; these properties are similar to those of 7-3 brass used in conventional friction materials. We fabricate high manganese steel fibers to prepare test pad specimens, and evaluate the friction and wear characteristics by simulating various braking conditions using a 1/5 scale dynamometer. The brake pad material is found to have excellent friction stability in comparison with conventional friction materials that use 7-3 brass fibers; particularly, the friction stability at high temperature is significantly improved. Additionally, we evaluate the wear using a wear test method that simulates the braking conditions in Europe. It is found that the amount of wear of the brake pad is the same as that in the case of the conventional friction material, and that the amount of wear of the cast iron disc is reduced by approximately 10. The high manganese steel is expected to be useful in the development of eco-friendly, copper-free friction material.

Dynamic Precipitation and Substructure Stablility of Cu Alloy during High Temperature Deformation

  • Han, Chang-Suk;Choi, Dong-Nyeok;Jin, Sung-Yooun
    • 한국재료학회지
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    • 제29권6호
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    • pp.343-348
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    • 2019
  • Structural and mechanical effects of the dynamical precipitation in two copper-base alloys have been investigated over a wide range of deformation temperatures. Basing upon the information gained during the experiment, also some general conclusion may be formulated. A one concerns the nature of dynamic precipitation(DP). Under this term it is commonly understood decomposition of a supersaturated solid solution during plastic straining. The process may, however, proceed in two different ways. It may be a homogeneous one from the point of view of distribution and morphological aspect of particles or it may lead to substantial difference in shape, size and particles distribution. The effect is controlled by the mode of deformation. Hence it seems to be reasonable to distinguish DP during homogeneous deformation from that which takes place in heterogeneously deformed alloy. In the first case the process can be analyzed solely in terms of particle-dislocation-particle interrelation. Much more complex problem we are facing in heterogeneously deforming alloy. Deformation bands and specific arrangement of dislocations in form of pile-ups at grain boundaries generate additional driving force and additional nucleation sites for precipitation. Along with heterogeneous precipitation, there is a homogeneous precipitation in areas between bands of coarse slip which also deform but at much smaller rate. This form of decomposition is responsible for a specially high hardening rate during high temperature straining and for thermally stable product of the decomposition of alloy.

고강도 알루미늄 합금(Al-Cu-Mg)에서 새로운 Cu 석출물의 TEM 관찰 (A New TEM Observation of the Copper Precipitate in High Strength Al-Cu-Mg Alloy)

  • 김황수
    • Applied Microscopy
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    • 제36권2호
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    • pp.47-55
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    • 2006
  • 이 논문에서 Al-2.5Cu-1.5Mg wt.% 합금에서 미세한 Cu 석출물에 대한 투과전자현미경 관찰이 보고 되었다. 이 새로운 관찰은 시료에 오염된 산화물을 제거하기 위해 ion milling을 하고 곧바로 시료 관찰을 했을 때 우연히 이루어 졌다. 특히 이 Cu석출물은 $150^{\circ}C$에서 100시간 aging한 시료에서 분명하게 관찰되었다. 그리고 ion milling 전 시료표면에서 분명히 관측되는 산화물은 $Cu_2O$임이 확실히 밝혀졌다. 이러한 분석과정은 회절 환 패턴의 정밀 분석을 요구함으로 이에 대한 시뮬레이션에 필요한 이론적 공식도 만들었다. 마지막으로 이 합금에 대한 예기치 않은 ion milling효과와 그 중요성이 논의되었다.

LED 및 반도체 소자 리드프레임 패키징용 Cu/STS/Cu 클래드메탈의 기계적/열전도/전기적 특성연구 (Study on the Mechanical Properties and Thermal Conductive Properties of Cu/STS/Cu Clad Metal for LED/semiconductor Package Device Lead Frame)

  • 이창훈;김기출;김용성
    • Journal of Welding and Joining
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    • 제30권3호
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    • pp.32-37
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    • 2012
  • Lead frame which has a high thermal conductivity and high mechanical strength is one of core technology for ultra-thin electronics such as LED lead frames, memory devices of semiconductors, smart phone, PDA, tablet PC, notebook PC etc. In this paper, we fabricated a Cu/STS/Cu 3-layered clad metal for lead frame packaging materials and characterized the mechanical properties and thermal conductive properties of the clad metal lead frame material. The clad metal lead frame material has a comparable thermal conductivity to typical copper alloy lead frame materials and has a reinforced mechanical tensile strength by 1.6 times to typical pure copper lead frame materials. The thermal conductivity and mechanical tensile strength of the Cu/STS/Cu clad metal are 284.35 W/m K and $52.78kg/mm^2$, respectively.

Cu50-Fe50 합금의 제조 및 특성평가 (Fabrication and characterization of Cu50-Fe50 alloy)

  • 이정일;딜리람;팽종민;조현수;양수민;류정호
    • 한국결정성장학회지
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    • 제28권4호
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    • pp.175-178
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    • 2018
  • 구리 금속은 높은 열전도도로 heat sink 혹은 heat exchanger로 널리 사용되고 있다. 그러나 이에 반하여 낮은 인장강도와 사용온도 한계를 가지고 있다. 따라서 높은 열전도도, 낮은 제작비와 함께 우수한 기계적 특성이 요구된다. 본 연구에서는 이를 위하여 동철합금($Cu_{50}-Fe_{50}$ alloy)를 고주파 가열로를 이용하여 제조하고 그 특성을 조사하였다. 제조된 동철합금은 Cu, ${\alpha}$-Fe, ${\gamma}$-Fe 결정구조를 기진 dendrite 미세구조를 보여주었다. 제조된 동철합금은 XRD, FE-SEM, EDS 및 XRF를 이용하여 결정구조 및 미세구조를 분석하였으며 전력공급 접점용 소재로서의 적합성을 확인하고자 하였다.

방전 플라즈마 소결법으로 제작한 Mo-Cu 합금의 열적, 전기적 특성 (A Study on the Thermal and Electrical Properties of Fabricated Mo-Cu Alloy by Spark Plasma Sintering Method)

  • 이한찬;이붕주
    • 전기학회논문지
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    • 제66권11호
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    • pp.1600-1604
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    • 2017
  • Mo-Cu alloys have been widely used for heat sink materials, vacuum technology, automobile and many other applications due to their excellent physical and electronic properties. Especially, Mo-Cu composites with 5~20 wt% copper are widely used for the heavy duty service contacts due to their excellent properties like low coefficient of thermal expansion, wear resistance, high temperature strength and prominent electrical and thermal conductivity. In most of the applications, high dense Mo-Cu materials with homogeneous microstructure are required for high performance, which has led in turn to attempts to prepare ultra-fine and well-dispersed Mo-Cu powders in different ways, such as spray drying and reduction process, electroless plating technique, mechanical alloying process and gelatification-reduction process. However, most of these methods were accomplished at high temperature (typically degree), resulting in undesirable growth of large Cu phases; furthermore, these methods usually require complicated experimental facilities and procedure. In this study, Mo-Cu alloying were prepared by planetary ball milling (PBM) and spark plasma sintering (SPS) and the effect of Cu with contents of 5~20 wt% on the microstructure and properties of Mo-Cu alloy has been investigated.

탄소강과 스테인리스강의 진공브레이징에 관한 연구 (A study on the vacuum brazing of carbon steels to a stainless steel)

  • 이창동;나석주
    • 대한기계학회논문집
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    • 제12권5호
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    • pp.1083-1091
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    • 1988
  • 본 연구에서는 위의 두번째 연구동향과 맥락을 같이하는 것으로서 스테인리스 강(SUS304)에 대한 진공브레이징 연구 및 탄소강의 진공 브레이징에 대한 연구결과들 을 토대로 하여 SUS304와 탄소강과의 진공브레이징 현상을 연구하였는데 특히 모재의 탄소함유량, 브레이징시간 및 접합부 틈새(joint clearance)등에 따라 접합부에 나타 나는 여러 금속학적 현상의 규명 및 접합강도(joint strength)에 대해 변수들이 미치 는 영향을 연구 하였다.

일방향 탄소나노섬유 강화 Cu 기지 나노복합재료용 중간재 제조에 관한 연구 (The study on the manufacturing intermediary materials for the carbon nanofiber reinforced Cu matrix noncomposite)

  • 백영민;이상관;엄문광
    • 한국복합재료학회:학술대회논문집
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    • 한국복합재료학회 2003년도 추계학술발표대회 논문집
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    • pp.46-49
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    • 2003
  • Cu have been widely used as signal transmission materials for electrical electronic components owing to its high electrical conductivity. However, it's size have been limited to small ones due to its poor mechanical properties, Until now, strengthening of the copper at toy was obtained either by the solid solution and precipitation hardening by adding alloy elements or the work hardening by deformation process. Adding the at toy elements lead to reduction of electrical conductivity. In this aspect, if carbon nanofiber is used as reinforcement which have outstanding mechanical strength and electric conductivity, it is possible to develope Cu matrix nanocomposite having almost no loss of electric conductivity. It is expected to be innovative in electric conduct ing material market. The unidirectional alignment of carbon nanofiber is the most challenging task developing the copper matrix composites of high strength and electric conductivity In this study, the unidirectional alignment of carbon nanofibers which is used reinforced material are controlled by drawing process in order to manufacture the intermediary materials for the carbon nanofiber reinforced Cu matrix nanocomposite and align mechanism as well as optimized drawing process parameters are verified via experiments and numerical analysis. The materials used in this study were pure copper and the nanofibers of 150nm in diameter and of $10~20\mu\textrm{m}$ In length. The materials have been tested and the tensile strength was 75MPa with the elongation of 44% for the copper it is assumed that carbon nanofiber behave like porous elasto-plastic materials. Compaction test was conducted to obtain constitutive properties of carbon nanofiber. Optimal parameter for drawing process was obtained by experiments and numerical analysis considering the various drawing angles, reduction areas, friction coefficient, etc Lower reduction areas provides the less rupture of cu tube is not iced during the drawing process. Optimal die angle was between 5 degree and 12 degree. Relative density of carbon nanofiber embedded in the copper tube is higher as drawing diameter decrease and compressive residual stress is occurred in the copper tube. Carbon nanofibers are moved to the reverse drawing direct ion via shear force caused by deformation of the copper tube and alined to the drawing direction.

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티타늄이 첨가된 알루미나 분산강화 동합금의 산화물 형성 거동 (Oxidation Behavior of Ti Added Alumina Dispersion Strengthening Copper Alloy)

  • 조홍래;한승전;안지혁;이재현;손영국;김광호
    • 한국재료학회지
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    • 제25권4호
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    • pp.202-208
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    • 2015
  • Alumina dispersion strengthening copper(ADSC) alloy has great potential for use in many industrial applications such as contact supports, frictional break parts, electrode materials for lead wires, and spot welding with relatively high strength and good conductivity. In this study, we investigated the oxidation behavior of ADSC alloys. These alloys were fabricated in forms of plate and round type samples by surface oxidation reaction using Cu-0.8Al, Cu-0.4Al-0.4Ti, and Cu-0.6Al-0.4Ti(wt%) alloys. The alloys were oxidized at $980^{\circ}C$ for 1 h, 2 h, and 4 h in ambient atmosphere. The microstructure was observed with an optical microscope(OM) and a scanning electron microscope(SEM) equipped with energy-dispersive X-ray spectroscopy(EDS). Characterization of alumina was carried out using a 200 kV field-emission transmission electron microscope(TEM). As a result, various oxides including Ti were formed in the oxidation layer, in addition to ${\gamma}$-alumina. The thickness of the oxidation layer increased with Ti addition to the Cu-Al alloy and with the oxidation time. The corrected diffusion equation for the plate and round type samples showed different oxidation layer thickness under the same conditions. Diffusion length of the round type specimen had a value higher than that of its plate counterpart because the oxygen concentration per unit area of the round type specimen was higher than that of the plate type specimen at the same diffusion depth.

LED 리드프레임 패키징용 Cu/STS/Cu 클래드 메탈의 기계 및 열전도 특성의 온도 안정성 연구 (Thermal Stability of the Mechanical and Thermal Conductive Properties on Cu-STS-Cu Clad Metal for LED Package Lead Frame)

  • 김용성;김일권
    • Journal of Welding and Joining
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    • 제31권5호
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    • pp.77-81
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    • 2013
  • We have investigated thermal stability of the mechanical and thermal conductive properties of Cu/STS/Cu 3 layered clad metal lead frame material for a LED device package at different temperatures ranging from RT to $200^{\circ}C$. The fabricated Cu/STS/Cu clad metal has a good thermal stability for the mechanical tensile strength and thermal conductivity of the over 50 $Kg/mm^2$ to the $150^{\circ}C$ and 270 $W/m{\cdot}K$ to the $200^{\circ}C$, respectively. This clad metal lead frame material at a high temperature of $150^{\circ}C$ shows a reinforced mechanical tensile strength by 1.5 times to conventional pure copper lead frame materials and also a comparable thermal conductivity to typical copper alloy lead frame materials.